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Denso (6902) · InitiativeFirst stated

Development of Next-Generation RC-IGBTs and Shipment of 300 mm Wafers

First written in FY2024. . Latest entry: FY2024.

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Development of SiC Power Semiconductors and Semiconductor Products for Automotive ApplicationsA theme 3 companies write about · 0 as a headwind · 4 as a tailwind

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  1. FY2024First statedAnnual report

    「In the mobility infrastructure field, we began shipping insulated-gate bipolar transistors (IGBTs) on 300mm wafers in May 2023. We developed next-generation IGBTs (RC-IGBTs) that reduce losses by up to 20% compared with conventional products while also being smaller, and, together with United Semiconductor Japan Co., Ltd., achieved higher production efficiency than with 200mm wafers on a newly established production line.」

    For power semiconductors for electrified vehicles, we made our first systematic disclosure of loss reductions of up to 20% versus conventional products, size reductions, the start of 300mm wafer shipments and improved production efficiency on a newly established production line.
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Development of Next-Generation RC-IGBTs and Shipment of 300 mm Wafers | DENSO CORPORATION (6902) | Komori