Announced details
The chip-making process (wafer dicing) for advanced semiconductors, including those used in generative AI
AAダイヤモンドテクノロジー株式会社 is a joint venture between Asahi Diamond Industrial Co.,Ltd. and TOKYO SEIMITSU CO.,LTD. Asahi Diamond Industrial Co.,Ltd. sells products developed by AAダイヤモンドテクノロジー株式会社.
AAダイヤモンドテクノロジー株式会社 is a joint venture between Asahi Diamond Industrial Co.,Ltd. and TOKYO SEIMITSU CO.,LTD. It has obtained ISO 9001 certification. No other information is provided in the main text. No information on TOKYO SEIMITSU CO.,LTD. is provided in the main text.
ISO9001
In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.
9 May 2025 release (Notice regarding the establishment of a joint venture)
| Item | Details |
|---|---|
| Names of Products / Services Covered | Hub Blade manufactured by AAダイヤモンドテクノロジー株式会社 (AA Diamond Hub Blade) |
| Counterparty | AAダイヤモンドテクノロジー株式会社, TOKYO SEIMITSU CO.,LTD. |
| Counterparty overview | AAダイヤモンドテクノロジー株式会社 is a joint venture between Asahi Diamond Industrial Co.,Ltd. and TOKYO SEIMITSU CO.,LTD. It has obtained ISO 9001 certification. No other information is provided in the main text. No information on TOKYO SEIMITSU CO.,LTD. is provided in the main text. |
| Relationship with the Company | AAダイヤモンドテクノロジー株式会社 is a joint venture between Asahi Diamond Industrial Co.,Ltd. and TOKYO SEIMITSU CO.,LTD. Asahi Diamond Industrial Co.,Ltd. sells products developed by AAダイヤモンドテクノロジー株式会社. |
| Launch date | 1 July 2026 (actual; sales have commenced) |
| Applicable area | The chip-making process (wafer dicing) for advanced semiconductors, including those used in generative AI |
| Award/certification name | ISO9001 |
| Source | 9 May 2025 release (Notice regarding the establishment of a joint venture) |
Items this document does not state (10)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The product is also used in the chip-making process, or wafer dicing, for advanced semiconductors, including those used in the rapidly growing generative AI sector.