Thinner, Higher-Performance Diamond Wire
First written in FY2016. 15 of 22 entries say "Advanced", first in FY2017-Q2. Latest entry: FY2026.
0 other companies' latest entry also says "Restated".
- FY2026RestatedAnnual report
「In the D-Next business, we are working on developing diamond wires for power semiconductor applications with finer wire diameters and improved performance, as well as developing PHX-01 to strengthen its market competitiveness.」
The policy of continuing to pursue finer wire diameters and improved performance for diamond wires for power semiconductor applications, and strengthening PHX-01's competitiveness, was reaffirmed. - FY2025AdvancedAnnual report
「In the D-Next business, we are working on developing diamond wires for power semiconductor applications with finer wire diameters and improved performance, as well as developing PHX-01 to strengthen its market competitiveness.」
For power semiconductor products, an application of the ultrafine wire technology, development to achieve finer wire diameters and improved performance, as well as development to strengthen PHX-01's competitiveness, is continuing. - FY2025-H1AdvancedAnnual report
「The number of companies formally adopting our diamond wire for power semiconductors and difficult-to-cut materials continues to increase, and mass-production adoption is progressing among major and mid-sized domestic companies. Customer share is also expanding, and sales volumes are increasing steadily.」
For products for power semiconductor and hard-to-cut-material applications, which are applications of the ultrafine diamond wire technology, increases were reported in the number of formal adopters, volume production adoption, customer share and sales volumes. - FY2024-Q3AdvancedAnnual report
「The number of companies formally adopting our diamond wires for semiconductor and hard-to-cut-material applications has been steadily increasing. During the cumulative third-quarter consolidated period, we made volume production sales to a total of 5 major customers with strong potential for sales expansion.」
For products for semiconductor and hard-to-cut-material applications, which are applications of the ultrafine diamond wire technology, progress was made to volume production sales to a total of 5 major customers. - FY2024-Q2AdvancedAnnual report
「The number of companies formally adopting our diamond wires for semiconductor and hard-to-cut-material applications has been steadily increasing. During the cumulative second-quarter consolidated period, we made volume production sales to a total of 4 major customers with strong potential for sales expansion.」
For products for semiconductor and hard-to-cut-material applications, which are applications of the ultrafine diamond wire technology, progress was made from an increase in formal adopters to volume production sales to 4 major customers. - FY2024-Q1AdvancedAnnual report
「In the D-Next business, diamond wire sales remained sluggish because operating rates at domestic contract wafer slicing companies declined as a result of inventory adjustments in the semiconductor sector. However, the number of companies formally adopting our diamond wires for semiconductor applications has been steadily increasing, and during the cumulative first-quarter consolidated period we began volume production sales to 1 new major domestic customer. We are also continuing business discussions with multiple companies regarding sales of diamond wire manufacturing equipment, mainly for the Indian market.」
Volume production sales of semiconductor-use diamond wire began for 1 new major domestic customer. Discussions with multiple companies regarding manufacturing equipment, mainly for the Indian market, are ongoing. Meanwhile, diamond wire sales remained sluggish because of the impact of inventory adjustments. - FY2023-Q3AdvancedAnnual report
「The number of companies formally adopting our semiconductor diamond wire has gradually increased, accompanied by higher sales volumes. Regarding sales of the new diamond wire manufacturing equipment, PHX-01, acceptance procedures for a sales project involving a Chinese diamond wire manufacturer were completed, and the consideration was recognized as revenue.」
For semiconductor-use products, an application of the ultrafine wire technology, the number of formal adopters and sales volumes increased, and progress was also reported on PHX-01, including completion of customer acceptance and recognition of the consideration as revenue. - FY2023-Q2AdvancedAnnual report
「The number of companies formally adopting our diamond wires for semiconductor applications has been steadily increasing, and sales volumes of the diamond wires have also risen accordingly. In connection with sales of the new diamond wire manufacturing equipment (PHX-01) to a Chinese diamond wire manufacturer, part of the consideration was recognized as revenue.」
For diamond wires for semiconductor applications, an application of the ultrafine wire technology, the number of formal adopters and sales volumes continued to increase. In addition, part of the consideration from the PHX-01 sales project was recognized as revenue. - FY2023-Q1AdvancedAnnual report
「The number of companies formally adopting our semiconductor diamond wire has gradually increased, accompanied by higher sales volumes of diamond wire.」
The number of companies formally adopting the semiconductor-use products being developed as an application of the ultrafine diamond wire technology, as well as sales volumes, increased. - FY2022-Q2AdvancedAnnual report
「We have begun selling semiconductor diamond wire to some customers and are providing samples to develop new customers.」
