Expanding Batch ALD Technology into Logic, Foundry, DRAM and Other Applications
First written in FY2024. 5 of 7 entries say "Advanced", first in FY2025-H1. Latest entry: 2026-11-09.
7 other companies' latest entry also says "Advanced".
- FY2026RaisedAnnual report
「We will also continue to strengthen our initiatives in the advanced packaging field in order to accelerate our efforts in new fields.」
In addition to the policy of expanding technologies such as batch ALD developed in NAND into Logic/Foundry and DRAM, the Group is continuing to strengthen its initiatives in advanced packaging, thereby broadening its target areas. - 2026-05-13AdvancedFinancial results presentation
「GAA特有の高難易度成膜POR獲得により新規需要を見込む。 アドバンスドパッケージ向け装置販売、成熟ノード向け装置販売の回復も期待。」
Logic/Foundry向けではGAA世代のPOR獲得を新規需要の要素として示し、アドバンスドパッケージおよび成熟ノードへの展開も記載している。 - FY2025AdvancedAnnual report
「In the current consolidated fiscal year, equipment sales increased year on year for all applications—DRAM, Logic/Foundry, and NAND.」
Regarding the expansion of technologies developed in NAND into Logic/Foundry and DRAM, equipment sales increased year on year for all 3 applications. - FY2025-H1AdvancedAnnual report
「During the interim consolidated accounting period, equipment sales increased for all applications—DRAM, Logic/Foundry, and NAND—compared with the same period of the previous year, when performance was at its lowest.」
Regarding the expansion of technologies developed in NAND into DRAM and Logic/Foundry, equipment sales increased year on year for all 3 applications during the interim period. - FY2024First statedAnnual report
「We will expand into the Logic/Foundry and DRAM fields the advanced platforms and process technologies, including batch ALD, that we have developed in the NAND field, where the transition to three-dimensional semiconductor devices is most advanced.」
The Group aims to expand its NAND-developed technologies into Logic/Foundry and DRAM, and further increase sales and profit in power devices, mature nodes, and sensors.