Disco (6146) · InitiativeRestated
Development and sales of the KABRA wafer-slicing process for SiC wafers
First written in FY2023. 2 of 3 entries say "Restated". Latest entry: FY2025.
3entries
3years
0from disclosures
How it moved
Same theme, other companies
Development and sale of the KABRA laser processing process for SiC wafersA theme 1 companies write about · 0 as a headwind · 1 as a tailwind
No other company in this theme has enough history to compare yet.
Full recordFilings, disclosures and news, newest first
- FY2025RestatedAnnual report
「The Group has developed and sells the KABRA process, which significantly improves productivity in SiC wafer manufacturing, and will continue to meet growing demand for energy conservation.」
We continue to develop and sell the KABRA process, which is intended to improve productivity in SiC wafer manufacturing. - FY2024RestatedAnnual report
「The Group has developed and sells the KABRA process, which significantly improves productivity in SiC wafer manufacturing, and will continue to meet growing demand for energy conservation.」
We continue to develop and sell the KABRA process, which is intended to improve productivity in SiC wafer manufacturing. - FY2023First statedAnnual report
「The Group has developed and sells the KABRA process*, which significantly improves productivity in SiC wafer manufacturing, and will continue to meet growing demand for SiC. *」
The KABRA process, aimed at improving productivity in SiC wafer manufacturing, was described in specific terms for the first time as a development and sales initiative, positioning it as a response to demand for power semiconductors and SiC.