R&D into MEMS Probe Performance, Substrates, Assembly and Processing Technologies, and Next-Generation Products
First written in FY2016. 29 of 32 entries say "Restated". Latest entry: FY2026.
1 other company's latest entry also says "Restated".
- FY2026RestatedAnnual report
「The main activities include improving the performance of probes using MEMS technology and developing substrates for finer and faster semiconductor circuits, developing assembly and processing technologies for probe cards, promoting the development of probe cards for next-generation semiconductors, and improving the performance of existing products. The Group will continue working to expand its market presence and strengthen its product portfolio. Total R&D expenses for the fiscal year were ¥1,681 million.」
R&D continued on MEMS probes, substrates, assembly and processing technologies, and next-generation probe cards, with annual R&D expenses totaling ¥1,681 million. No new development completions or product launches were specifically disclosed. - FY2026-H1RestatedAnnual report
「Total R&D expenses for the six-month interim period were ¥824 million.」
R&D investment continued, with R&D expenses for the six-month interim period totaling ¥824 million. No new development completions or product launches were specifically disclosed for MEMS probes, substrates, assembly and processing technologies, or next-generation products. - FY2025-H1RestatedAnnual report
「Total R&D expenses for the six-month interim period were ¥741 million.」
R&D activities continued in relation to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or market launch of next-generation products was disclosed. - FY2024-Q3RestatedAnnual report
「Total R&D expenses for the nine-month period ended 31 December were ¥1,321 million.」
R&D activities continued, with R&D expenses totaling ¥1,321 million. No completion of new technology development or market launch of next-generation products was disclosed. - FY2024-Q2RestatedAnnual report
「Total R&D expenses for the six-month period ended 30 September were ¥939 million.」
R&D activities continued, with R&D expenses totaling ¥939 million. No completion of new development projects or product launches was disclosed for MEMS probes, substrates, assembly and processing technologies, or next-generation products. - FY2024-Q1RestatedAnnual report
「Total R&D expenses for the three-month cumulative consolidated period were ¥457 million.」
R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products continued. R&D expenses increased from ¥355 million in the same quarter of the previous year to ¥457 million, but no completion of new technology development or product launch was disclosed. - FY2023-Q3RestatedAnnual report
「Total R&D expenses for the cumulative period through the third quarter were ¥1,103 million.」
The company continued R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was disclosed. - FY2023-Q2RestatedAnnual report
「Total R&D expenses for the first half of the current consolidated cumulative period were ¥747 million.」
The company continued investing in R&D, with R&D expenses totaling ¥747 million. No new development completion or product launch was disclosed for MEMS probes, substrates, assembly and processing technologies, or next-generation products. - FY2023-Q1RestatedAnnual report
「Total R&D expenses for the cumulative period through the first quarter were ¥355 million.」
The company continued R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. Cumulative R&D expenses for the quarter were ¥355 million, below ¥386 million in the same quarter of the previous year. - FY2022RestatedAnnual report
「The main areas of activity are improving the performance of MEMS-based probes and developing substrates to support semiconductor circuit miniaturization and higher speeds, developing probe card assembly and processing technologies, promoting development of probe cards for next-generation semiconductors, and improving the performance of existing products. The company will continue working to expand sales in the market and strengthen its product portfolio. Total R&D expenses were ¥1,414 million for the consolidated fiscal year.」
The company continued R&D on MEMS probes, substrates, assembly and processing technologies, and next-generation probe cards. - FY2022-Q3RestatedAnnual report
「Total R&D expenses for the nine-month cumulative consolidated period were ¥1,061 million.」
The company reported R&D expenses of ¥1,061 million, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2022-Q2RestatedAnnual report
「Total R&D expenses for the six-month cumulative consolidated period were ¥714 million.」
The company reported R&D expenses of ¥714 million, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2022-Q1RestatedAnnual report
「Total R&D expenses for the three-month cumulative consolidated period were ¥386 million.」
The company reported R&D expenses of ¥386 million, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2021RestatedAnnual report
「The main areas of activity are improving the performance of MEMS-based probes and developing substrates to support semiconductor circuit miniaturization and higher speeds, developing probe card assembly and processing technologies, promoting development of probe cards for next-generation semiconductors, and improving the performance of existing products. The company will continue working to expand sales in the market and strengthen its product portfolio. Total R&D expenses were ¥1,447 million for the consolidated fiscal year.」
The company continued R&D on MEMS probes, substrates, assembly and processing technologies, and next-generation probe cards, and reported annual R&D expenses of ¥1,447 million. - FY2021-Q3RestatedAnnual report
