Komori
Other Disclosures5381Mipox CorporationConstruction and Materials

Notice of Full-Scale Entry into Contract Processing of 12-Inch Semiconductor Wafers and Completion of CMP Line Construction

Mipox has constructed a CMP contract processing line capable of handling 12-inch (300 mm) wafers at its Kanuma facility and has commenced full-scale operations. In addition to its proprietary process using internally developed slurry, the company also offers contract polishing of 12-inch SiC wafers and aims to provide an integrated service covering bonding processes in the future.

Worth reading
52Recurring
0–100. This measures how worthwhile something is to read, not how good or bad the company is.
Direction
Improvement
Direction inferred from the company’s description.
Scale
300
mm(12インチウェーハ)
Wording
Conditional
How definitive the wording is.

Announced details

12インチ(300mm)ウェーハ対応CMP受託加工12インチSiCウェーハ受託研磨トータルファンドリーサービス
Applicable field (uses covered by this announcement)
生成AI向け半導体EV用パワー半導体Power DevicesCu(銅)ダマシン接合前工程3次元実装
Launch date2026年3月12日(本格稼働開始の実績として記載)
Location (as indicated in this announcement)

栃木県鹿沼市(鹿沼事業所)

Impact on Business Performance

The impact on consolidated results for the fiscal year ending March 2026 is minor. The impact from the following fiscal year onward is under review.

The company does not address Contract Value / Offering price.

Announced details
ItemDetails
Names of Products / Services Covered12インチ(300mm)ウェーハ対応CMP受託加工, 12インチSiCウェーハ受託研磨, トータルファンドリーサービス
Launch date2026年3月12日(本格稼働開始の実績として記載)
Applicable area生成AI向け半導体, EV用パワー半導体, Power Devices, Cu(銅)ダマシン, 接合前工程, 3次元実装
Location栃木県鹿沼市(鹿沼事業所)
Impact on Business PerformanceThe impact on consolidated results for the fiscal year ending March 2026 is minor. The impact from the following fiscal year onward is under review.
Items this document does not state (13)
CounterpartyCounterparty overviewRelationship with the CompanyContract ValueOffering priceContract DateAward/certification nameAwarding / certifying bodyRegistration number and expiry dateLocation scaleQuantitative EffectsUsage historySource

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

GPUをはじめとする生成AI向け半導体の高集積化、EV用パワー半導体向けウェーハの大口径化、市場ニーズおよび顧客ニーズの高まりに対応するため。

How to read this page

This is not the documentKomori reads the disclosure the company filed and writes this summary. Figures are as stated by the company and are not audited.
Weight is not a verdictIt measures how much this changes what the company had already told the market. It is not a view on the shares.
Corrections happenIf the company reissues this disclosure, the page is rebuilt from the corrected version and the revision number moves up.
Notice of Full-Scale Entry into Contract Processing of 12-Inch Semiconductor Wafers and Completion of CMP Line Construction | Mipox Corporation (5381) timely disclosure | Komori