Expansion into the Semiconductor Inspection Equipment Systems Business
First written in FY2016. 5 of 9 entries say "Restated". Latest entry: FY2026.
The whole theme swung hardest in 2022: 1 of 7 companies on the "Worse" side.
2 other companies' latest entry also says "Restated".
- FY2026RestatedAnnual report
「Development and manufacture of semiconductor inspection equipment systems」
The Company continues to pursue the development and manufacture of semiconductor inspection equipment systems as a priority issue. - FY2025RestatedAnnual report
「Development and manufacture of semiconductor inspection equipment systems」
The Company continues to pursue the development and manufacture of semiconductor inspection equipment systems as a priority issue. - FY2024-Q3RestatedAnnual report
「For image-processing visual inspection equipment, we will seek orders for high-value-added projects, including products for functional films and semiconductor-related applications.」
The Company continues to seek orders for high-value-added projects, including semiconductor-related products. No completion of the development and manufacture of semiconductor inspection equipment systems or sales results are reported. - FY2024-Q2RestatedAnnual report
「For image-processing visual inspection equipment, we will seek orders for high-value-added projects, including products for functional films and semiconductor-related applications.」
The Company continues to seek orders for high-value-added projects, including semiconductor-related products. No completion of development and manufacture or sales results are reported. - FY2024-Q1RestatedAnnual report
「For image-processing visual inspection equipment, we will seek orders for high-value-added projects, including products for functional films and semiconductor-related applications.」
The Company continues to seek orders for high-value-added projects, including semiconductor-related products. No completion of the development and manufacture of semiconductor inspection equipment systems or sales results are reported. - FY2023ReframedAnnual report
「Promotion of the inspection equipment systems business Development and manufacture of high-performance film inspection equipment systems Development and manufacture of semiconductor inspection equipment systems Development and manufacture of microLED inspection equipment systems」
For the semiconductor field, the priority issue has been reorganised from the specific wording used in the previous fiscal year, semiconductor package inspection equipment systems, to the development and manufacture of semiconductor inspection equipment systems in general. - FY2022ReframedAnnual report
「Development and manufacture of semiconductor package inspection equipment systems」
The scope has been specified and the item relisted as semiconductor package inspection equipment systems, replacing the previous wording, semiconductor inspection equipment systems for front-end and back-end processes. - FY2021DroppedAnnual report
「The Group will focus on addressing the following issues.」
The list of priority issues this time does not include the semiconductor inspection equipment system for front-end and back-end processes previously listed. - FY2016First statedAnnual report
「(4) Advancing the semiconductor inspection systems business Development and manufacturing of inspection systems for semiconductor front-end and back-end processes」
The Company plans to develop inspection equipment systems covering both the front-end and back-end semiconductor processes.