Komori
Ngk (5333) · RiskWorsened

Reduced capital investment by electronics and electronic materials manufacturers and intensifying competition in heating products

First written in FY2020-Q2. 5 of 9 entries say "Restated". Latest entry: FY2026-H1.

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ProgressHeldSoftenedWorseWorsenedFY2020 – FY2023RestatedFY2024-Q1 – FY20242019: 12020: 220202021: 020212022: 020222023: 320232024: 220242025: 12025
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  1. FY2026-H1WorsenedAnnual report

    「In the Digital Society business, shipments of products for semiconductor manufacturing equipment increased due to inventory build-ups by some customers, despite delays in plans to build new advanced foundry plants.」

    Although shipments of products for semiconductor manufacturing equipment increased, the retreat from plans to build new advanced foundry plants was identified as a new factor restraining capital investment.
  2. FY2024RestatedAnnual report

    「In the Digital Society Business, shipments of products for semiconductor manufacturing equipment and piezoelectric microactuators for hard disk drives (HDDs) and other products declined due to reduced semiconductor and data center investment. Despite the positive impact of yen depreciation, revenue declined.」

    The risk of lower demand due to reduced capital investment related to semiconductors and electronic components has continued to manifest as lower full-year revenue and operating profit.
  3. FY2024-Q3RestatedAnnual report

    「In the Digital Society business, semiconductor and data center investment continued to stagnate, resulting in lower shipments of products for semiconductor manufacturing equipment and electronic components.」

    Stagnant semiconductor and data center investment, together with the resulting decline in shipments of related products, continued in the cumulative third quarter.
  4. FY2024-Q2RestatedAnnual report

    「In the Digital Society business, shipments of products for semiconductor manufacturing equipment and electronic components decreased as semiconductor and data center investment stagnated.」

    Stagnant semiconductor and data center investment, together with the resulting decline in shipments of products for semiconductor manufacturing equipment and electronic components, continued in the first half.
  5. FY2024-Q1RestatedAnnual report

    「In the Digital Society business, shipments of products for semiconductor manufacturing equipment and electronic components decreased as semiconductor and data center investment stagnated.」

    The materialization of the risks of stagnant semiconductor-related investment and lower shipments of electronic components and other products has continued.
  6. FY2023WorsenedAnnual report

    「In the Digital Society business, shipments of products for semiconductor manufacturing equipment and electronic components, including piezoelectric microactuators for hard disk drives (HDDs), decreased due to declines in semiconductor and data center investment, among other factors.」

    The decline in semiconductor and data center investment has materialized as lower full-year shipments of electronic components and other products.
  7. FY2020WorsenedAnnual report

    「Revenue declined for industrial equipment-related products as demand for sintering furnaces used to manufacture cathode materials for automotive lithium-ion batteries and other products decreased.」

    In addition to reduced capital investment by electronics and electronic materials manufacturers and intensifying competition in sintering furnaces, lower demand for sintering furnaces used for cathode materials in automotive lithium-ion batteries and other products has been reflected in lower full-year revenue.
  8. FY2020-Q3RestatedAnnual report

    「Although capital investment by semiconductor manufacturers was showing signs of recovery, volumes of products for semiconductor manufacturing equipment declined year on year in the Process Technology business. Sales of heating products also decreased owing to restrained capital investment by electronics and electronic materials manufacturers and intensifying competition in kilns for lithium-ion battery cathode materials.」

    Reduced capital investment by electronics and electronic materials manufacturers and intensifying competition among sintering furnaces for lithium-ion battery cathode materials have continued, resulting in lower sales of heating products.
  9. FY2020-Q2First statedAnnual report

    「In the Process Technology Business, volumes of products for semiconductor manufacturing equipment declined against a backdrop of reduced capital investment by semiconductor manufacturers. Sales of heating products also declined due to reduced capital investment by electronics and electronic materials manufacturers and intensifying competition among sintering furnaces for lithium-ion battery cathode materials.」

    Reduced capital investment by electronics and electronic materials manufacturers and intensifying competition among sintering furnaces for lithium-ion battery cathode materials have materialized as lower sales of heating products.
Moved together

"Profit allocation with a medium-term target of a consolidated dividend payout ratio of approximately 30%" moved the same way as this thread, in the same document, in 2 of its 9 moves.

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  1. ★This thread
  2. 1Profit allocation with a medium-term target of a consolidated dividend payout ratio of approximately 30%2×
  3. 2Foreign exchange, interest rates and raw material prices2×
  4. 3Demand fluctuations caused by economic conditions in Japan and overseas2×
  5. 4Higher demand for ceramic products used in semiconductor manufacturing equipment2×
  6. 5Improving earnings power and capital efficiency with a medium- to long-term focus on ROE of 10% or higher2×

★ is this thread; numbers match the list above. The number on a line is how many documents both moved the same way in; lines between the other threads count the documents they moved together in too. Threads that move together often sit closer.

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