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Musashi Seimitsu Industry (7220) · InitiativeAchieved

Building laser technology and HSC core technology through the acquisition of Wired

First written in FY2025-H1. 1 of 2 entries say "Achieved", first in FY2025. Latest entry: FY2025.

2entries
2years
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ProgressHeldSoftenedWorseFirst statedFY2025-H12024: 120242025: 12025
Same theme, other companies
Building laser technology and HSC core technology through the acquisition of WiredA theme 1 companies write about · 0 as a headwind · 1 as a tailwind

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  1. FY2025AchievedAnnual report

    「26 April 2024 (date control was obtained); the corporate name changed to 武蔵ワイヤード株式会社 effective 1 April 2025」

    The acquisition of 60% of the shares of 株式会社ワイヤード and its inclusion in the scope of consolidation have been completed, and the corporate name changed to 武蔵ワイヤード株式会社 effective 1 April 2025. The foundation for expanding the application of laser technology and building next-generation core technology for HSCs is taking concrete shape.
  2. FY2025-H1First statedAnnual report

    「Through collaboration based on a capital alliance with 株式会社ワイヤード, we will maintain 株式会社ワイヤード's existing management policy and seek to maintain and expand its existing businesses, while promoting the application of laser technology across a broad range of fields within our group and jointly developing next-generation core technology essential for hybrid supercapacitors, for which demand is expected to grow in particular. The two companies will also seek to develop a solutions business leveraging the synergies between their technologies in order to strengthen their competitiveness in addressing new needs in global markets.」

    On 26 April 2024, the Company acquired 60% of the shares of 株式会社ワイヤード and made it a subsidiary. The acquisition cost was ¥360 million, with the aim of expanding the application of laser technology, building next-generation core technology for HSCs and developing a solutions business through technological synergies between the two companies.
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