Worth reading
54Recurring
Scored from 3 of 5 sectionsDirection
Improvement
Direction inferred from the company’s description.Scale
1066
¥ millionWording
Conditional
How definitive the wording is.Details of issuance or disposal
Issuance of new shares by third-party allotment
Specific use of funds
Capital expenditures for constructing a new technology development building and renovating the showroom related to semiconductor manufacturing equipment and machine toolsAmount ¥1,731 million / Scheduled timing of expenditures August 2024 to March 2027
Research and development investment for developing new next-generation modelsAmount ¥1,500 million / Scheduled timing of expenditures August 2024 to March 2026 (allocated)
Construction of an automated warehouse building to continuously provide high value-added products and services related to semiconductor manufacturing equipment and machine toolsAmount ¥1,606 million / Scheduled timing of expenditures June 2024 to February 2026 (allocated)
Equipment upgrades and new capital investment at 大和工機株式会社 to increase production capacity for semiconductor manufacturing equipment
Capital expenditures and renovation costs for enhancing the laboratory functions of the technology development building in ① and utilizing it as a base for the human resources strategyAmount ¥800 million / Scheduled timing of expenditures July 2026 to March 2028
Establishment of a demonstration facility in TaiwanAmount ¥550 million / Scheduled timing of expenditures August 2026 to December 2029
Research and development investment in new processing equipment for next-generation semiconductor materials for semiconductor-related equipmentAmount ¥400 million / Scheduled timing of expenditures August 2026 to December 2029
Research and development investment in large-scale processing equipment for PLPAmount ¥1,066 million / Scheduled timing of expenditures October 2026 to September 2030
Use of funds based on the future business environment and the Group's growth strategy (details undetermined)Amount ¥1,953 million / Scheduled timing of expenditures To be determined
Most recent equity financing
Issuance of new shares through a third-party allotment dated 22 May 2024 (issue amount: Not disclosed)
Impact on Business Performance
The Company expects the impact on current-period results from the changes to the amounts and scheduled expenditure periods for the use of proceeds to be immaterial
| Item | Details |
|---|---|
| Type of issuance or disposal | Issuance of new shares by third-party allotment |
| Specific use of funds | Details Capital expenditures for constructing a new technology development building and renovating the showroom related to semiconductor manufacturing equipment and machine tools / Amount ¥1,731 million / Scheduled timing of expenditures August 2024 to March 2027, Details Research and development investment for developing new next-generation models / Amount ¥1,500 million / Scheduled timing of expenditures August 2024 to March 2026 (allocated), Details Construction of an automated warehouse building to continuously provide high value-added products and services related to semiconductor manufacturing equipment and machine tools / Amount ¥1,606 million / Scheduled timing of expenditures June 2024 to February 2026 (allocated), Details Equipment upgrades and new capital investment at 大和工機株式会社 to increase production capacity for semiconductor manufacturing equipment / Amount Not disclosed / Scheduled timing of expenditures Not disclosed, Details Capital expenditures and renovation costs for enhancing the laboratory functions of the technology development building in ① and utilizing it as a base for the human resources strategy / Amount ¥800 million / Scheduled timing of expenditures July 2026 to March 2028, Details Establishment of a demonstration facility in Taiwan / Amount ¥550 million / Scheduled timing of expenditures August 2026 to December 2029, Details Research and development investment in new processing equipment for next-generation semiconductor materials for semiconductor-related equipment / Amount ¥400 million / Scheduled timing of expenditures August 2026 to December 2029, Details Research and development investment in large-scale processing equipment for PLP / Amount ¥1,066 million / Scheduled timing of expenditures October 2026 to September 2030, Details Use of funds based on the future business environment and the Group's growth strategy (details undetermined) / Amount ¥1,953 million / Scheduled timing of expenditures To be determined |
| Most recent equity financing | Issuance of new shares through a third-party allotment dated 22 May 2024 (issue amount: Not disclosed) |
| Impact on Business Performance | The Company expects the impact on current-period results from the changes to the amounts and scheduled expenditure periods for the use of proceeds to be immaterial |
Items this document does not state (24)
Number of shares to be issued or disposed ofIssue price and disposal priceTotal issue valueAmount of funds to be raisedEstimated issuance expensesPayment dateIntended allotteeIntended allottee's holding policyDilution RateTotal number of issued sharesBasis for determining the amount to be paidExercise priceExercise periodNumber of Stock Acquisition RightsTransfer restriction periodConditions for lifting transfer restrictionsReason for acquisition without considerationCategories and Number of Persons CoveredTotal Stock-Based CompensationUnderwriter / lead underwriterOverallotmentStock Split RatioProcedures under the Corporate Code of ConductMajor shareholders after the offering
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To strengthen the company’s ability to address the PLP market and drive the medium- to long-term growth of its semiconductor-related equipment business. The company plans to develop processing equipment capable of handling large substrates, expand its product lineup, strengthen its competitiveness, acquire new customers and expand its customer base.
How to read this page
This is not the documentKomori reads the disclosure the company filed and writes this summary. Figures are as stated by the company and are not audited.
Weight is not a verdictIt measures how much this changes what the company had already told the market. It is not a view on the shares.
Corrections happenIf the company reissues this disclosure, the page is rebuilt from the corrected version and the revision number moves up.