Issuance of Class Shares and Common Shares by Third-Party Allotment and Funding for Growth Investments
First written in FY2024-Q2. 4 of 13 entries say "Advanced", first in FY2024-Q3. Latest entry: 2026-08-07.
The whole theme swung hardest in 2025: 1 of 9 companies on the "Worse" side.
5 other companies' latest entry also says "Achieved".
- FY2026AdvancedAnnual report
「At a meeting of its board of directors held on 27 March 2026, the Company resolved to raise funds through a private placement of these preferred shares to DBJ, consisting of shares held by DBJ, in order to secure growth funding to achieve high growth and high profitability under the 11th Medium-Term Management Plan (fiscal 2026 to fiscal 2028) by increasing its share in the market for large-capacity aluminum electrolytic capacitors for AI servers and the mass-market general-purpose products market, while maintaining a sound financial base after redeeming the Class A preferred shares for cash and reducing the burden of dividends and cash redemptions.」
Following the 2023 capital raising by JIS and others, the Company resolved to make a private placement to DBJ of ¥6 billion in Class C and ¥3 billion in Class D preferred shares to fund growth under the 11th Medium-Term Management Plan and maintain its financial base after the redemption of Class A preferred shares. - FY2024AchievedAnnual report
「The payment for the above private placement under the investment agreement was completed on 14 November 2023. In addition, at the same meeting of its board of directors, the Company resolved to issue Class A preferred shares totaling ¥10 billion and Class B preferred shares totaling ¥5 billion through a private placement to Japan Industrial Solutions Fund III, L.P., and entered into an investment agreement with the fund on the same date. The payment for the above private placement under the investment agreement was completed on 27 December 2023.」
Payment was completed for both the approximately ¥2.4 billion private placement of common shares to 三瑩電子工業 and the ¥10 billion Class A and ¥5 billion Class B private placements to JIS Fund III, L.P., executing the planned financing. - FY2024-Q3AdvancedAnnual report
「The payment for the above private placement under the investment agreement was completed on 14 November 2023. In addition, at the same meeting of its board of directors, the Company resolved to issue Class A preferred shares totaling ¥10 billion and Class B preferred shares totaling ¥5 billion through a private placement to Japan Industrial Solutions Fund III, L.P., and entered into an investment agreement with the fund on the same date. The payment for the above private placement under the investment agreement was completed on 27 December 2023.」
Payment for the private placement of approximately ¥2.4 billion in common shares to 三瑩電子工業 and the private placement of ¥10 billion in Class A and ¥5 billion in Class B preferred shares to JIS Fund III, L.P. was completed, moving the planned financing into the execution phase. - FY2024-Q2First statedAnnual report
「The issuance of Class A and Class B preferred shares through a private placement to Japan Industrial Solutions Fund III, L.P.」
The Company planned a private placement of ¥10 billion in Class A preferred shares and ¥5 billion in Class B preferred shares, and separately planned to allocate 1,625,100 common shares totaling ¥2,451.48 million to 三瑩電子工業株式会社. The funds raised were to be allocated from April 2023 through March 2026 to capital expenditures for the hybrid capacitor business, smart-factory initiatives, and R&D-related investments. Each issuance was subject to approval at an extraordinary general meeting of shareholders and other conditions.