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Nippon Avionics (6946) · InitiativeFirst stated

Expansion of the application scope of ultrasonic reflow bonding technology

First written in FY2026. . Latest entry: FY2026.

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Expanding applications for ultrasonic reflow bonding technologyA theme 1 companies write about · 0 as a headwind · 1 as a tailwind

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  1. FY2026First statedAnnual report

    「From FY2025, to further expand applications, we are also pursuing research and development into applying the technology to bonding materials other than solder, such as brazing and sintering materials. Through this work, we aim to expand the application of ultrasonic reflow technology beyond power semiconductors to other fields, including optical devices.」

    For the ultrasonic reflow bonding technology developed for power semiconductors, the Company described application to brazing and sintering materials and expansion into optical devices and other fields as new research and development themes.
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Nippon Avionics's next results are scheduled for 2026-10-30. Read the earnings preview
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Expansion of the application scope of ultrasonic reflow bonding technology | Nippon Avionics Co.,Ltd. (6946) | Komori