Announced details
Semiconductor manufacturing processes, wafer-level packaging, and advanced packaging technologies for markets including AI, 5G, IoT and autonomous driving
Improved yield (figures: Not disclosed)
Existing track record of transactions (number of transactions and cumulative total: Not disclosed)
The Company has an existing track record of transactions with the customer
Major overseas semiconductor-related manufacturer. Location, representative, business activities, capital and year established: Not disclosed
Approximately ¥5.0 billion
Revenue is expected to be recognized in the fiscal year ending June 2028. If revisions to the current fiscal year's earnings forecasts become necessary due to adjustments to the delivery schedule with the customer or other factors, the Company will disclose the information promptly. As the transaction is denominated in yen, there will be no impact from foreign-exchange fluctuations.
The company does not address Offering price.
| Item | Details |
|---|---|
| Names of Products / Services Covered | System for wafer-level packaging (temporary bonder/debonder equipment) |
| Counterparty | Major overseas semiconductor-related manufacturer (name undisclosed) |
| Counterparty overview | Major overseas semiconductor-related manufacturer. Location, representative, business activities, capital and year established: Not disclosed |
| Relationship with the Company | The Company has an existing track record of transactions with the customer |
| Contract Value | Approximately ¥5.0 billion |
| Applicable area | Semiconductor manufacturing processes, wafer-level packaging, and advanced packaging technologies for markets including AI, 5G, IoT and autonomous driving |
| Quantitative Effects | Improved yield (figures: Not disclosed) |
| Usage history | Existing track record of transactions (number of transactions and cumulative total: Not disclosed) |
| Impact on Business Performance | Revenue is expected to be recognized in the fiscal year ending June 2028. If revisions to the current fiscal year's earnings forecasts become necessary due to adjustments to the delivery schedule with the customer or other factors, the Company will disclose the information promptly. As the transaction is denominated in yen, there will be no impact from foreign-exchange fluctuations. |
Items this document does not state (9)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The proposal combines the wafer temporary bonding, support-glass debonding and cleaning technologies developed over many years with the Company's manufacturing capabilities. The proposal was well received for its ability to deliver stable quality and improve yield, and the order was secured based on the Company's track record of transactions with the customer.