Postponement of the plan to install a laser processing machine at the head office plant
First written in FY2018-Q3. 1 of 4 entries say "Reframed", first in FY2018. Latest entry: FY2019-Q3.
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- FY2019-Q3AchievedAnnual report
「Head office plant (Wakayama, Wakayama Prefecture) / Electronic Substrates business / Laser processing machine / 29,339 / Installment purchase / July 2019 / August 2019 / -」
The previously postponed installation of the laser processing machine was completed, with work starting in July 2019 and finishing in August. The total investment was ¥29.339 million. - FY2019-Q2SoftenedAnnual report
「Head office plant / Electronic Substrates business / Laser processing machine / 30,000 / - / Installment purchase / July 2019 / August 2019 / Due to a review of the capital investment plan, the scheduled start month was postponed from April 2019 to July 2019, and the scheduled completion month from May 2019 to August 2019.」
The laser processing machine investment plan was further postponed, with the scheduled start and completion dates moved from April and May 2019 to July and August 2019. - FY2018ReframedAnnual report
「Head office factory Electronic Circuit Board business Laser processing machine 30,000 – Installment purchase April 2019 May 2019」
The plan was changed from a planned investment of ¥45 million with the timing undecided to a planned investment of ¥30 million, with work scheduled to start in April 2019 and finish in May 2019. - FY2018-Q3First statedAnnual report
「Head office plant / Electronic Substrates business / Laser processing machine / 45,000 / - / Installment purchase / Undecided / Undecided」
The Company disclosed a plan to install a laser processing machine for the Electronic Substrates business at the head office plant, with a planned investment of ¥45 million and the start and completion dates undecided. Following a review of the capital investment plan, the project was postponed from the original schedule of starting in July 2018 and completing in August 2018.