「Total R&D expenses for the nine-month cumulative consolidated period were ¥1,106 million.」
The company reported R&D expenses of ¥1,106 million, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2021-Q2RestatedAnnual report
「Total R&D expenses for the cumulative period through the second quarter were ¥766 million.」
The company continued its R&D activities, and R&D expenses for the cumulative period through the second quarter totaled ¥766 million. No new development completion or product launch was specifically disclosed for MEMS probes, substrates, assembly and processing technologies, or next-generation products. - FY2021-Q1RestatedAnnual report
「Total R&D expenses for the three-month cumulative consolidated period were ¥402 million.」
The company reported R&D expenses of ¥402 million, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2020-Q3RestatedAnnual report
「Total R&D expenses for the cumulative period through the third quarter were ¥844 million.」
The company continued its R&D activities, and R&D expenses for the cumulative period through the third quarter totaled ¥844 million. No completion of new technology development or launch of a next-generation product was specifically disclosed. - FY2020-Q2RestatedAnnual report
「Total R&D expenses for the cumulative period through the second quarter were ¥567 million.」
The company continued its R&D activities and reported R&D expenses of ¥567 million for the cumulative period through the second quarter. No completion of new technology development or launch of a next-generation product was specifically disclosed. - FY2020-Q1RestatedAnnual report
「Total R&D expenses for the cumulative period through the first quarter were ¥257 million.」
The company continued R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. R&D expenses decreased from ¥268 million in the same quarter of the previous year, but no new development completion or product launch was disclosed. - FY2019RestatedAnnual report
「The main areas of activity are improving the performance of MEMS-based probes and developing substrates to support semiconductor circuit miniaturization and higher speeds, developing probe card assembly technologies and improving processing technologies, promoting development of next-generation probe cards, and improving the performance of existing products. Total R&D expenses were ¥1,104 million for the consolidated fiscal year.」
The company continued R&D on MEMS probes, substrates, assembly and processing technologies, and next-generation probe cards. Annual R&D expenses totaled ¥1,104 million. - FY2019-Q3RestatedAnnual report
「Total R&D expenses for the nine-month cumulative consolidated period were ¥865 million.」
The company reported R&D expenses of ¥865 million, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2019-Q2RestatedAnnual report
「Total R&D expenses for the six-month cumulative consolidated period were ¥550 million.」
The company reported R&D expenses of ¥550 million for the cumulative period through the second quarter, indicating the continuation of R&D activities relating to MEMS probes, substrates, assembly and processing technologies, and next-generation products. No completion of new technology development or product launch was specifically disclosed. - FY2019-Q1RestatedAnnual report
「Total R&D expenses for the three-month cumulative consolidated period were ¥268 million.」
The company continued its R&D activities and reported R&D expenses of ¥268 million for the cumulative period through the first quarter. No completion of new technology development or launch of a next-generation product was specifically disclosed. - FY2018-Q3RestatedAnnual report
「Against this business backdrop, the Group sought to shorten lead times for its core products and further improve their performance in anticipation of future market trends. As a result, both sales and profit exceeded the same period of the previous year.」
The company states that it continued efforts to shorten lead times and improve the performance of its core products. No launch of a new next-generation product or completion of technology development was specifically disclosed. - FY2018-Q2RestatedAnnual report
「Total R&D expenses for the six-month cumulative consolidated period were ¥642 million.」
The company states that it continued its R&D activities, with cumulative R&D expenses of ¥642 million. No specific results from new technology development were disclosed. - FY2018-Q1RestatedAnnual report
「Total R&D expenses for the cumulative period through the first quarter were ¥325 million.」
The company states that it continued its R&D activities, with cumulative R&D expenses of ¥325 million. No specific results from new technology development were disclosed. - FY2017-Q3RestatedAnnual report
「Total R&D expenses for the nine-month cumulative consolidated period were ¥813 million.」
The company states that it continued its R&D activities, with cumulative R&D expenses of ¥813 million. No specific results from new technology development were disclosed. - FY2017-Q1RestatedAnnual report
「Total R&D expenses for the cumulative period through the first quarter were ¥279 million.」
R&D expenses for the quarter were ¥279 million, quantifying the continuation of R&D activities. - FY2016First statedAnnual report
「The main areas of activity are improving the performance of MEMS-based probes and developing substrates to support semiconductor circuit miniaturization and higher speeds, developing probe card assembly technologies and improving processing technologies, promoting development of next-generation probe cards, and improving the performance of existing products. The company is working to strengthen these activities further.」