Business Expansion in Growth Areas, Strengthening Product Capabilities, and Securing Profits from High-Market-Share Products
First written in FY2016. 35 of 37 entries say "Advanced", first in FY2017-Q1. Latest entry: 2026-09-29.
1 other company's latest entry also says "Advanced".
- 2026-09-29Advancedfinance.yahoo.co.jp
「Announced on 24 September the launch of sales of the "HSM-1000" pre-processing equipment for advanced semiconductor packaging.」
The company announced the launch of sales of a new product for advanced semiconductor packaging. - FY2026AdvancedAnnual report
「The Group is accelerating business-structure reforms as its basic policy to secure sales and profits in growth areas. In capital expenditures, it invested ¥10,964 million, mainly in the SPE field.」
The Company invested ¥10,964 million, mainly in the SPE field, increasing the scale of investment to secure sales and profits in growth areas. - FY2026-H1AdvancedAnnual report
「In semiconductor back-end processes, equipment for advanced packaging performed well as demand for GPUs for generative AI increased, resulting in a significant year-on-year increase. FPD back-end processes and vacuum application equipment were weak, with both declining year on year. As a result, sales for the segment as a whole increased to ¥14,108 million, up 57.6% year on year.」
Strong sales of advanced-packaging equipment for GPUs for generative AI drove Mechatronics Systems sales up 57.6% year on year and segment profit to ¥3,371 million, up 102.7% year on year. Growth in semiconductor back-end processes progressed, while FPD back-end processes and vacuum application equipment remained weak. - FY2025-H1AdvancedAnnual report
「Orders in the semiconductor business increased year on year as equipment for logic/foundry applications in front-end processes and equipment for advanced packaging, including applications for GPUs for generative AI, in back-end processes both performed well. The FPD business declined year on year as it remained weak. In addition, higher orders in the distribution equipment business contributed, bringing orders for the first half to ¥36,946 million, up 11.1% year on year.」
Orders increased for equipment for logic/foundry applications, advanced-packaging equipment including applications for GPUs for generative AI, and distribution equipment, bringing total orders to ¥36,946 million, up 11.1% year on year. Meanwhile, the FPD business was weak and orders declined. - FY2024-Q3AdvancedAnnual report
「In semiconductor back-end processes, equipment for advanced packaging remained solid. In front-end processes, however, orders decreased from the high level recorded in the year-earlier period, as some customers revised their capital investment plans, mainly for wafer-related equipment.」
Equipment for advanced packaging in semiconductor back-end processes performed steadily. Meanwhile, orders for wafer-related equipment decreased due to customers' revisions to their capital investment plans, indicating differing progress across growth areas. - FY2024-Q2AdvancedAnnual report
「In semiconductor back-end processes, orders for advanced-packaging equipment increased significantly from both the year-earlier period and the second half of the previous fiscal year as demand for GPUs for generative AI increased.」
Orders for advanced-packaging equipment increased significantly from both the year-earlier period and the second half of the previous fiscal year against a backdrop of rising demand for GPUs for generative AI. - FY2024-Q1AdvancedAnnual report
「In semiconductor back-end processes, equipment for advanced packaging remained solid as demand for GPUs for generative AI increased.」
Orders for advanced-packaging equipment remained solid against a backdrop of rising demand for GPUs for generative AI. This indicates concrete progress in the growth area of semiconductor back-end processes. - FY2023-Q3AdvancedAnnual report
「Sales of equipment for logic/foundry, power-device and wafer applications in semiconductor front-end processes all performed steadily and increased year on year. Meanwhile, FPD front-end sales decreased year on year. As a result, sales for the segment as a whole increased to ¥31,210 million, up 47.0% year on year. Orders in semiconductor front-end processes remained solid overall. In FPD front-end processes, both equipment for large panels and equipment for small- and medium-sized panels performed weakly. As a result, orders for the segment as a whole increased to ¥44,816 million, up 29.2% year on year.」
Equipment for logic/foundry, power-device and wafer applications in semiconductor front-end processes performed steadily, resulting in higher sales and orders in the Fine Mechatronics segment. Meanwhile, FPD front-end processes were weak, indicating uneven progress across growth areas. - FY2023-Q2AdvancedAnnual report
「Orders in the semiconductor business performed well on the back of robust customer investment. Meanwhile, the FPD business remained weak as customers reviewed their capital investment plans. As a result, orders for the first 2 quarters reached ¥47,421 million, up 61.6% year on year.」
Orders increased on the back of robust customer investment in the semiconductor business, bringing total orders to ¥47,421 million, up 61.6% year on year. Meanwhile, the FPD business was weak due to revisions to capital investment plans. - FY2023-Q1AdvancedAnnual report
「Orders in the semiconductor business performed well on the back of robust customer investment, while the FPD business remained at a level comparable to the year-earlier period. As a result, orders for the first quarter reached ¥28,941 million, up 94.7% year on year.」
