Announced details
Semiconductor manufacturing equipment; production of metal 3D printer products
Printable weight is expected to increase by approximately 4 times
Kawasaki, Kanagawa Prefecture (head office location; no specific equipment installation location disclosed)
Product cost reductions and shorter lead times are expected
The company does not address Contract Value / Offering price.
| Item | Details |
|---|---|
| Names of Products / Services Covered | Powder bed metal 3D printers; metal 3D printer products |
| Launch date | Scheduled to begin operation in April 2026; full-scale operation scheduled from October 2026 |
| Applicable area | Semiconductor manufacturing equipment; production of metal 3D printer products |
| Location | Kawasaki, Kanagawa Prefecture (head office location; no specific equipment installation location disclosed) |
| Location scale | 2 units measuring 260 mm × 260 mm × 290 mm and 1 unit measuring 450 mm × 450 mm × 500 mm, for a total of 3 units |
| Quantitative Effects | Printable weight is expected to increase by approximately 4 times |
| Impact on Business Performance | Product cost reductions and shorter lead times are expected |
Items this document does not state (11)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To support large-format printing that was difficult with the existing machines, including applications for semiconductor manufacturing equipment compatible with 12-inch silicon wafers, increase printing speed, reduce product costs and lead times, and address the shortage of skilled technicians and customers' demand for higher quality.