FY2025First statedAnnual report
「As part of these efforts, on 25 April 2025, our company entered into a non-exclusive patent licence agreement with 株式会社ダイワ工業 for the DPGA circuit board (Daiwa Process Global Advance (high-heat-dissipation circuit board)) patent owned by the company. The DPGA circuit board is characterized by heat dissipation, connection reliability and weight reduction. Through this technology, we will address the heat-dissipation requirements of future printed wiring boards, broaden the scope of design, planning and proposals in new business areas, promote further sales expansion and pursue the achievement of our medium-term management plan.」
On 25 April 2025, the company entered into a non-exclusive licence agreement for a patent held by an external party and disclosed for the first time an initiative to use the DPGA circuit board, characterized by high heat dissipation, high reliability and light weight, in design, planning and proposals and sales expansion in new business areas.