Capturing demand for bonding equipment for small electronic components and expanding exports

「As a result of efforts to expand sales in target markets, orders for joining and infrared equipment totaled ¥5,286 million, up 20.0% year on year, net sales totaled ¥5,335 million, up 30.4%, and segment profit was ¥419 million, an improvement of ¥669 million year on year.」

「Joining equipment and sensing solutions recorded orders of ¥2,200 million, up 19.4% from the same interim period of the previous year, sales of ¥2,545 million, up 25.0%, and segment profit of ¥167 million, an improvement of ¥287 million from the same interim period of the previous year, as a result of sales expansion activities targeting the target market.」

「Electronic Equipment (Bonding Equipment and Sensing Solutions) Against a backdrop of recovering equipment demand, we will expand sales of crystal device sealing equipment, actively launch new products that provide high customer value centered on our 4 bonding methods—resistance welding, pulse heat, ultrasonic and laser—and strengthen our overseas operations to expand orders and sales.」

「Bonding Equipment and Sensing Solutions recorded orders of ¥1,842 million, up 33.5% year on year, and net sales of ¥2,035 million, up 23.1%, as equipment demand recovered and sales expansion efforts in target markets progressed.」

「In joining equipment, the Company began selling high-current, highly reliable inverter-type resistance welders and high-output ultrasonic metal-joining products that contribute to improving power-transmission efficiency and enabling rapid charging for the growing battery, motor and harness markets driven by vehicle electrification and higher functionality.」

「Electronic equipment revenue was ¥1,653 million, down 43.2% year on year, and segment loss was ¥272 million, a ¥425 million year-on-year decrease, due to weak capital investment related to information equipment, including smartphones.」

「Revenue for bonding equipment and sensing solutions was ¥653 million, down 43.7% year on year, and segment loss was ¥214 million, a ¥212 million year-on-year decrease, due to lower demand related to smartphones and consumer products and the slowing recovery in capital-investment plans.」

「Bonding Equipment developed and launched a highly reliable inverter-type resistance welding machine capable of welding with high-current conduction and high-precision control, optimised for fusing, a solderless direct-bonding method for joining the coils and terminals of large vehicle motors. The product is designed to improve quality and productivity amid rapidly expanding demand for large vehicle motors accompanying the growth of the EV market.」

「Revenue for bonding equipment and sensing solutions was ¥3,990 million, down 34.4% year on year, and segment profit was ¥168 million, a ¥642 million year-on-year decrease, due to lower demand for consumer products and revisions to capital-investment plans.」

「In Electronic Equipment, the economy had not yet achieved a full recovery, and production equipment investment declined as demand for smartphones and consumer electronics fell. Sensing Solutions also recorded lower sales and segment profit because demand declined as customers reviewed capital expenditure plans in the steel, power and other industries. Full-year sales in this division were ¥2,912 million, down 30.9% year on year, and segment profit was ¥152 million, down ¥468 million year on year.」

「In Electronic Equipment, sales of Bonding Equipment declined because sales recognition was postponed as a result of disruptions in international logistics. Sales of Sensing Solutions also declined because orders for existing production equipment applications decreased as customers reviewed capital expenditure plans for decarbonisation measures in the steel and other industries.」

「Changes in components and materials resulting from higher communications capacity and speeds and the electrification and enhanced functionality of automobiles present opportunities for our company. We will develop markets related to batteries, motors and other products, centered on our 4 bonding methods.」

「Although demand for Infrared Equipment for screening people with elevated temperatures declined, demand for production equipment applications showed an upward trend, while 5G-related demand for Bonding Equipment remained solid. As a result, overall Electronic Equipment sales increased. Full-year sales in this division increased by ¥791 million year on year to ¥6,081 million, up 15.0%, and segment profit increased by ¥118 million year on year to ¥810 million.」

「Although demand for Infrared Equipment for production equipment applications showed an upward trend, demand for screening people with elevated temperatures did not recover because of delays in the disbursement of government subsidies and other factors. Meanwhile, 5G-related demand for Bonding Equipment remained solid, resulting in higher overall Electronic Equipment sales. Full-year sales in this division increased by ¥668 million year on year to ¥4,216 million, up 18.9%, and segment profit increased by ¥190 million year on year to ¥621 million.」

「Demand for 5G-related Bonding Equipment remained solid. Although demand for Infrared Equipment for production equipment applications showed signs of recovery, demand for screening people with elevated temperatures, which had surged in the previous fiscal year, remained weak because of delays in the disbursement of government subsidies.」

「Although Electronic Equipment was affected by sluggish private-sector capital expenditure, demand for Bonding Equipment related to 5G and demand for Infrared Equipment related to COVID-19 countermeasures remained solid. The company worked to expand production capacity for both products to meet this demand.」

「Although Electronic Equipment was affected by sluggish private-sector capital expenditure, overseas demand for 5G-related Bonding Equipment and demand for Infrared Equipment for infectious-disease control remained solid. Sales increased, and segment profit improved substantially as the company worked to reduce various expenses. Full-year sales in this division were ¥5,289 million, up 71.0% year on year. Segment profit was ¥692 million, an improvement of ¥1,068 million year on year.」

