Contraction of the High-Reliability Printed Circuit Board and Semiconductor Inspection Equipment Market
First written in FY2016. 1 of 3 entries say "Materialised", first in FY2017-Q1. Latest entry: FY2020.
No other company in this theme has enough history to compare yet.
- FY2020MitigatedAnnual report
「“Printed Circuit Boards,” which had previously been disclosed, was wound down in the previous consolidated fiscal year.」
Following the winding down of the printed circuit board business, direct exposure to the high-reliability substrate and semiconductor inspection equipment markets declined. - FY2017-Q1MaterialisedAnnual report
「Although substrates for semiconductor high-temperature screening tests for automotive applications performed well, revenue from printed circuit boards decreased by ¥77 million year on year to ¥714 million, down 9.8%, due to declines in high-reliability substrates, in which we specialize, and substrates for semiconductor measurement equipment.」
The decline in high-reliability substrates and substrates for semiconductor measurement equipment was reflected in the 9.8% year-on-year decline in quarterly revenue. By contrast, automotive substrates were described as performing well. - FY2016First statedAnnual report
「Performance remained weak due to the ongoing contraction in the high-reliability substrate market, in which we specialize, and the downturn in the semiconductor inspection equipment market.」
Revenue from printed circuit boards was ¥3,074 million, down 5.7% year on year. The segment posted a loss of ¥191 million.