Komori
Zuken (6947) · InitiativeFirst stated

Support for next-generation semiconductor and 3D-IC/chiplet packaging processes

First written in FY2026. . Latest entry: FY2026.

1entries
1years
0from disclosures
Share on X
How it moved
Same theme, other companies
Expansion of the 3D-IC and chiplet assembly process support businessA theme 1 companies write about · 0 as a headwind · 1 as a tailwind

No other company in this theme has enough history to compare yet.

Full recordFilings, disclosures and news, newest first
  1. FY2026First statedAnnual report

    「In the semiconductor field, we are working to support packaging processes for next-generation semiconductors such as 3D-ICs and chiplets by leveraging the advanced data-management functions and high performance of the CR-8000 series, with the aim of expanding our semiconductor business.」

    For the first time, the company presented as an independent theme its efforts to expand the business by supporting packaging processes for next-generation semiconductors such as 3D-ICs and chiplets using the CR-8000 series. The R&D section also describes participation in next-generation semiconductor projects and development of 3Dblox and OASIS output functions.
Moved together

None of this company's other threads moved the same way in the same document twice or more.

When this could move next
No upcoming earnings preview for Zuken yet.
News
No news is linked to this thread yet. When an article touches it, it will appear here by date.
Support for next-generation semiconductor and 3D-IC/chiplet packaging processes | ZUKEN INC. (6947) | Komori