Entry into the semiconductor business through the acquisition of ケメット・ジャパン and システム精工
First written in FY2024-Q1. 6 of 9 entries say "Advanced", first in FY2024-Q2. Latest entry: FY2027-H1.
No other company in this theme has enough history to compare yet.
- FY2027-H1AdvancedAnnual report
「Sales were ¥1,570 million, up 108.4% year on year, as sales of equipment for semiconductors and electronic components and of products in the hard disk business increased at consolidated subsidiary 北川グレステック株式会社 against a backdrop of growing global demand for AI semiconductors, while consumables such as diamond abrasives also remained firm. Segment profit (operating profit) was ¥354 million, up 5,255.8% year on year, as higher sales more than offset the increased cost burden associated with capital investment and additional hiring for business expansion.」
In the semiconductor-related business, sales of equipment, hard disk-related products and diamond polishing abrasives increased against a backdrop of demand for AI semiconductors, resulting in sales of ¥1,570 million and segment profit of ¥354 million. Business integration and monetisation following the acquisitions have progressed further. - FY2026Accumulation of order backlog after completion of the large-scale projectAnnual report
「Semiconductor-related business 3,389 110.5 2,339 219.9」
In the semiconductor-related business, full-year sales declined to ¥1,780 million and operating profit to ¥138 million following completion of the large-scale HDD manufacturing equipment project, while orders received totaled ¥3,389 million and order backlog was ¥2,339 million, indicating accumulation on the order front. - FY2026-H1Changes in the earnings mix after completion of the large-scale projectAnnual report
「Sales in this business segment remained firm at 北川グレステック㈱, a consolidated subsidiary, supported by AI-related capital investment that drove strong sales of consumables and semiconductor-related contract processing. However, sales were ¥753 million, down 20.4% year on year, because the large hard disk manufacturing equipment project was completed in the previous fiscal year. Segment profit was ¥6 million, down 96.2% year on year, due to increased development investment aimed at future business expansion and other factors.」
In the semiconductor-related business, sales of consumables and contract processing remained firm against a backdrop of AI-related capital investment, while the large-scale HDD manufacturing equipment project was completed in the previous fiscal year and development investment also increased. Sales were ¥753 million and segment profit was ¥6 million. - FY2025AdvancedAnnual report
「Sales in this business segment were ¥2,512 million, owing to consolidated subsidiary 北川グレステック㈱ recording sales from a large hard disk manufacturing equipment project and steady sales of semiconductor-related consumables and contract processing. Segment profit (operating profit) was ¥586 million.」
In the semiconductor-related business, which was integrated into 北川グレステック following the acquisitions, a large-scale HDD manufacturing equipment project, sales of consumables and contract processing contributed to full-year sales of ¥2,512 million and operating profit of ¥586 million. - FY2025-H1AdvancedAnnual report
「Sales in this business segment were ¥946 million, owing to consolidated subsidiary 北川グレステック㈱ recording sales from a large HDD manufacturing equipment project and steady sales of semiconductor-related consumables and contract processing. Segment profit (operating profit) was ¥174 million, compared with a segment loss (operating loss) of ¥4 million in the same period of the previous year, due to the recording of sales from the large project.」
北川グレステック, which was integrated following the acquisitions, recorded sales from a large-scale project, and the semiconductor-related business turned from a ¥4 million loss in the same period of the previous year to a ¥174 million profit. - FY2024AdvancedAnnual report
「On 1 April 2024, システム精工㈱, as the surviving company, absorbed ケメット・ジャパン㈱ in a merger and changed its corporate name to 北川グレステック㈱. 北川グレステック㈱ manufactures and sells semiconductor-related products.」
Following the acquisitions of ケメット・ジャパン and システム精工, the companies were integrated through a merger effective 1 April 2024, becoming 北川グレステック, and proceeded to establish a manufacturing and sales structure for the semiconductor business. - FY2024-Q3AdvancedAnnual report
「As the deemed acquisition date for both companies was the end of the second-quarter consolidated accounting period, only their balance sheets were consolidated for the second-quarter consolidated accounting period, while their income statements have been consolidated from the third-quarter consolidated accounting period. The increase in goodwill amounted to ¥666 million for the nine months ended the third quarter of the current fiscal year.」
For ケメット・ジャパン and システム精工, consolidation progressed from balance sheets only in the second quarter to the consolidation of income statements as well from the third quarter. Goodwill of ¥666 million associated with the acquisitions has also been provisionally recorded. - FY2024-Q2AdvancedAnnual report
「During the consolidated second quarter, the Company acquired shares in ケメット・ジャパン株式会社 and システム精工株式会社 and made them consolidated subsidiaries. As the deemed acquisition date for both companies was the end of the consolidated second quarter, only their balance sheets were included in the consolidated results for the consolidated second quarter.」
Following the acquisition of both companies, their consolidation as subsidiaries was reflected in the financial statements, using the end of the current quarter as the deemed acquisition date. The voting rights ratio in both companies is 100%, and goodwill of ¥666 million has been provisionally recorded. - FY2024-Q1First statedAnnual report
「At a meeting of the Board of Directors held on 14 July 2023, the company resolved to acquire all shares of ケメット・ジャパン株式会社 and システム精工株式会社 and make them subsidiaries. Based on this resolution, the company entered into a share transfer agreement on 14 July 2023 and acquired the shares on 31 July 2023. ケメット・ジャパン株式会社 imports and sells semiconductor polishing materials and provides comprehensive technical support for polishing and processing, while システム精工株式会社 manufactures and sells manufacturing equipment for HDD-related components. Through the acquisition of both companies, the company aims to enter the rapidly growing semiconductor business and further expand the Group's business as a whole by deploying the Group's financial resources, personnel and management resources, including its machine design and manufacturing technologies.」
The company acquired all shares of the 2 companies on 31 July 2023 and made them wholly owned subsidiaries. It aims to enter a business providing an integrated contract service for semiconductor polishing processes, from polishing materials through equipment, by incorporating expertise in semiconductor polishing materials, the high market share and precision polishing technologies of magnetic disk polishing equipment, and to expand the Group's business as a whole.