Creating higher-value-added offerings by solving user issues and addressing individual needs
First written in FY2016. 8 of 9 entries say "Advanced", first in FY2018. Latest entry: 2026-09-01.
6 other companies' latest entry also says "Advanced".
- 2026-09-01AdvancedGovernance
「Development of Flap Wrist, a new handling technology for the advanced-packaging era」
The company presented the development of Flap Wrist as a specific achievement addressing challenges in the advanced-packaging market. - FY2026AdvancedAnnual report
「Our main new product is equipment compatible with PLP (Panel Level Package).」
The company disclosed the development of specific new products in the form of PLP-compatible equipment. - 2026-05-06AdvancedGeneral Meetings of Shareholders
「At the existing plant of the Vietnamese subsidiary, the company is promoting the development of a production system incorporating manufacturing automation technology and an automated inspection system using AI, with the aim of improving production efficiency and product quality.」
The company presented manufacturing automation and an AI-based inspection system as specific measures. - FY2023AdvancedAnnual report
「Our main new products include robots, core AI technologies and standalone control software.」
The company disclosed new development achievements comprising robots, core AI technologies and standalone control software. - FY2021AdvancedAnnual report
「Our main new product is a transfer system for thin wafers, bonded wafers, tape-frame wafers and TAIKO wafers for the next-generation 3D advanced packaging market.」
The company developed a transfer system compatible with multiple wafer types for the next-generation 3D advanced packaging market. - FY2020AdvancedAnnual report
「Our main new products include a wafer transfer system for backside mini-contact handling and a wafer transfer system for warped wafers, both required for next-generation clean transfer. We also developed a glass-substrate transfer system (EFEM and sorter) for PLP (panel-level packaging), which is expected to be a next-generation semiconductor packaging technology.」
The company developed new products and systems addressing customer and process challenges involving next-generation clean transfer, warped wafers and PLP. - FY2019AdvancedAnnual report
「Our main new products include the N2 Smart Purge Sorter, which substantially reduces nitrogen consumption as a measure against yield declines caused by oxygen and water molecules inside equipment. We also developed a glass-substrate transfer robot for PLP (panel-level packaging), which is expected to be a next-generation semiconductor packaging technology.」
The company developed 2 specific new products addressing customer and process challenges involving yield declines and next-generation packaging. - FY2018AdvancedAnnual report
「Our main new products include the shutter-type load port RV301 and the N2 Umbrella. These products support the highly demanded N2 purge used to prevent wafer oxidation caused by process miniaturization and quality impacts from moisture and the surrounding atmosphere.」
RV301 and N2 Umbrella were developed as specific new products addressing customers' quality and environmental challenges. - FY2016First statedAnnual report
「We are actively developing new products that are close to users and can solve issues such as improving operating rates and performance, automation and cost reduction.」
The company is advancing product development to solve customer issues related to operating rates, performance, automation and costs.