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Presentation materials for financial results6503Mitsubishi Electric CorporationElectrical Equipment and Precision Instruments

Notice of the Release of Presentation Materials for Mitsubishi Electric IR Day 2026 (Semiconductor and Device Business)

Mitsubishi Electric presented a new medium-term business strategy and FY2030 financial targets for its Semiconductor and Device Business. It also explained plans to increase the added value of power devices, expand optical device production capacity, and begin discussions on integrating its power semiconductor business with ROHM and Toshiba Electronic Devices & Storage Corporation.

Worth reading
53Recurring
Scored from 5 of 6 sections
Direction
Mixed performance
Direction inferred from the company’s description.
Scale
0.4
Trillion yen (FY2030 sales target)
Wording
Avoiding a definitive answer
How definitive the wording is.

Contents of this document

Medium-Term Management Plan Presentation9 items taken from the company’s own explanation
Financial Results Figures (The key points of this material are explained below)
Net Sales¥2,871 100 million FY2025 actuals, Semiconductor and Device Business
Operating profit¥463 100 million FY2025 actuals, adjusted operating profit
Operating profit margin16.1 % FY2025 actuals, adjusted operating margin
Full-year earnings forecast
Semiconductor and Device Business
Net Sales
3,000 Hundreds of millions of yen
Adjusted operating profit
430 Hundreds of millions of yen
Adjusted operating margin
14.3 %
Power Device Business sales
2,270 Hundreds of millions of yen
High-Frequency and Optical Device Business sales
730 Hundreds of millions of yen
What the company explained in this material
Breakdown of Factors Affecting the ChangeReasons cited by the Company for the change in the figures.
The adjusted operating margin bridge illustrates the effects of foreign exchange movements, sales growth, a shift in product mix, and productivity improvements, but the amounts attributable to each factor were not disclosed
Assumptions Underlying the Business OutlookThe assumptions used by the company in preparing its forecast.
  • Exchange rates (FY2026)¥150/US$, ¥175/euro, ¥21.5/Chinese yuan
  • Exchange rates (FY2030)¥140/US$, ¥160/euro, ¥19.5/Chinese yuan
  • EML chip production capacityMore than 3 times FY2025 levels by FY2029, and 20 times FY2020 levels
  • HV production capacity2.3 times higher from FY2023 to FY2027
New initiatives
  • Strengthen the high-voltage power device product lineup and supply structure
  • Transition SiC to 8-inch wafers and strengthen cost competitiveness
  • Increase EML chip production capacity to more than 3 times FY2025 levels by FY2029
  • Launch optical devices for next-generation CPO applications
  • Begin discussions on integrating the power semiconductor businesses and management of ROHM and Toshiba Electronic Devices & Storage Corporation
Key KPIsA metric the company considers important as a management benchmark.
  • Global share of power modules2 rank
  • Global share of IPMs1 rank
  • Global share of power modules for VSC-HVDC1 rank
  • Global share of EML chips for data centers1 rank
  • Cumulative shipments of EML chips for data centers1 100 million units FY2025
  • Cumulative shipments of GaN modules for 5G base stations300 10,000 units FY2025
Segment results
Power Device Business
Net Sales
¥2,313 100 million FY2025 actual
High-Frequency and Optical Device Business
Net Sales
¥554 100 million FY2025 actual
Medium-term management plan targets
Target fiscal yearFY2030
Semiconductor and Device Business sales
¥0.4 trillion
Adjusted operating margin
20 %
ROIC
12 %
Power Device Business sales
3,000 Hundreds of millions of yen
High-Frequency and Optical Device Business sales
1,000 Hundreds of millions of yen
Comparison with actual resultsFor comparison with FY2025 actuals, sales of ¥287.1 billion, an adjusted operating margin of 16.1%, and ROIC of 8.6% are also shown
Financial targets
ROIC
FY2025 actual8.6%
FY2030 target12%
Adjusted operating margin
FY2025 actual16.1%
FY2026 outlook14.3%
FY2030 target20%
Market Size / Share
  • Global share of power modules2nd
  • Global share of IPMs1st place
  • Global share of power modules for VSC-HVDC1st place
  • Global share of EML chips for data centers1st place
  • CAGR of the Ethernet optical transceiver and CPO market27% (2024–2030)
Capital expenditures
¥400 100 million decided in FY2025, for expanding EML chip production capacity
Contents of this document
ItemDetails
Document typeMedium-Term Management Plan Presentation
Net Sales¥2,871 100 million (FY2025 actuals, Semiconductor and Device Business)
Operating profit¥463 100 million (FY2025 actuals, adjusted operating profit)
Operating profit margin16.1 % (FY2025 actuals, adjusted operating margin)
Full-year earnings forecastSemiconductor and Device Business Net Sales 3,000 Hundreds of millions of yen / Adjusted operating profit 430 Hundreds of millions of yen / Adjusted operating margin 14.3 % / Power Device Business sales 2,270 Hundreds of millions of yen / High-Frequency and Optical Device Business sales 730 Hundreds of millions of yen
