Results for this period
Third quarter1 July 2025 to 31 March 2026ConsolidatedJapanese GAAPThe width of the band at each stage is based on revenue. The narrower it becomes toward the bottom, the smaller the proportion of revenue that remains as profit. The dotted outline is the full-year forecast and the band inside it is the result for this period. The progress rate is the result divided by the forecast.
塗りつぶした部分が自己資本比率です。総資産のうち、返済のいらない自前の資金がどれだけかを表します。The thin vertical line indicates the level at the end of the previous fiscal year.
Against a backdrop of expanding investment in advanced semiconductors for AI applications, shipments and orders for wafer-handling systems for advanced semiconductor packages used in AI applications drove performance. Shipments of batch encapsulation lines for microdisplays progressed, as did efforts to meet demand for parts, modifications and expansions in the LCD business.
No applicable matters.
| Item | Details |
|---|---|
| Fiscal Period Classification | Third quarter |
| Accounting standards | Japanese GAAP |
| Consolidated / non-consolidated | Consolidated |
| Period Covered | 1 July 2025 to 31 March 2026 |
| Net Sales | ¥24,863 million (YoY +134.4%) |
| Operating profit | ¥4,228 million |
| Ordinary income | ¥4,095 million |
| Profit attributable to owners of the parent | ¥2,820 million |
| Net income per share | ¥150.28 |
| Equity ratio | End of the current fiscal period 46 / End of previous period 39.7 |
| Total assets | ¥29,488 million |
| Net assets | ¥13,551 million |
| Full-year earnings forecast | Net Sales ¥34,312 million (YoY +63.3%) / Operating profit ¥4,854 million (YoY +131.7%) / Ordinary income ¥4,499 million (YoY +138.8%) / Net income ¥3,078 million (YoY +811.3%) |
| Annual Dividend Forecast | ¥45.00 (before giving effect to the stock split) → ¥17.00 (after giving effect to the stock split)(+13.3% (after giving effect to the stock split)) |
| Segment revenue | IJP Solutions Business ¥1,421,746 thousand (YoY +288.9%), Semiconductor-Related Business ¥21,480,696 thousand (YoY +120.1%), LCD Business ¥1,960,847 thousand (YoY +306.7%) |
| Segment profit | IJP Solutions Business ¥-567,969 thousand, Semiconductor-Related Business ¥6,262,718 thousand (YoY +412.7%), LCD Business ¥-200,440 thousand |
| Orders received and order backlog | Orders received ¥38,642 million (YoY +60.0%) / Order backlog ¥39,972 million (YoY +18.3%) |
| Depreciation and amortization | ¥286,477 thousand |
| Impairment loss | None applicable (material impairment loss related to non-current assets) |
| Breakdown of extraordinary income (loss) | None in the current period |
| Disclosure regarding the going concern assumption | No applicable matters. |
| Change in accounting policy | Changes due to revisions to standards No / Other changes No / Change in accounting estimate No / Restatement No |
| Changes in the scope of consolidation | New 0 / Excluded 0 / Company name No applicable matters |
| Material subsequent events | A 3-for-1 stock split effective 1 April 2026 and a change in the total number of authorized shares under the Articles of Incorporation |
| Availability of Supplementary Financial Results Materials | Yes |
| Availability of Financial Results Briefing | No |
| Issued Shares at Period-End | 18,849,000 |
| Treasury Shares at Period-End | 37,356 |
| Factors Behind Changes in Business Performance | Against a backdrop of expanding investment in advanced semiconductors for AI applications, shipments and orders for wafer-handling systems for advanced semiconductor packages used in AI applications drove performance. Shipments of batch encapsulation lines for microdisplays progressed, as did efforts to meet demand for parts, modifications and expansions in the LCD business. |
Items this document does not state (9)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.Investment in advanced semiconductors for AI applications continued to expand, driving shipments and orders for wafer-handling systems for advanced semiconductor packages used in AI applications. Shipments of batch encapsulation lines for microdisplays progressed, while the LCD business also made progress in shipments to meet demand for parts, modifications and expansions.