Announced details
Semiconductor back-end processes and mass production of semiconductor packages. A wide range of packages, including memory, logic, QFN and RF modules
Targeting an approximately 50% reduction in mass-production costs, 2x productivity per unit, a 40% reduction in installation footprint, a 50% reduction in power consumption and a 25% reduction in consumable materials, all compared with the Company’s conventional systems
In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.
| Item | Details |
|---|---|
| Names of Products / Services Covered | Next-generation compression molding system “INNOMS (イノモス)” |
| Launch date | Sales scheduled to begin in August 2026 |
| Applicable area | Semiconductor back-end processes and mass production of semiconductor packages. A wide range of packages, including memory, logic, QFN and RF modules |
| Quantitative Effects | Targeting an approximately 50% reduction in mass-production costs, 2x productivity per unit, a 40% reduction in installation footprint, a 50% reduction in power consumption and a 25% reduction in consumable materials, all compared with the Company’s conventional systems |
Items this document does not state (14)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.Against the backdrop of semiconductor market growth driven by expanding generative AI and data center investment, to meet market demand for low costs, mass production and reduced environmental impact.