Agreements reached under this partnership
Capital and Business Alliance- 1
Tanaka Seimitsu Kogyo subscribed to a third-party allotment of shares conducted by U-MAP. The investment amount has not been disclosed. Through this investment, we will establish a medium- to long-term collaborative relationship.
- 2
The companies will use their respective technologies to jointly validate thermal management and cooling technologies for next-generation power semiconductors for EVs and data centers, with a view to practical application. The specific validation themes and evaluation details will not be disclosed.
These are items that the documents state the two companies will work on. The lines above and below represent arrangements between the two companies.
Using existing products in the automotive inverter segment as of 2025 as a reference, the companies have set a 50% reduction in cooling system weight as a development target. They aim to commercialize the technology by 2030.
This indicates whether the companies will do more than work together, such as holding each other’s shares or seconding personnel (capital and business alliance).
| Item | Details |
|---|---|
| Name of alliance partner | U-MAP |
| Alliance partner's business activities | Development, manufacture and sale of thermal management materials, including TIM sheets, grease and ceramic substrates, centered on Thermalnite®, a highly thermally conductive fibrous aluminum nitride single crystal |
| Alliance partner's location | Nagoya, Aichi Prefecture |
| Type of alliance | Capital and Business Alliance |
| Details of the alliance | Tanaka Seimitsu Kogyo subscribed to a third-party allotment of shares conducted by U-MAP. The investment amount has not been disclosed. Through this investment, we will establish a medium- to long-term collaborative relationship., The companies will use their respective technologies to jointly validate thermal management and cooling technologies for next-generation power semiconductors for EVs and data centers, with a view to practical application. The specific validation themes and evaluation details will not be disclosed. |
| Acquisition price | Investment amount undisclosed |
| Numerical targets under the alliance | Using existing products in the automotive inverter segment as of 2025 as a reference, the companies have set a 50% reduction in cooling system weight as a development target. They aim to commercialize the technology by 2030. |
| Contract Date | 28 September 2026 |
Items this document does not state (15)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The increasing adoption of EVs and expanding demand for data centers are driving higher output and greater power density in power semiconductors, increasing the importance of thermal management and cooling technologies. The companies aim to explore new markets by combining their materials and product commercialization technologies.