Borrowing to Finance フェニテック Capital Investment
First written in FY2019-Q1. 2 of 4 entries say "Restated". Latest entry: FY2020-Q2.
The whole theme swung hardest in 2026: 2 of 16 companies on the "Worse" side.
4 other companies' latest entry also says "Restated".
- FY2020-Q2RestatedAnnual report
「¥552 million in repayments of long-term borrowings」
In connection with borrowings supporting フェニテック's capital investment, ¥552 million in repayments of long-term borrowings was recorded during the six months ended the second quarter. No new borrowing was disclosed. - FY2019-Q3AdvancedAnnual report
「This was mainly due to the borrowing of funds by フェニテックセミコンダクター株式会社, which increased long-term borrowings by ¥665 million.」
The company disclosed that long-term borrowings had increased by ¥665 million as of the end of the third quarter in connection with borrowings supporting フェニテック's capital investment. - FY2019-Q2RestatedAnnual report
「Cash increased by ¥213 million, reflecting inflows including ¥1.5 billion in proceeds from long-term borrowings, partly offset by outflows including ¥623 million in repayments of long-term borrowings.」
The company disclosed the financing and repayment results for the ¥1.5 billion long-term borrowing supporting フェニテック's capital investment for the six months ended the second quarter. - FY2019-Q1First statedAnnual report
「① Use of proceeds: Capital investment ② Lender: 株式会社中国銀行 ③ Borrowing amount: ¥1.5 billion ④ Interest terms: Base rate plus spread ⑤ Repayment terms: Principal and interest repaid monthly ⑥ Borrowing date: 8 May 2018 ⑦ Final repayment date: 30 April 2028 ⑧ Assets pledged as collateral or guarantee: None」
フェニテック borrowed ¥1.5 billion to fund capital investment through an unsecured loan with a final repayment date of 30 April 2028. The borrowing is described as new financing to support the integration of フェニテック's factories, construction of a new building and expansion of floor space, and installation of new equipment.