Concrete progress was reported for the semiconductor-use products being developed as an application of the ultrafine diamond wire technology, including the start of sales to certain customers and the provision of samples. - FY2022-Q1AdvancedAnnual report
「This was due in part to the decision by certain manufacturers of hard-to-cut materials to adopt the semiconductor-use diamond wire under development.」
Concrete progress was reported on the semiconductor-use diamond wire being developed as an application of the ultrafine wire technology, including the decision by a manufacturer of hard-to-cut materials to adopt it. - FY2021AdvancedAnnual report
「We are working on the development of diamond wires for semiconductor applications, as well as new diamond wire manufacturing equipment that leverages our experience and expertise in ultrafine diamond wire manufacturing technology.」
The development of semiconductor products and new manufacturing equipment has taken concrete shape as ongoing initiatives to apply the ultrafine diamond wire technology. - FY2021-Q1AdvancedAnnual report
「In addition, we will develop diamond wires for semiconductor applications using the remaining equipment, as well as new diamond wire manufacturing equipment that leverages our ultrafine diamond wire production technology, in an effort to secure stable revenue going forward.」
The development of semiconductor products and new manufacturing equipment was specifically identified as applications for the ultrafine diamond wire technology. - FY2020-Q3RestatedAnnual report
「Going forward, we will seek to secure stable earnings by establishing a new profit-generation model that leverages our ultrafine diamond wire production technology.」
The policy of leveraging ultrafine diamond wire technology to generate new revenue was reaffirmed. - FY2020-Q2RestatedAnnual report
「Going forward, we will proceed with relocating the production equipment to Jiangsu San超 and work to establish new revenue-generation schemes that leverage our ultrafine diamond wire production technology.」
The policy of leveraging the technological advantages of ultrafine diamond wires was reaffirmed as a new revenue-generation strategy following the sale of equipment and the licensing of technology. - FY2020-Q1RestatedAnnual report
「We will optimize our production structure by focusing on sales of ultrafine diamond wires of φ55μm or less, which have technological advantages, and concentrating our management resources at our main plant, the Izumi Plant (D-Next).」
The policy of prioritizing sales of ultrafine diamond wires of φ55μm or less was reaffirmed. - FY2019RaisedAnnual report
「In the electronic materials slicing-related business, our Group's core business, the challenging business environment continues. We will develop even finer diamond wires, such as φ45μm and φ40μm, while seeking to secure revenue through new revenue-generation schemes that leverage our diamond wire production technology.」
The technology target was raised from strengthening sales of ultrafine products of φ55μm or less to developing even finer products of φ45μm and φ40μm. - FY2019-Q3AdvancedAnnual report
「In our core Electronic Materials Slicing-Related Business, our group pursued various measures to restore profitability, including developing new customers among single-crystal wafer manufacturers, strengthening sales of ultrafine diamond wire of φ55µm or less, and reducing costs. These efforts produced some results, including expanded business with major single-crystal wafer manufacturers and a higher sales mix for ultrafine diamond wire.」
Sales efforts for ultrafine products of φ55µm or less were strengthened, resulting in concrete progress through a higher sales mix. However, overall profitability did not recover. - FY2019-Q2RaisedAnnual report
「Diamond wire diameters currently used to slice silicon wafers are φ65μm and φ60μm, but customers have strong demand for thinner wire. To differentiate ourselves from competing Chinese diamond wire manufacturers, we will actively sell φ55μm and φ50μm diamond wire, where our technological advantages can be demonstrated.」
The previous policy of making the wire thinner was advanced into a more specific sales strategy focused on actively selling products with the thinner diameters of φ55μm and φ50μm. - FY2017-Q3AdvancedAnnual report
「Profitability also deteriorated significantly, due not only to the decline in revenue but also to a ¥848 million inventory write-down on products using the previous specifications, following a specification change to improve diamond wire cutting performance.」
Product specifications were changed to improve cutting performance, resulting in an inventory write-down of ¥848 million on products using the previous specifications. This represented concrete progress in making the wire thinner and improving performance, but also had a financial impact through the write-down of inventory using the previous specifications. - FY2017-Q2AdvancedAnnual report
「At the same time, by further reducing diamond wire diameter, we will work to differentiate ourselves from other companies, including domestic Chinese manufacturers, and establish a system for the stable supply of high-value-added products.」
The company identified as an issue to address the need to link thinner wire with differentiation and the establishment of a system for the stable supply of high-value-added products. - FY2016First statedAnnual report
「For example, we shifted the diameter of diamond wire, for which 0.1 mm had been the mainstream, to 0.08 mm, and launched 0.07 mm products. We will continue working to further reduce wire diameter.」
Key themes for strengthening competitiveness include reducing kerf loss, increasing processing speed, extending service life and refining diamond abrasive grains.