Expansion in the Advanced Packaging Field through an Investment in Nanoverse Technologies
First written in FY2025-Q1. 1 of 4 entries say "Achieved", first in FY2025-H1. Latest entry: 2026-10-08.
No other company in this theme has enough history to compare yet.
- FY2025-H1AchievedAnnual report
「At a Board of Directors meeting held on 24 June 2024, the Company resolved to subscribe to a third-party allotment of new shares conducted by Nanoverse Technologies,Ltd. Based on that resolution, it acquired shares of the company on 26 June 2024 and made it a consolidated subsidiary.」
The Company acquired shares of Nanoverse Technologies,Ltd. on 26 June 2024 through its subscription to a third-party allotment of new shares, completing its conversion into a consolidated subsidiary. The acquired voting-rights ratio was 33.00%, and the acquisition consideration was US$70 million. - FY2025-Q1First statedAnnual report
「Since its establishment in 2022, Nanoverse Technologies, Ltd. (Nanoverse) has continued research and development into technologies expected to be useful in future semiconductor manufacturing processes and holds several competitive patents. Nanoverse plans to combine these patented technologies to develop new semiconductor manufacturing equipment in the advanced packaging field, which is expected to grow, and to deliver evaluation systems to semiconductor manufacturers. The equipment under development also incorporates transport equipment manufactured by the Company, making the Company one of its customers.」
At a Board of Directors meeting held on 24 June 2024, the Company resolved to subscribe to a third-party allotment of new shares conducted by Nanoverse and make it a consolidated subsidiary. The business combination was scheduled for July 2024, with a post-acquisition voting-rights ratio of 33.00% and acquisition consideration of US$70 million. The transaction aims to achieve further growth in the semiconductor-related equipment business by combining Nanoverse's patented technologies and equipment development capabilities in the advanced packaging field with the Company's core technologies, service network and production capacity.