Orders performed well against a backdrop of robust customer investment in the semiconductor business, bringing total orders to ¥28,941 million, up 94.7% year on year. The FPD business was at roughly the same level as the year-earlier period. - FY2022-Q3AdvancedAnnual report
「Orders reached a high level, particularly in the third quarter, as customers made robust investments in the semiconductor business, reaching ¥24,231 million, up 94.2% year on year. During the first 3 quarters, both semiconductor front-end and back-end processes performed well, while FPD front-end processes remained at a low level and back-end processes performed steadily. As a result, orders for the first 3 quarters reached ¥53,575 million, up 74.7% year on year.」
Semiconductor front-end and back-end processes and FPD back-end processes performed well, bringing orders to ¥53,575 million, up 74.7% year on year. This indicates concrete progress in efforts to expand orders in growth areas. - FY2022-Q2AdvancedAnnual report
「Orders increased year on year as both semiconductor front-end and back-end processes performed well, while in the FPD business, equipment for small- and medium-sized panels in front-end processes and equipment for large panels in back-end processes increased. Orders reached ¥29,344 million, up 61.3% year on year.」
Orders increased in semiconductor front-end and back-end processes, FPD front-end processes for small- and medium-sized panels, and FPD back-end processes for large panels. Total orders increased 61.3% year on year. - FY2022-Q1AdvancedAnnual report
「Orders increased year on year as the semiconductor business performed steadily and equipment for large panels in FPD back-end processes also remained solid. Orders reached ¥14,866 million, up 69.4% year on year.」
Equipment in the semiconductor business and equipment for large panels in FPD back-end processes drove orders higher, bringing total orders up 69.4% year on year. Semiconductor front-end processes performed steadily in wafer cleaning and power-device applications, while semiconductor back-end processes performed steadily in advanced packaging, FO-PLP and display-driver IC applications. - FY2021-Q3AdvancedAnnual report
「In FPD front-end processes, sales increased year on year as equipment for small- and medium-sized panels increased and equipment for large panels remained solid, in line with the plan. In semiconductor front-end processes, equipment for logic/foundry and wafer applications performed generally steadily and sales were in line with the plan, but decreased year on year. As a result, sales for the segment as a whole increased to ¥21,471 million, up 6.5% year on year. Segment profit reached ¥1,486 million, up 5.9% year on year, due to higher sales, lower fixed costs and changes in the product mix.」
Equipment for small-, medium- and large-sized panels in FPD front-end processes increased or remained solid, and Fine Mechatronics sales rose 6.5% year on year, while segment profit increased 5.9%. Meanwhile, sales in semiconductor front-end processes decreased year on year, indicating differing progress across fields. - FY2021-Q2AdvancedAnnual report
「In FPD front-end processes, sales increased year on year as equipment for small- and medium-sized panels increased and equipment for large panels remained solid, in line with the plan. In semiconductor front-end processes, equipment for logic/foundry and wafer applications performed generally steadily, and sales were roughly in line with the year-earlier period. As a result, sales for the segment as a whole increased to ¥15,998 million, up 22.5% year on year. Segment profit reached ¥1,361 million, up 107.6% year on year, due to higher sales in FPD front-end processes, lower fixed costs and changes in the product mix.」
Equipment for small-, medium- and large-sized panels in FPD front-end processes and equipment for logic/foundry and wafer applications in semiconductor front-end processes progressed, bringing Fine Mechatronics sales to ¥15,998 million and segment profit to ¥1,361 million. Meanwhile, FPD front-end orders declined as some customers postponed their investment plans. - FY2021-Q1AdvancedAnnual report
「In FPD front-end processes, both equipment for small- and medium-sized panels and equipment for large panels performed steadily, and sales increased year on year as planned. As a result, sales for the segment as a whole increased to ¥6,676 million, up 27.9% year on year. Segment profit also increased year on year on higher sales, but due to changes in the product mix, the increase was limited to ¥250 million, up 89.6% year on year.」
Equipment for small-, medium- and large-sized panels in FPD front-end processes performed steadily, and Fine Mechatronics sales increased 27.9% year on year, while segment profit rose 89.6%. Meanwhile, mask-related business in semiconductor front-end processes declined due to changes in customers' investment plans, and orders for the segment as a whole decreased year on year. - FY2020AdvancedAnnual report
「The Group is accelerating business-structure reforms as its basic policy to secure sales and profits in growth areas and healthcare. In capital expenditures, it invested ¥2,230 million, mainly in the semiconductor and FPD fields.」
The Company invested ¥2,230 million in growth areas, mainly semiconductors and FPDs, and introduced evaluation equipment including single-wafer phosphoric-acid etching equipment, photomask etching equipment and firing furnaces for OLED applications. - FY2020-Q3AdvancedAnnual report
