Borrowing of part of the funds under a special overdraft facility agreement
HPC SYSTEMS INC. (the filing company)
Allocation to part of the materials procurement costs related to the large-scale order
The company will provide timely updates on changes in the outstanding balance resulting from this borrowing.
The company will provide timely updates on changes in the outstanding borrowing balance.
| Item | Details |
|---|---|
| Event name | Borrowing of part of the funds under a special overdraft facility agreement |
| Date of occurrence | 2 July 2026 (date of the borrowing) |
| Subject Entity | HPC SYSTEMS INC. (the filing company) |
| Cause | Allocation to part of the materials procurement costs related to the large-scale order |
| Outlook | The company will provide timely updates on changes in the outstanding balance resulting from this borrowing. |
| Planned follow-up disclosure | The company will provide timely updates on changes in the outstanding borrowing balance. |
Items this document does not state (19)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To fund part of the materials procurement costs related to the large-scale order announced on 1 April 2026.