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Share Issuance and Disposal6855JAPAN ELECTRONIC MATERIALS CORPORATIONElectrical Equipment and Precision Instruments

Notice Regarding the Determination of the Issue Price and Offering Price

The terms, including the issue price and offering price, have been finalized for the public offering, offering by over-allotment and third-party allotment capital increase approved on 25 February 2026. The issue price for the public offering is ¥6,478 per share, and the subscription price for the third-party allotment is ¥6,118.50 per share.

Worth reading
71In focus
Scored from 4 of 5 sections
Direction
Neutral
Direction inferred from the company’s description.
Scale
11266537600
Yen (total public offering issue price)
Wording
Definitive
How definitive the wording is.

Details of issuance or disposal

Issuance of new shares through a public offering (domestic offering), Issuance of new shares through a third-party allotment, Offering of shares (over-allotment offering)

発行・処分する株式数

Issuance of new shares through a public offering 1,739,200株 / Issuance of new shares through a third-party allotment 260,800株(上限) / Secondary offering of shares 260,800株

Public offering 1株につき6,118.50円(払込金額) / Third-party allotment ¥6,118.50 per share
Total issue value

Public offering 11,266,537,600円(発行価格の総額) / Third-party allotment 1,595,704,800円(払込金額の総額・上限)

Amount of funds to be raised
手取概算額合計上限12,180,000,000円(一般募集及び第三者割当増資)
Specific use of funds
Part of the construction costs for a new factory to expand production capacity in response to growing demand for M-type probe cards for memory applications (probe cards using MEMS technology), which is expected to increase as the AI-related semiconductor market expandsAmount 12,500,000,000円の一部 / Scheduled timing of expenditures By the end of September 2028
Offering structure
Overallotment
売出株式数260,800株、第三者割当による新株式発行の上限260,800株
Payment date
Public offering 16 March 2026 / Third-party allotment 30 March 2026
Basis for determining the amount to be paid
2026年3月10日の終値7,190円を算定基準とし、9.90%のディスカウント。公募発行価格・売出価格は6,478円。
Details of issuance or disposal
ItemDetails
Type of issuance or disposalIssuance of new shares through a public offering (domestic offering), Issuance of new shares through a third-party allotment, Offering of shares (over-allotment offering)
Number of shares to be issued or disposed ofIssuance of new shares through a public offering 1,739,200株 / Issuance of new shares through a third-party allotment 260,800株(上限) / Secondary offering of shares 260,800株
Issue price and disposal pricePublic offering 1株につき6,118.50円(払込金額) / Third-party allotment ¥6,118.50 per share
Total issue valuePublic offering 11,266,537,600円(発行価格の総額) / Third-party allotment 1,595,704,800円(払込金額の総額・上限)
Amount of funds to be raised手取概算額合計上限12,180,000,000円(一般募集及び第三者割当増資)
Specific use of fundsDetails Part of the construction costs for a new factory to expand production capacity in response to growing demand for M-type probe cards for memory applications (probe cards using MEMS technology), which is expected to increase as the AI-related semiconductor market expands / Amount 12,500,000,000円の一部 / Scheduled timing of expenditures By the end of September 2028
Payment datePublic offering 16 March 2026 / Third-party allotment 30 March 2026
Basis for determining the amount to be paid2026年3月10日の終値7,190円を算定基準とし、9.90%のディスカウント。公募発行価格・売出価格は6,478円。
Overallotment売出株式数260,800株、第三者割当による新株式発行の上限260,800株
Items this document does not state (19)
Estimated issuance expensesIntended allotteeIntended allottee's holding policyDilution RateTotal number of issued sharesExercise priceExercise periodNumber of Stock Acquisition RightsTransfer restriction periodConditions for lifting transfer restrictionsReason for acquisition without considerationCategories and Number of Persons CoveredTotal Stock-Based CompensationUnderwriter / lead underwriterStock Split RatioProcedures under the Corporate Code of ConductMost recent equity financingMajor shareholders after the offeringImpact on Business Performance

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

AI関連半導体市場の拡大に伴い増加するメモリー向けMタイププローブカードへの需要に対応するため、新工場の建設資金の一部に充当する予定。

How to read this page

This is not the documentKomori reads the disclosure the company filed and writes this summary. Figures are as stated by the company and are not audited.
Weight is not a verdictIt measures how much this changes what the company had already told the market. It is not a view on the shares.
Corrections happenIf the company reissues this disclosure, the page is rebuilt from the corrected version and the revision number moves up.
Notice Regarding the Determination of the Issue Price and Offering Price | JAPAN ELECTRONIC MATERIALS CORPORATION (6855) timely disclosure | Komori