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Other Disclosures6167Fuji Die Co.,Ltd.Machinery

Participating in the Japan Society for Precision Engineering’s FY2026 Spring Conference: Exhibiting Ultra-Precision Molds for Data Centers and Presenting a Corporate Award

Fuji Die Co.,Ltd. participated in the Japan Society for Precision Engineering Spring Conference, exhibiting ultra-precision machined products and presenting a corporate award to a student, as well as giving a seminar presentation.

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Announced details

Molds for optical fiber arraysMolds for MT ferrulesUltra-precision machined productsElectroplated grinding wheels
Applicable field (uses covered by this announcement)

Next-generation optical communications for data centers and other applications

Launch date17 to 19 March 2026 (completed)
Relationship between the counterparty and the company
Fuji Die Co.,Ltd.6167
Relationship with the Company

Participation in the Japan Society for Precision Engineering Spring Conference, exhibitions, presentation of a corporate award, and a seminar presentation. Capital and personnel relationships: Not disclosed

CounterpartyThe Japan Society for Precision Engineering, Saitama University, The University of Tokyo

The Japan Society for Precision Engineering organized the conference. Saitama University provided the venue. The University of Tokyo is the university attended by the student who received the corporate award. Other details: Not disclosed

Award/certification name

FY2024 (8th) Japan Society for Precision Engineering Manufacturing Award: Grand Prize, Fuji Die Award

Awarding / certifying body

The Japan Society for Precision Engineering, Fuji Die Co.,Ltd.

In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.

Source (materials cited by the company)

The Japan Society for Precision Engineering

Announced details
ItemDetails
Names of Products / Services CoveredMolds for optical fiber arrays, Molds for MT ferrules, Ultra-precision machined products, Electroplated grinding wheels
CounterpartyThe Japan Society for Precision Engineering, Saitama University, The University of Tokyo
Counterparty overviewThe Japan Society for Precision Engineering organized the conference. Saitama University provided the venue. The University of Tokyo is the university attended by the student who received the corporate award. Other details: Not disclosed
Relationship with the CompanyParticipation in the Japan Society for Precision Engineering Spring Conference, exhibitions, presentation of a corporate award, and a seminar presentation. Capital and personnel relationships: Not disclosed
Launch date17 to 19 March 2026 (completed)
Applicable areaNext-generation optical communications for data centers and other applications
Award/certification nameFY2024 (8th) Japan Society for Precision Engineering Manufacturing Award: Grand Prize, Fuji Die Award
Awarding / certifying bodyThe Japan Society for Precision Engineering, Fuji Die Co.,Ltd.
SourceThe Japan Society for Precision Engineering
Items this document does not state (9)
Contract ValueOffering priceContract DateRegistration number and expiry dateLocationLocation scaleQuantitative EffectsUsage historyImpact on Business Performance

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The reasons the company gives

The company's own explanation, not something inferred from the numbers.

To contribute to society through manufacturing and promote interaction with educational and research institutions.

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Participating in the Japan Society for Precision Engineering’s FY2026 Spring Conference: Exhibiting Ultra-Precision Molds for Data Centers and Presenting a Corporate Award | Fuji Die Co.,Ltd. (6167) timely disclosure | Komori