Additional Investment in Equipment to Address Increased Semiconductor Demand and Increases in Product Selling Prices
First written in FY2022-Q2. 7 of 13 entries say "Advanced", first in FY2023-Q1. Latest entry: 2026-05-14.
- 2026-05-14RestatedEarnings
「Cash outflows amounted to ¥2,359 million, mainly due to ¥1,432 million in payments for the acquisition of property, plant and equipment and ¥765 million in payments for the acquisition of intangible assets.」
The company continues to invest in tangible and intangible fixed assets. - FY2026-H1RestatedAnnual report
「The subsidiary incurred expenditures of ¥684 million, including for the replacement of machinery and equipment, down ¥2.195 billion from the same period of the previous year.」
The company has continued investing in manufacturing equipment, including replacing machinery and equipment at a subsidiary. Net cash used in investing activities was ¥684 million. - FY2025AdvancedAnnual report
「Total capital investment in the semiconductor devices business during the current consolidated fiscal year amounted to ¥2.964690 billion, including intangible assets as well as property, plant and equipment. The main investments were the installation of new equipment and investment in related equipment at the Kagoshima Plant of Fenitec Semiconductor Corporation, a consolidated subsidiary.」
The company made ¥2.964 billion in capital investment, including the installation of new equipment and investment in related equipment at the Kagoshima Plant. - FY2025-H1AdvancedAnnual report
「This was due in part to the installation of new equipment at a subsidiary to establish a higher-volume production structure, which increased property, plant and equipment by ¥670 million.」
To establish a higher-volume production structure, the subsidiary installed new equipment, increasing property, plant and equipment by ¥670 million. - FY2024AdvancedAnnual report
「Total capital investment in the semiconductor devices business during the current consolidated fiscal year amounted to ¥5.284322 billion, including the installation of new equipment and investment in related equipment at the Kagoshima Plant of Fenitec Semiconductor Corporation, a consolidated subsidiary.」
The company proceeded with capital investment at the Kagoshima Plant and elsewhere, bringing full-year capital investment to ¥5.284 billion. - FY2024-Q3AdvancedAnnual report
「This was due in part to the installation of new equipment at a subsidiary to establish a higher-volume production structure, which increased property, plant and equipment by ¥716 million.」
To establish a higher-volume production structure, the subsidiary installed new equipment, increasing property, plant and equipment by ¥716 million. - FY2024-Q2AdvancedAnnual report
「This was due in part to the installation of new equipment at a subsidiary to establish a higher-volume production structure, which increased property, plant and equipment by ¥1.094 billion.」
To establish a higher-volume production structure, the subsidiary installed new equipment, increasing property, plant and equipment by ¥1.094 billion. - FY2024-Q1RestatedAnnual report
「In preparation for future semiconductor demand, we are making capital investments to secure production capacity in response to product demand, while raising product selling prices in response to soaring raw material prices.」
The company has continued capital investment to prepare for future semiconductor demand and sales price increases to address soaring raw material prices. - FY2023-Q3RestatedAnnual report
「With demand for semiconductors expected to remain strong globally over the medium to long term, the company has invested in equipment at overseas manufacturing partners and entered into long-term production outsourcing agreements to secure production capacity.」
The company has continued initiatives to invest in equipment at overseas contract manufacturers and pursue long-term contract manufacturing agreements to secure production capacity in anticipation of continued global semiconductor demand. - FY2023-Q2AdvancedAnnual report
「With demand for semiconductors expected to remain strong globally over the medium to long term, the company has invested in equipment at overseas manufacturing partners and entered into long-term production outsourcing agreements to secure production capacity.」
Anticipating continued global semiconductor demand, the company invested in equipment at overseas contract manufacturers and entered into long-term contract manufacturing agreements to secure production capacity. - FY2023-Q1AdvancedAnnual report
「As global semiconductor demand is expected to continue over the medium to long term, we are promoting further capital investment to secure production capacity in response to product demand.」
Anticipating continued global semiconductor demand, the company has continued additional capital investment to secure production capacity. During the first quarter, a subsidiary installed new equipment, increasing property, plant and equipment by ¥227 million, and also made an additional ¥1.5 billion in long-term borrowings to establish a higher-volume production structure. - FY2022-Q3RestatedAnnual report
「As global semiconductor demand increases, we are promoting further capital investment to secure production capacity in response to product demand, while raising product selling prices in response to soaring raw material prices.」
The company has continued additional capital investment in response to rising semiconductor demand and sales price increases to address soaring raw material prices. - FY2022-Q2First statedAnnual report
「As global semiconductor demand increases, we are promoting further capital investment to secure production capacity in response to product demand, while raising product selling prices in response to soaring raw material prices.」
In response to rising semiconductor demand, the company explicitly stated for the first time that it would combine additional capital investment to secure production capacity with sales price increases to address soaring raw material prices.