Announced details
For interposers, package substrates, and advanced packaging applications
0.5 μm-class L/S
LET is a consolidated subsidiary of our company. The order was received from NEDO through Osaka Metropolitan University.
NEDO is the New Energy and Industrial Technology Development Organization, a national research and development agency. Osaka Metropolitan University is listed as the intermediary for the order. Other information, including location, representative, capital, and year established, is Not disclosed.
The impact of this order on results for the current fiscal year is expected to be limited.
The company does not address Contract Value / Offering price.
| Item | Details |
|---|---|
| Names of Products / Services Covered | DI (direct imaging) exposure equipment, LAMBDI |
| Counterparty | NEDO, the New Energy and Industrial Technology Development Organization, with the order received through Osaka Metropolitan University |
| Counterparty overview | NEDO is the New Energy and Industrial Technology Development Organization, a national research and development agency. Osaka Metropolitan University is listed as the intermediary for the order. Other information, including location, representative, capital, and year established, is Not disclosed. |
| Relationship with the Company | LET is a consolidated subsidiary of our company. The order was received from NEDO through Osaka Metropolitan University. |
| Launch date | August 2025 (shipping began for the DI exposure system supporting 1 μm wiring) |
| Applicable area | For interposers, package substrates, and advanced packaging applications |
| Quantitative Effects | 0.5 μm-class L/S |
| Impact on Business Performance | The impact of this order on results for the current fiscal year is expected to be limited. |
Items this document does not state (10)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The system achieves higher resolution than the model supporting 1 μm wiring, which began shipping in August 2025.