Sales composition by end use
First written in FY2018-Q1. . Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026Full-year sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥8,680 million, an increase of 52.1% year on year. Sales of connectors and microswitches were ¥2,599 million, an increase of 40.6% year on year. Sales of lead frames were ¥6,424 million, an increase of 35.5% year on year.」
Sales increased year on year across all major applications for the full year, with printed circuit boards and semiconductor package substrates the largest application at ¥8,680 million. - FY2026-H1Update: interim-period sales by applicationAnnual report
「The breakdown of sales by application was: ¥3,806 million for printed circuit boards and semiconductor package substrates, ¥1,057 million for connectors and microswitches, ¥2,487 million for lead frames, and ¥184 million for Other.」
Updated interim-period sales by application. Printed circuit boards and semiconductor package substrates were the largest application at ¥3,806 million. - FY2025Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥5,708 million, an increase of 22.3% year on year. Sales of connectors and microswitches were ¥1,848 million, a decrease of 14.7% year on year. Sales of lead frames were ¥4,740 million, an increase of 9.6% year on year.」
For the full year, sales of printed circuit boards and semiconductor package substrates and of lead frames increased, while sales of connectors decreased. - FY2025-H1Update: interim-period sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,965 million for printed circuit boards and semiconductor package substrates, ¥969 million for connectors and microswitches, ¥2,265 million for lead frames, and ¥129 million for Other.」
Year on year, sales of printed circuit boards and semiconductor package substrates increased, while sales of connectors and microswitches, lead frames, and Other decreased. Lead frames remained the largest application at ¥2,265 million. - FY2024Full-year sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥4,668 million, an increase of 0.7% year on year. Sales of connectors and microswitches were ¥2,166 million, a decrease of 31.6% year on year. Sales of lead frames were ¥4,327 million, a decrease of 47.6% year on year. Sales of Other were ¥257 million, an increase of 35.7% year on year.」
For the full year, sales of printed circuit boards and semiconductor package substrates increased slightly, sales of connectors and lead frames decreased substantially, and sales of Other increased. - FY2024-Q3Update: cumulative third-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥3,393 million for printed circuit boards and semiconductor package substrates, ¥1,746 million for connectors and microswitches, ¥3,339 million for lead frames, and ¥242 million for Other.」
Updated sales by application for the cumulative third quarter. Sales of printed circuit boards and semiconductor package substrates were ¥3,393 million, and sales of lead frames were ¥3,339 million. - FY2024-Q2Update: cumulative second-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,271 million for printed circuit boards and semiconductor package substrates, ¥1,221 million for connectors and microswitches, ¥2,346 million for lead frames, and ¥202 million for Other.」
Updated sales by application for the cumulative second quarter. Lead frames were the largest application at ¥2,346 million, but decreased from ¥4,657 million in the same period of the previous year. - FY2024-Q1Update: first-quarter sales by applicationAnnual report
「Application Sales (¥ thousand) Printed circuit boards and semiconductor package substrates 837,816 Connectors and microswitches 614,601 Lead frames 1,285,998 Other 104,821 Total 2,843,237」
In the cumulative first quarter, lead frames were the largest application at ¥1,285,998 thousand, although sales decreased year on year across all major applications. - FY2023Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥4,637 million, a decrease of 22.4% year on year. Sales of connectors and microswitches were ¥3,165 million, an increase of 6.1% year on year. Sales of lead frames were ¥8,261 million, a decrease of 14.1% year on year.」
Updated full-year sales by application. Lead frames remained the largest application, while sales of printed circuit boards and semiconductor package substrates and of lead frames decreased, and sales of connectors increased. - FY2023-Q3Update: cumulative third-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥3,771 million for printed circuit boards and semiconductor package substrates, ¥2,506 million for connectors and microswitches, ¥6,752 million for lead frames, and ¥116 million for Other.」
Updated sales by application for the cumulative third quarter. Lead frames were the largest application at ¥6,752 million, but decreased from ¥7,237 million in the same period of the previous year. - FY2023-Q2Update: cumulative second-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,553 million for printed circuit boards and semiconductor package substrates, ¥1,761 million for connectors and microswitches, ¥4,657 million for lead frames, and ¥81 million for Other.」
Updated sales by application for the cumulative second quarter. Lead frames remained the largest application at ¥4,657 million, but decreased from ¥5,135 million in the same period of the previous year, while connectors and microswitches increased to ¥1,761 million. - FY2023-Q1First-quarter sales by end use updatedAnnual report
「The breakdown of sales by application was: ¥1,439 million for printed circuit boards and semiconductor package substrates, ¥1,038 million for connectors and microswitches, ¥2,533 million for lead frames, and ¥38 million for Other.」
Updated sales by application for the cumulative first quarter. Lead frames were the largest application at ¥2,533 million. - FY2022Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥5,978 million, an increase of 0.6% year on year. Sales of connectors and microswitches were ¥2,983 million, an increase of 5.8% year on year. Sales of lead frames were ¥9,617 million, an increase of 24.7% year on year.」
Updated full-year sales by application. Lead frames were the largest application at ¥9,617 million, an increase of 24.7% year on year. - FY2022-Q3Update: third-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥4,683 million for printed circuit boards and semiconductor package substrates, ¥2,251 million for connectors and microswitches, ¥7,237 million for lead frames, and ¥105 million for Other.」
Updated cumulative third-quarter sales by application. Lead frames were the largest application at ¥7,237 million. - FY2022-Q2Update: cumulative second-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥3,022 million for printed circuit boards and semiconductor package substrates, ¥1,477 million for connectors and microswitches, ¥5,135 million for lead frames, and ¥76 million for Other.」
Updated sales by application for the cumulative second quarter. Lead frames were the largest application at ¥5,135 million. - FY2022-Q1First-quarter sales by end use updatedAnnual report
「The breakdown of sales by application was: ¥1,509 million for printed circuit boards and semiconductor package substrates, ¥805 million for connectors and microswitches, ¥2,751 million for lead frames, and ¥42 million for Other.」
Updated sales by application for the cumulative first quarter. Lead frames were the largest application at ¥2,751 million. - FY2021Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥5,945 million, an increase of 29.1% year on year. Sales of connectors and microswitches were ¥2,819 million, an increase of 14.5% year on year. Sales of lead frames were ¥7,713 million, an increase of 37.2% year on year. Sales of Other, including watch decoration, were ¥144 million, a decrease of 48.4% year on year.」
Updated full-year sales by application. Lead frames were the largest application at ¥7,713 million, while sales of Other decreased 48.4% year on year. - FY2021-Q3Update: third-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥4,314 million for printed circuit boards and semiconductor package substrates, ¥2,130 million for connectors and microswitches, ¥5,617 million for lead frames, and ¥141 million for Other.」
Updated sales by application for the cumulative third quarter. