Helios Techno Holding (6927) · InitiativeAdvanced
Laser ablation using semiconductor lasers and resin surface modification
First written in FY2020. 1 of 2 entries say "Advanced", first in FY2021. Latest entry: FY2021.
2entries
2years
0from disclosures
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Same theme, other companies
Development of Resin Surface Modification Technology Using Semiconductor LasersA theme 1 companies write about · 0 as a headwind · 1 as a tailwind
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Full recordFilings, disclosures and news, newest first
- FY2021AdvancedAnnual report
「レーザーアブレーザーにつきましては、接着強度の改善など樹脂の表面改質を目的に開発し、表面改質試験を経てサンプル提供を行っております。」
レーザーアブレーザーは開発・表面改質試験の段階から、サンプル提供まで進展した。 - FY2020First statedAnnual report
「In addition to LEDs, we are developing laser ablation equipment using semiconductor lasers and conducting R&D on surface modification of resins and other applications aimed at improving bonding strength.」
For the first time, identifies development of laser ablation equipment using semiconductor lasers and R&D aimed at improving bonding strength through resin surface modification.