「In semiconductor front-end processes, orders for logic/foundry applications remained solid but decreased year on year due partly to delays in investment decisions, while sales increased. As a result, orders and sales for the segment as a whole edged down year on year, with sales of ¥20,169 million, down 2.1%. Segment profit increased significantly, to ¥1,403 million, up 133.1% year on year, due to higher sales in semiconductor front-end processes, changes in the product mix and cost improvements.」
Sales in semiconductor front-end processes increased against a backdrop of capital investment for logic/foundry applications, while changes in the product mix and cost improvements also contributed, bringing Fine Mechatronics segment profit to ¥1,403 million, up 133.1% year on year. Meanwhile, orders and sales for the segment as a whole edged down, indicating uneven progress across fields. - FY2020-Q2AdvancedAnnual report
「In FPD front-end processes, orders increased year on year, mainly for equipment for small- and medium-sized panels, while sales decreased due partly to the impact of lower orders in the first half. In semiconductor front-end processes, sales increased as orders remained solid, mainly for logic/foundry and wafer applications.」
Increases in orders or sales were recorded for equipment for small- and medium-sized panels in FPD front-end processes and for logic/foundry and wafer applications in semiconductor front-end processes. Meanwhile, sales in FPD front-end processes and orders and sales in the Mechatronics Systems segment declined, indicating uneven progress across growth areas. - FY2020-Q1AdvancedAnnual report
「In semiconductor front-end processes, capital investment continued, mainly for logic/foundry and wafer applications, and both orders and sales increased.」
Continued capital investment for logic/foundry and wafer applications resulted in increases in both orders and sales in semiconductor front-end processes. This indicates concrete progress in growth areas. - FY2019AdvancedAnnual report
「The Group is accelerating business-structure reforms as its basic policy to secure sales and profits in growth areas and new market fields. In capital expenditures, it invested ¥1,717 million, mainly in the semiconductor and FPD fields.」
To secure sales and profits in growth areas and new market fields, the Company invested ¥1,717 million in capital expenditures, mainly in the semiconductor and FPD fields. - FY2019-Q3AdvancedAnnual report
「In semiconductor front-end processes, active capital investment continued, and both orders and sales increased. In semiconductor back-end processes, orders and sales both increased, mainly for equipment for mobile-device components and advanced packaging. As a result, orders and sales increased for the segment as a whole, with sales of ¥20,603 million, up 12.6% year on year. Segment profit increased on higher sales and other factors, reaching ¥602 million, up 32.3% year on year.」
Orders and sales increased in semiconductor front-end processes and semiconductor back-end processes for mobile-device components and advanced packaging. Sales in the Fine Mechatronics segment increased 12.6% year on year, while segment profit rose 32.3%, indicating concrete progress in expanding growth areas and high-margin products. - FY2019-Q2AdvancedAnnual report
「In semiconductor front-end processes, active capital investment continued, resulting in a significant increase in orders and an increase in sales. In semiconductor back-end processes, orders and sales both increased significantly, mainly for equipment for smartphone components and advanced packaging.」
In addition to higher orders and sales in semiconductor front-end processes, orders and sales increased significantly for semiconductor back-end equipment for smartphone components and advanced packaging. Sales were ¥14,399 million in the Fine Mechatronics segment and ¥10,553 million in the Mechatronics Systems segment. - FY2019-Q1AdvancedAnnual report
「In semiconductor front-end processes, both orders and sales increased on the back of active capital investment. In semiconductor back-end processes, orders and sales both increased significantly, mainly for equipment for smartphone components and advanced packaging. In vacuum application equipment, orders and sales both increased, mainly for electronic component-related and automotive equipment. As a result, orders and sales increased for the segment as a whole, with sales of ¥4,975 million, up 14.9% year on year. Segment profit increased on higher sales and changes in the sales mix, reaching ¥701 million, up 68.3% year on year.」
Orders and sales increased in semiconductor front-end processes, semiconductor back-end processes for smartphone components and advanced packaging, and vacuum application equipment for electronic components and automotive applications. Sales in the Mechatronics Systems segment increased 14.9% year on year, while segment profit rose 68.3%. - FY2018AdvancedAnnual report
「The Group is pursuing business-structure reform as its basic policy, with the aim of expanding orders in growth areas and securing sales and profits from high-market-share products. It made ¥1,126 million in capital investments, primarily in the semiconductor and FPD fields.」
To expand growth areas and high-market-share products, the Company invested ¥1,126 million in capital expenditures, mainly in the semiconductor and FPD fields. - FY2018-Q3AdvancedAnnual report
