Items stated in the management plan
Partially revisedEach line is the climb from the baseline the document states to the target it sets. The slope is scaled against the largest climb in this document. For metrics expressed as percentages, differences are shown in percentage points (pt).The increase shown by the dotted line is calculated from the two reported figures because the company did not provide the amount of growth.
In response to growing demand for AI infrastructure, active capital investment in advanced semiconductors for AI applications is continuing. In this business environment, temporary bonders, debonders and other products for advanced semiconductor packaging are expected to generate sales above the assumptions made when the plan was formulated. Accordingly, the Company reviewed the themes and period targets set out in the medium-term management plan, taking into account actual results for the fiscal year ended June 2026.
| Item | Details |
|---|---|
| Plan name | First Medium-Term Management Plan |
| Plan period | Fiscal years ending June 2026 through June 2028 |
| Progress against the plan | Partially revised |
| Sales Target | 300 Hundreds of millions of yen → 450 Hundreds of millions of yen(50%) |
| Operating profit target | 38 Hundreds of millions of yen → 90 Hundreds of millions of yen(Approximately 136.8%) |
| Operating profit margin target | 12 % → 20 %(Approximately 66.7%) |
| ROE target | 17 % → At least 30%(At least 76.5%) |
| Payout ratio / DOE policy | Dividends will be paid with a dividend on equity (DOE) of approximately 2.5% as a guideline. The applicable period is the revised plan for the fiscal years ending June 2026 through June 2028 and the medium-term management plan. |
| Investment amount by sector | Field Growth Investment / Amount Not disclosed / Allocation Approximately 40% / Details Research and development costs, Capital investment, including expansion of development and production sites, Management Infrastructure |
| Segment target | Segment Semiconductor-Related Business / Net sales for the fiscal year ending June 2028 ¥38.8 billion, Segment IJP/LCD / Net sales for the fiscal year ending June 2028 ¥6.2 billion |
| Plan assumptions | Growing demand for AI infrastructure and continued capital investment in advanced semiconductors for AI applications. At the same time, forward-looking statements are based on information currently available to the Company and certain assumptions that it considers reasonable. |
| Key initiatives | TB/DB(WLP), TB/DB(PLP、HBM、SiPh), Solder ball mounters, Establishing sales and support channels in the United States and other markets, Systems for microdisplays, IJP/NIP systems for new processes, Smooth launch of the new plant, Building a multi-vendor structure, Expanding a flexible production structure by developing a multiskilled workforce, Introducing new business systems, Strengthening the IT infrastructure, Shorter lead times, Promoting cross-equipment procurement of materials and components, Controlling working capital, Addressing climate change, protecting the global environment and reducing environmental impact, Diversity, Equity and Inclusion, Strengthening Governance, Activating human capital and ensuring health and safety |
| Results under the previous plan | Net sales of ¥30.0 billion, operating income of ¥3.8 billion and an operating margin of 12% (the original final-year targets under the medium-term management plan for the fiscal year ending June 2028) → Actual results for the fiscal year ended June 2026: net sales of ¥35.2 billion, operating income of ¥5.8 billion and an operating margin of 16.5% |
| Reason for revision or withdrawal | In response to growing demand for AI infrastructure, active capital investment in advanced semiconductors for AI applications is continuing. In this business environment, temporary bonders, debonders and other products for advanced semiconductor packaging are expected to generate sales above the assumptions made when the plan was formulated. Accordingly, the Company reviewed the themes and period targets set out in the medium-term management plan, taking into account actual results for the fiscal year ended June 2026. |
| Risks identified | The possibility that actual business performance and other results may differ substantially due to various factors |
| Publication date | 7 August 2026 |
Items this document does not state (9)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.In response to growing demand for AI infrastructure, active capital investment in advanced semiconductors for AI applications is continuing. Temporary bonders, debonders and other products for advanced semiconductor packaging are expected to generate sales above the assumptions made when the plan was formulated. The revision also reflects actual results for the fiscal year ended June 2026.