Segment resultsPower Device Business Net Sales ¥2,313 100 million (FY2025 actual) / Profit Not disclosed / Year on year against the same period last year Not disclosed / High-Frequency and Optical Device Business Net Sales ¥554 100 million (FY2025 actual) / Profit Not disclosed / Year on year against the same period last year Not disclosed
Breakdown of Factors Affecting the ChangeThe adjusted operating margin bridge illustrates the effects of foreign exchange movements, sales growth, a shift in product mix, and productivity improvements, but the amounts attributable to each factor were not disclosed
Key KPIsIndicator name Global share of power modules / Value 2 rank / Year on year against the same period last year Not disclosed, Indicator name Global share of IPMs / Value 1 rank / Year on year against the same period last year Not disclosed, Indicator name Global share of power modules for VSC-HVDC / Value 1 rank / Year on year against the same period last year Not disclosed, Indicator name Global share of EML chips for data centers / Value 1 rank / Year on year against the same period last year Not disclosed, Indicator name Cumulative shipments of EML chips for data centers / Value 1 100 million units (FY2025) / Year on year against the same period last year Not disclosed, Indicator name Cumulative shipments of GaN modules for 5G base stations / Value 300 10,000 units (FY2025) / Year on year against the same period last year Not disclosed
Assumptions Underlying the Business OutlookItem Exchange rates (FY2026) / Value ¥150/US$, ¥175/euro, ¥21.5/Chinese yuan, Item Exchange rates (FY2030) / Value ¥140/US$, ¥160/euro, ¥19.5/Chinese yuan, Item EML chip production capacity / Value More than 3 times FY2025 levels by FY2029, and 20 times FY2020 levels, Item HV production capacity / Value 2.3 times higher from FY2023 to FY2027
Medium-term management plan targetsTarget fiscal year FY2030 / Semiconductor and Device Business sales ¥0.4 trillion / Adjusted operating margin 20 % / ROIC 12 % / Power Device Business sales 3,000 Hundreds of millions of yen / High-Frequency and Optical Device Business sales 1,000 Hundreds of millions of yen / Comparison with actual results For comparison with FY2025 actuals, sales of ¥287.1 billion, an adjusted operating margin of 16.1%, and ROIC of 8.6% are also shown
Financial targetsROIC FY2025 actual 8.6% / FY2030 target 12% / Adjusted operating margin FY2025 actual 16.1% / FY2026 outlook 14.3% / FY2030 target 20%
Capital expenditures¥400 100 million (decided in FY2025, for expanding EML chip production capacity)
Market Size / ShareItem Global share of power modules / Value 2nd, Item Global share of IPMs / Value 1st place, Item Global share of power modules for VSC-HVDC / Value 1st place, Item Global share of EML chips for data centers / Value 1st place, Item CAGR of the Ethernet optical transceiver and CPO market / Value 27% (2024–2030)
New initiativesStrengthen the high-voltage power device product lineup and supply structure, Transition SiC to 8-inch wafers and strengthen cost competitiveness, Increase EML chip production capacity to more than 3 times FY2025 levels by FY2029, Launch optical devices for next-generation CPO applications, Begin discussions on integrating the power semiconductor businesses and management of ROHM and Toshiba Electronic Devices & Storage Corporation
Items this document does not state (17)
Fiscal Period CoveredOrdinary incomeNet incomeGross Profit MarginSelling, general and administrative expensesResults for the three months of the current quarterProgress against full-year forecastSelf-assessment against the planUnit price and quantity metricsNumber of stores and locationsNumber of employeesRisk amount incorporated into the outlookAnnual DividendPayout ratioAcquisition of treasury sharesOrders received and order backlogKey points of the Q&A

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

Mitsubishi Electric identified carbon neutrality, lower power consumption, AI-related investment, and growing data center demand as growth opportunities. It also stated that it aims to strengthen its competitiveness, cost competitiveness, and supply structure in response to the rise of Chinese competitors and the expansion of Western competitors.

How to read this page

This is not the documentKomori reads the disclosure the company filed and writes this summary. Figures are as stated by the company and are not audited.
Weight is not a verdictIt measures how much this changes what the company had already told the market. It is not a view on the shares.
Corrections happenIf the company reissues this disclosure, the page is rebuilt from the corrected version and the revision number moves up.
Notice of the Release of Presentation Materials for Mitsubishi Electric IR Day 2026 (Semiconductor and Device Business) | Mitsubishi Electric Corporation (6503) timely disclosure | Komori