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Management planning6227AIMECHATEC,Ltd.Machinery

Notice Regarding Revisions to the Medium-Term Management Plan

The final-year targets under the First Medium-Term Management Plan have been raised from ¥30.0 billion to ¥45.0 billion for net sales and from ¥3.8 billion to ¥9.0 billion for operating income. The targets for operating margin and ROE have also been revised upward. In addition, the cash allocation policy, including growth investment and shareholder returns, has been reviewed.

Worth reading
63In focus
0–100. This measures how worthwhile something is to read, not how good or bad the company is.
Direction
Mixed performance
Direction inferred from the company’s description.
Scale
150
Hundreds of millions of yen
Wording
Avoiding a definitive answer
How definitive the wording is.

Items stated in the management plan

Partially revised
First Medium-Term Management PlanPlan period Fiscal years ending June 2026 through June 2028
Publication date 7 August 2026
Net Sales+50.0%
基準 300Target450Hundreds of millions of yen
Operating profit+136.8%
基準 38Target90Hundreds of millions of yen
Operating profit margin+8.0pt
基準 12Target20%
ROE+13.0pt
基準 17Target30%

Each line is the climb from the baseline the document states to the target it sets. The slope is scaled against the largest climb in this document. For metrics expressed as percentages, differences are shown in percentage points (pt).The increase shown by the dotted line is calculated from the two reported figures because the company did not provide the amount of growth.

What happened to the previous planNet sales of ¥30.0 billion, operating income of ¥3.8 billion and an operating margin of 12% (the original final-year targets under the medium-term management plan for the fiscal year ending June 2028) → Actual results for the fiscal year ended June 2026: net sales of ¥35.2 billion, operating income of ¥5.8 billion and an operating margin of 16.5%-0.1%Calculated from the two disclosed figures
Investment amount by sectorField Growth Investment / Amount Not disclosed / Allocation Approximately 40% / Details Research and development costs, Capital investment, including expansion of development and production sites, Management Infrastructure
Statements about the use of capital
Payout ratio / DOE policyDividends will be paid with a dividend on equity (DOE) of approximately 2.5% as a guideline. The applicable period is the revised plan for the fiscal years ending June 2026 through June 2028 and the medium-term management plan.The payout ratio is the proportion of profit paid out as dividends, while DOE is the ratio of dividends to net assets.
Key initiatives
01TB/DB(WLP)
02TB/DB(PLP、HBM、SiPh)
03Solder ball mounters
04Establishing sales and support channels in the United States and other markets
05Systems for microdisplays
06IJP/NIP systems for new processes
07Smooth launch of the new plant
08Building a multi-vendor structure
09Expanding a flexible production structure by developing a multiskilled workforce
10Introducing new business systems
11Strengthening the IT infrastructure
12Shorter lead times
13Promoting cross-equipment procurement of materials and components
14Controlling working capital
15Addressing climate change, protecting the global environment and reducing environmental impact
16Diversity, Equity and Inclusion
17Strengthening Governance
18Activating human capital and ensuring health and safety
Plan assumptionsGrowing demand for AI infrastructure and continued capital investment in advanced semiconductors for AI applications. At the same time, forward-looking statements are based on information currently available to the Company and certain assumptions that it considers reasonable.
Segment targetSegment Semiconductor-Related Business / Net sales for the fiscal year ending June 2028 ¥38.8 billion, Segment IJP/LCD / Net sales for the fiscal year ending June 2028 ¥6.2 billion
Risks identified by the company
The possibility that actual business performance and other results may differ substantially due to various factors
Reason for revision or withdrawal

In response to growing demand for AI infrastructure, active capital investment in advanced semiconductors for AI applications is continuing. In this business environment, temporary bonders, debonders and other products for advanced semiconductor packaging are expected to generate sales above the assumptions made when the plan was formulated. Accordingly, the Company reviewed the themes and period targets set out in the medium-term management plan, taking into account actual results for the fiscal year ended June 2026.

Items stated in the management plan
ItemDetails
Plan nameFirst Medium-Term Management Plan
Plan periodFiscal years ending June 2026 through June 2028
Progress against the planPartially revised
Sales Target300 Hundreds of millions of yen → 450 Hundreds of millions of yen(50%)
Operating profit target38 Hundreds of millions of yen → 90 Hundreds of millions of yen(Approximately 136.8%)
Operating profit margin target12 % → 20 %(Approximately 66.7%)
ROE target17 % → At least 30%(At least 76.5%)
Payout ratio / DOE policyDividends will be paid with a dividend on equity (DOE) of approximately 2.5% as a guideline. The applicable period is the revised plan for the fiscal years ending June 2026 through June 2028 and the medium-term management plan.
Investment amount by sectorField Growth Investment / Amount Not disclosed / Allocation Approximately 40% / Details Research and development costs, Capital investment, including expansion of development and production sites, Management Infrastructure
Segment targetSegment Semiconductor-Related Business / Net sales for the fiscal year ending June 2028 ¥38.8 billion, Segment IJP/LCD / Net sales for the fiscal year ending June 2028 ¥6.2 billion
Plan assumptionsGrowing demand for AI infrastructure and continued capital investment in advanced semiconductors for AI applications. At the same time, forward-looking statements are based on information currently available to the Company and certain assumptions that it considers reasonable.
Key initiativesTB/DB(WLP), TB/DB(PLP、HBM、SiPh), Solder ball mounters, Establishing sales and support channels in the United States and other markets, Systems for microdisplays, IJP/NIP systems for new processes, Smooth launch of the new plant, Building a multi-vendor structure, Expanding a flexible production structure by developing a multiskilled workforce, Introducing new business systems, Strengthening the IT infrastructure, Shorter lead times, Promoting cross-equipment procurement of materials and components, Controlling working capital, Addressing climate change, protecting the global environment and reducing environmental impact, Diversity, Equity and Inclusion, Strengthening Governance, Activating human capital and ensuring health and safety
Results under the previous planNet sales of ¥30.0 billion, operating income of ¥3.8 billion and an operating margin of 12% (the original final-year targets under the medium-term management plan for the fiscal year ending June 2028) → Actual results for the fiscal year ended June 2026: net sales of ¥35.2 billion, operating income of ¥5.8 billion and an operating margin of 16.5%
Reason for revision or withdrawalIn response to growing demand for AI infrastructure, active capital investment in advanced semiconductors for AI applications is continuing. In this business environment, temporary bonders, debonders and other products for advanced semiconductor packaging are expected to generate sales above the assumptions made when the plan was formulated. Accordingly, the Company reviewed the themes and period targets set out in the medium-term management plan, taking into account actual results for the fiscal year ended June 2026.
Risks identifiedThe possibility that actual business performance and other results may differ substantially due to various factors
Publication date7 August 2026
Items this document does not state (9)
Net income targetROIC targetTreasury share acquisition policyCost of capitalSelf-assessment of PBR and share priceTotal investment planNon-financial targetsSize of the Target MarketDate of board resolution

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

In response to growing demand for AI infrastructure, active capital investment in advanced semiconductors for AI applications is continuing. Temporary bonders, debonders and other products for advanced semiconductor packaging are expected to generate sales above the assumptions made when the plan was formulated. The revision also reflects actual results for the fiscal year ended June 2026.

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Notice Regarding Revisions to the Medium-Term Management Plan | AIMECHATEC,Ltd. (6227) timely disclosure | Komori