Development of Thick-Film Conductive Ink for Printed Electronics
First written in FY2024-Q3. 1 of 2 entries say "Advanced", first in FY2025. Latest entry: FY2025.
1 other company's latest entry also says "Advanced".
- FY2025AdvancedAnnual report
「本微粒銅粉はアジア最大の展示会であるネプコンジャパン（第39回）に出展いたしました。」
プリンテッドエレクトロニクス向け厚膜導電性インクと微粒銅粉について、前年度の開発・展示から、翌年度にはネプコンジャパンへの出展に進んだ。 - FY2024-Q3First statedAnnual report
「In the materials segment, we developed thick-film conductive ink jointly with the National Institute for Materials Science (NIMS), Prewavs Co., Ltd., a NIMS-originated startup, and N.E. CHEMCAT CORPORATION for printed electronics, which uses printing technology to form electronic circuits and sensors on substrates such as films. The ink contains fine copper powder under development at the Niihama Research Institute to achieve the film-thickness control and low-temperature sinterability required for printed electronics. It was exhibited at the Electronics Manufacturing and Mounting Exhibition held in January 2024. We will expand applications and improve performance through dialogue with customers.」
The company jointly developed thick-film conductive ink with NIMS, Prewavs and N.E. CHEMCAT and exhibited it in January 2024. Future initiatives include expanding applications and improving performance through customer dialogue.