Contents of this document
- Growth in the semiconductor manufacturing equipment segment
- Planned shipment of the order backlog accumulated through the previous fiscal year
- Orders reaching their second-highest level on record
- Foreign Exchange Gains
- Reduction of the order backlog-10 Hundreds of millions of yen
- Revenue brought forward from the fourth quarter
- Extraordinary losses in the second quarter
- Rollout of probers with high-precision temperature control
- Development and rollout of grinders for Hybrid Bonding and processing equipment for large-panel PLP
- Rollout of probers, dicers and grinders incorporating metrology technology
- Development of new consumable products, including dicing blades, and strengthened sales efforts
- Completion of the Nagoya Plant
- Construction of a demonstration center in South Korea
- Launch of a secondary battery evaluation center
- Orders received1,631 Hundreds of millions of yenYear on year against the same period last year+12.0%
- Free cash flow135 Hundreds of millions of yen
- Equity ratio76.2 %
- HPC-related revenue as a percentage of semiconductor revenueAbove 30% → mid-30% range → above 40%
- HPC-related orders as a percentage of semiconductor orders40% → 40% → above 40%
| Item | Details |
|---|---|
| Document type | Presentation materials for financial results |
| Fiscal Period Covered | Full-year FY2025 (fiscal year ending March 2026) results and full-year FY2026 (fiscal year ending March 2027) forecast |
| Net Sales | 1,668 Hundreds of millions of yen (YoY +11.0%) |
| Operating profit | 337 Hundreds of millions of yen (YoY +14.0%) |
| Ordinary income | 348 Hundreds of millions of yen (YoY +16.0%) |
| Net income | 247 Hundreds of millions of yen (YoY -4.0%) |
| Operating profit margin | FY2025: 20%, unchanged year on year (+0 ppt). Fourth quarter of FY2025: 24%, up 1 ppt year on year |
| Three months of the current quarter | Orders received 458 Hundreds of millions of yen (YoY +30.0%) / Net Sales 539 Hundreds of millions of yen (YoY +14.0%) / Operating profit 128 Hundreds of millions of yen (YoY +20.0%) / Ordinary income 131 Hundreds of millions of yen (YoY +29.0%) / Net income 106 Hundreds of millions of yen (YoY +41.0%) / Operating profit margin 24 % |
| Full-year earnings forecast | Fiscal 2026 Orders received Not disclosed / Net Sales 1,815 Hundreds of millions of yen / Operating profit 400 Hundreds of millions of yen / Ordinary income 400 Hundreds of millions of yen / Net income for the current fiscal year 280 Hundreds of millions of yen / Research and development costs 130 Hundreds of millions of yen / Capital Expenditure 110 Hundreds of millions of yen / Depreciation and amortization 62 Hundreds of millions of yen / Dividend per share ¥276 |
| Self-assessment against the plan | Fourth-quarter results exceeded the internal plan. Execution of the medium-term management plan was broadly in line with the plan |
| Segment results | Semiconductor manufacturing equipment Orders received 1,234 Hundreds of millions of yen (YoY +15.0%) / Net Sales 1,279 Hundreds of millions of yen (YoY +13.0%) / Operating profit 284 Hundreds of millions of yen (YoY +17.0%) / Operating profit margin 22 % / Measurement Equipment Orders received 397 Hundreds of millions of yen (YoY +5.0%) / Net Sales 390 Hundreds of millions of yen (YoY +5.0%) / Operating profit 53 Hundreds of millions of yen (YoY -1.0%) / Operating profit margin 14 % |
| Breakdown of Factors Affecting the Change | Factors Growth in the semiconductor manufacturing equipment segment / Amount Not disclosed, Factors Planned shipment of the order backlog accumulated through the previous fiscal year / Amount Not disclosed, Factors Orders reaching their second-highest level on record / Amount Not disclosed, Factors Foreign Exchange Gains / Amount Not disclosed, Factors Reduction of the order backlog / Amount -10 Hundreds of millions of yen, Factors Revenue brought forward from the fourth quarter / Amount Not disclosed, Factors Extraordinary losses in the second quarter / Amount Not disclosed |
| Key KPIs | Indicator name Orders received / Value 1,631 Hundreds of millions of yen / Year on year against the same period last year 12 Hundreds of millions of yen, Indicator name Free cash flow / Value 135 Hundreds of millions of yen / Year on year against the same period last year Not disclosed, Indicator name Equity ratio / Value 76.2 % / Year on year against the same period last year Not disclosed, Indicator name HPC-related revenue as a percentage of semiconductor revenue / Value Above 30% → mid-30% range → above 40% / Year on year against the same period last year Not disclosed, Indicator name HPC-related orders as a percentage of semiconductor orders / Value 40% → 40% → above 40% / Year on year against the same period last year Not disclosed |
| Assumptions Underlying the Business Outlook | Exchange rate 150 Yen/Dollar / Contribution of HPC-related revenue Approximately 40% / HPC orders in the first half of FY2026 20 % (increase from the second half of FY2025) / Metrology orders in the first half of FY2026 10 % (increase from the second half of FY2025) / HPC-related revenue ratio in the first half of FY2026 Above 40% |
| Medium-term management plan targets | Target fiscal year FY2025–FY2027 / Net Sales 1,850 Hundreds of millions of yen / Operating profit 450 Hundreds of millions of yen / Operating profit margin 24 % / ROE 15 % |
| Financial targets | ROE Target value 15 % / Actual value 15 % / Equity ratio Actual value 76.2 % / Target value Not disclosed |
| Annual Dividend | Annual ¥262 per share / Interim ¥111 per share / End of period ¥151 per share / FY2026 forecast Annual ¥276 per share / Interim ¥138 per share / End of period ¥138 per share |
| Capital expenditures | 111 Hundreds of millions of yen |
| Orders received and order backlog | Orders received 1,631 Hundreds of millions of yen / Order backlog Not disclosed |
| New initiatives | Rollout of probers with high-precision temperature control, Development and rollout of grinders for Hybrid Bonding and processing equipment for large-panel PLP, Rollout of probers, dicers and grinders incorporating metrology technology, Development of new consumable products, including dicing blades, and strengthened sales efforts, Completion of the Nagoya Plant, Construction of a demonstration center in South Korea, Launch of a secondary battery evaluation center |
Items this document does not state (11)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.In semiconductor manufacturing equipment, demand for HPC applications was the primary driver. Revenue growth also reflected the planned shipment of the order backlog accumulated through the previous fiscal year and orders reaching their second-highest level on record. Ordinary profit was also supported by foreign exchange gains. Net income was affected by the recognition of extraordinary losses in the second quarter. The FY2026 outlook assumes growth in HPC, including generative AI, global OSAT, high-end demand in China, demand for general-purpose memory, and high-value-added products.