Contents of this document
- HPC-related demand for semiconductor manufacturing equipment
- Partial adjustment of the order backlog-10 Hundreds of millions of yen
- Assumed exchange rate150 Yen/dollar
- HPC-related share of SPE revenue (forecast for the first half of FY2026)Above 40%
- HPC-related share of SPE order intake (forecast for the first half of FY2026)Above 40%
- HPC-related order intake (first half of FY2026 versus second half of FY2025)15 %
- Expansion of high-value-added probers
- Built-in metrology functions for probers, dicers and grinders
- Development and rollout of new dicing blade products
- Strengthening recurring businesses, including services and equipment calibration
- Expansion of production and evaluation capabilities at the Nagoya plant, the new Hachioji plant and the Korea demo center
- Orders received1,631 Hundreds of millions of yenYear-on-year (%)12
- Order intake for semiconductor manufacturing equipment1,234 Hundreds of millions of yenYear-on-year (%)15
- Order intake for metrology equipment397 Hundreds of millions of yenYear-on-year (%)5
- Order backlog793.59 Hundreds of millions of yen
- HPC-related share of SPE revenue (second half of FY2025)mid-30% range
| Item | Details |
|---|---|
| Document type | Presentation materials for financial results |
| Fiscal Period Covered | Fiscal year ended March 2026 (fiscal 2025) |
| Net Sales | 1,668 Hundreds of millions of yen (YoY +11.0%) |
| Operating profit | 337 Hundreds of millions of yen (YoY +14.0%) |
| Ordinary income | 348 Hundreds of millions of yen (YoY +16.0%) |
| Net income | 247 Hundreds of millions of yen (YoY -4.0%) |
| Operating profit margin | 20%, +0 percentage points year on year |
| Selling, general and administrative expenses | 327.5 Hundreds of millions of yen |
| Results for the three months of the current quarter | Subject Fourth quarter of the fiscal year ended March 2026 / Net Sales 539 Hundreds of millions of yen / Operating profit 128 Hundreds of millions of yen / Ordinary income 131 Hundreds of millions of yen / Net income 106 Hundreds of millions of yen |
| Full-year earnings forecast | Orders received Not disclosed / Net Sales 1,815 Hundreds of millions of yen / Operating profit 400 Hundreds of millions of yen / Ordinary income 400 Hundreds of millions of yen / Net income 280 Hundreds of millions of yen / Research and development costs 130 Hundreds of millions of yen / Capital Expenditure 110 Hundreds of millions of yen / Depreciation and amortization 62 Hundreds of millions of yen / Semiconductor manufacturing equipment revenue 1,415 Hundreds of millions of yen / Metrology equipment revenue 400 Hundreds of millions of yen / Annual Dividend ¥276 |
| Segment results | Semiconductor manufacturing equipment Orders received 1,234 Hundreds of millions of yen (YoY +15.0%) / Net Sales 1,279 Hundreds of millions of yen (YoY +13.0%) / Operating profit 284 Hundreds of millions of yen (YoY +17.0%) / Operating profit margin 22%, +1 percentage point year on year / Measurement Equipment Orders received 397 Hundreds of millions of yen (YoY +5.0%) / Net Sales 390 Hundreds of millions of yen (YoY +5.0%) / Operating profit 53 Hundreds of millions of yen (YoY -1.0%) / Operating profit margin 14%, -1 percentage point year on year |
| Breakdown of Factors Affecting the Change | Factors HPC-related demand for semiconductor manufacturing equipment / Amount Not disclosed, Factors Partial adjustment of the order backlog / Amount -10 Hundreds of millions of yen |
| Key KPIs | Orders received 1,631 Hundreds of millions of yen, Order intake for semiconductor manufacturing equipment 1,234 Hundreds of millions of yen, Order intake for metrology equipment 397 Hundreds of millions of yen, Order backlog 793.59 Hundreds of millions of yen, HPC-related share of SPE revenue (second half of FY2025) mid-30% range |
| Assumptions Underlying the Business Outlook | Assumed exchange rate 150 Yen/dollar, HPC-related share of SPE revenue (forecast for the first half of FY2026) Above 40%, HPC-related share of SPE order intake (forecast for the first half of FY2026) Above 40%, HPC-related order intake (first half of FY2026 versus second half of FY2025) 15 % |
| Medium-term management plan targets | Subject FY2025–FY2027 / Net Sales 1,850 Hundreds of millions of yen / Operating profit 450 Hundreds of millions of yen / Operating profit margin 24 % / ROE 15 % / Comparison with actual results FY2025 actuals: revenue of ¥166.8 billion, operating income of ¥33.7 billion, operating margin of 20%, ROE not disclosed |
| Financial targets | ROE Target 15 % / Actual results Not disclosed / Equity ratio Actual results 76.2 % / Target Not disclosed |
| Annual Dividend | ¥262 per share |
| Capital expenditures | 111 Hundreds of millions of yen |
| Orders received and order backlog | Orders received 1,631 Hundreds of millions of yen / Order backlog 793.59 Hundreds of millions of yen |
| New initiatives | Expansion of high-value-added probers, Built-in metrology functions for probers, dicers and grinders, Development and rollout of new dicing blade products, Strengthening recurring businesses, including services and equipment calibration, Expansion of production and evaluation capabilities at the Nagoya plant, the new Hachioji plant and the Korea demo center |
Items this document does not state (11)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.In FY2025, HPC-related demand for semiconductor manufacturing equipment drove performance. For FY2026, the company expects increased demand for HPC, including generative AI, global OSATs, high-end applications in China and general-purpose memory, as well as price revisions for metrology equipment, higher sales in the aerospace and defense and semiconductor-related sectors, a higher mix of high-value-added products and cost improvements.