「Although Electronic Equipment was affected by postponed capital expenditure because of the COVID-19 pandemic, overseas 5G-related products for Bonding Equipment performed well, while demand for Infrared Equipment for screening people with elevated temperatures remained solid. As a result, sales increased and segment profit improved substantially, aided by reductions in various expenses. Full-year sales in this division were ¥3,547 million, up 71.4% year on year. Segment profit was ¥430 million, an improvement of ¥683 million year on year.」

「Although customers postponed capital expenditure for research and development and other purposes, Bonding Equipment demand related to 5G remained solid and demand for Infrared Equipment for screening people with elevated temperatures increased, resulting in higher sales. Full-year sales in this division were ¥1,490 million, up 49.6% year on year. Segment profit was ¥127 million, an improvement of ¥280 million year on year.」

「Meanwhile, although the order backlog for bonding equipment accumulated in the second half as overseas orders increased with the expansion of markets related to 5G, sales declined because of weakness in demand for information devices such as smartphones and in the automotive market during the first half.」

「In the third quarter, Bonding Equipment's overseas orders increased and the order backlog accumulated, but sales declined because of weakness in demand from information equipment customers, including smartphones, during the first 2 quarters. The segment recorded a loss of ¥375 million, a deterioration of ¥239 million year on year.」

「Electronic equipment sales were broadly flat for infrared equipment, but sales of bonding equipment for information devices declined because the smartphone market remained weak. Segment profit and loss deteriorated because of the decline in sales despite efforts to reduce overhead expenses. Sales in this segment for the current period were ¥2,069 million, down 28.8% year on year. The segment loss was ¥253 million, a deterioration of ¥169 million year on year.」

「Electronic Equipment recorded higher sales of Infrared Equipment because of increased sales of new products launched in the previous fiscal year and systems projects, but Bonding Equipment recorded a sharp decline in sales to information equipment customers as the smartphone market remained weak, resulting in an overall decline. Sales in this division were ¥996 million, down 29.2% year on year. The segment recorded a loss of ¥152 million, a deterioration of ¥82 million year on year.」

「Bonding Equipment recorded higher domestic sales, driven mainly by the automotive parts market, but overseas sales to information equipment customers declined sharply because of sluggish capital expenditure accompanying the slowdown in the smartphone market and postponed business negotiations resulting from US-China trade friction. Despite efforts to reduce various expenses, segment profit deteriorated because of lower sales. Full-year sales in this division were ¥4,097 million, down 24.5% year on year. The segment recorded a loss of ¥136 million, a deterioration of ¥598 million year on year.」

「Bonding Equipment recorded higher domestic sales, driven mainly by the solid automotive parts market, but overseas capital expenditure remained sluggish as the smartphone market slowed, resulting in a sharp decline in sales to information equipment customers. Despite efforts to reduce various expenses, segment profit deteriorated because of lower sales.」

「Meanwhile, sales of bonding equipment increased in Japan due to expanded sales in the automotive market, a focus area, but overseas capital investment remained weak because of the slowdown in the smartphone market, resulting in a substantial decline in sales for information devices.」

「Bonding Equipment focused on deepening relationships with customers and captured demand for production equipment supporting the miniaturisation of electronic components used in smartphones and other information devices, mainly in Asia. Overseas sales remained strong, resulting in higher net sales.」

「Although Infrared Equipment recorded lower sales due mainly to a decline in overseas sales, Bonding Equipment focused on deepening relationships with customers and captured demand, mainly in Asia, for production equipment supporting the miniaturisation of electronic components used in smartphones and other information devices. Overseas products performed well, resulting in net sales of ¥5,428 million, up ¥1,037 million, or 23.6%, year on year. Segment profit increased by ¥322 million year on year to ¥461 million as higher sales lifted profit.」

「Bonding Equipment focused on deepening relationships with customers and captured demand, mainly in Asia, for production equipment supporting the miniaturisation of electronic components used in smartphones and other information devices. Overseas products performed well, resulting in net sales of ¥3,493 million, up ¥554 million, or 18.9%, year on year. Segment profit increased by ¥117 million year on year to ¥252 million as higher sales lifted profit.」

「Although Infrared Equipment recorded lower sales because of a decline in overseas sales, Bonding Equipment captured demand, mainly in Asia, for production equipment supporting the miniaturisation of electronic components used in smartphones and other information devices. Overseas products performed well, resulting in net sales of ¥1,718 million, up ¥193 million, or 12.7%, year on year. Profit increased as a result of higher sales and efforts to reduce various expenses, resulting in segment profit of ¥188 million, up ¥91 million year on year.」

「Bonding Equipment captured demand for production equipment supporting the miniaturisation of electronic components used in smartphones and other information devices, while exports also remained strong, driven by increased demand for smartphone-related equipment in Asia.」

「Electronic Equipment recorded higher sales as Bonding Equipment captured demand for production equipment supporting the miniaturisation of electronic components used in smartphones and other information devices, while exports also remained strong.」