Borrowing of part of the funds under a special overdraft facility agreement
HPC SYSTEMS Inc.
Allocation to part of the materials procurement costs related to the large-scale order
The Company will provide timely updates on changes in the outstanding balance resulting from this borrowing.
The Company will provide timely updates on changes in the outstanding balance.
| Item | Details |
|---|---|
| Event name | Borrowing of part of the funds under a special overdraft facility agreement |
| Date of occurrence | 11 June 2026 |
| Subject Entity | HPC SYSTEMS Inc. |
| Cause | Allocation to part of the materials procurement costs related to the large-scale order |
| Outlook | The Company will provide timely updates on changes in the outstanding balance resulting from this borrowing. |
| Planned follow-up disclosure | The Company will provide timely updates on changes in the outstanding balance. |
Items this document does not state (19)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The borrowing is intended to finance part of the procurement of materials related to the large order announced on 1 April 2026.