「In FPD back-end processes, orders remained strong, led by equipment for large panels, and both orders and sales increased substantially. In semiconductor back-end processes, orders remained strong, led by equipment for smartphone components, and both orders and sales increased substantially. For vacuum-application equipment, both orders and sales remained solid, led by electronic-component and automotive equipment. Across the division as a whole, both orders and sales increased substantially. Segment profit also increased substantially due to higher sales. As a result, segment sales were ¥13,008 million, up 60.6% year on year, and segment profit was ¥1,190 million, up 284.8%.」
Orders and sales increased for large-panel, smartphone-component, electronic-component and automotive equipment. Sales in the Mechatronics Systems Division increased 60.6% year on year, while segment profit increased 284.8%. - FY2018-Q2AdvancedAnnual report
「For the six-month period of the current consolidated fiscal year, orders received were ¥25,581 million, up 32.9% year on year, reflecting solid performance. Net sales were ¥22,570 million, up 1.6%, operating income was ¥959 million, up 62.6%, ordinary income was ¥868 million, up 56.2%, and net income attributable to owners of the parent for the quarter was ¥689 million, up 61.5%, resulting in higher sales and profit.」
Orders received increased 32.9% year on year, while operating income increased 62.6%. The company reports higher orders and sales in multiple growth areas, including large panels, OLEDs, smartphone components and automotive applications. - FY2018-Q1AdvancedAnnual report
「In FPD back-end processes, orders for equipment for large panels increased, resulting in higher orders and sales. In semiconductor back-end processes, both orders and sales increased, led by equipment for smartphone components. Orders for vacuum-application equipment declined due to changes in customers’ capital investment plans and other factors, while sales increased, led by electronic-component and automotive equipment. Across the division as a whole, both orders and sales increased. As a result, segment sales were ¥4,331 million, up 121.9% year on year, and segment profit was ¥417 million, compared with a segment loss of ¥59 million in the same period of the previous year.」
Orders or sales increased for large-panel, smartphone-component, electronic-component and automotive equipment, and the Mechatronics Systems Division turned from a loss in the same period of the previous year to profit of ¥417 million. The company reports specific progress in expanding growth areas and high-profitability products, while also noting a decline in orders due to changes in customers’ capital investment plans. - FY2017-Q3AdvancedAnnual report
「In semiconductor front-end processes, both orders and sales increased year on year, led by equipment for advanced applications. For vacuum-application equipment, both orders and sales increased in response to stronger demand for IoT-related and automotive equipment. Across the division as a whole, orders declined year on year, but sales increased. In addition to higher sales, the increased proportion of more profitable equipment drove segment profit higher. As a result, segment sales were ¥19,746 million, up 11.1% year on year, and segment profit was ¥38 million, compared with a segment loss of ¥477 million in the same period of the previous year.」
The company reported higher orders and sales of semiconductor equipment for advanced applications and IoT- and automotive-related equipment, as well as an increased proportion of more profitable equipment. The Fine Mechatronics Division turned from a segment loss of ¥477 million in the same period of the previous year to segment profit of ¥38 million. - FY2017-Q2AdvancedAnnual report
「Operating income increased as business-structure reform progressed and the shift toward more profitable product lines advanced. Ordinary income and net income attributable to owners of the parent for the quarter also increased. For the six-month period of the current consolidated fiscal year, orders received were ¥19,248 million, down 17.5% year on year, net sales were ¥22,214 million, up 1.3%, and operating income was ¥589 million, up 21.0%.」
The shift toward more profitable product lines progressed, and operating income was ¥589 million, up 21.0% year on year. The company reports specific progress in business-structure reform and the transition to more profitable products in its results. - FY2017-Q1AdvancedAnnual report
「Operating income, ordinary income and net income attributable to owners of the parent for the quarter increased, partly because the sales mix shifted toward more profitable equipment. For the first quarter of the current consolidated fiscal year, orders received were ¥8,266 million, down 31.5% year on year, net sales were ¥10,392 million, up 2.7%, and operating income was ¥284 million, compared with an operating loss of ¥70 million in the same period of the previous year.」
The sales mix shifted toward more profitable equipment, and operating income turned from a loss in the same period of the previous year to profit of ¥284 million. The company describes this as specific progress in securing profits from high-market-share, high-profitability products. - FY2016First statedAnnual report
「The Group is pursuing business-structure reform as its basic policy, with the aim of expanding its businesses in growth areas, strengthening product competitiveness and securing profits from high-market-share products. It made ¥1,536 million in capital investments, primarily in the semiconductor and LCD fields.」
Capital investment for the year was directed primarily toward growth areas and strengthening high-market-share products, particularly in the semiconductor and LCD fields.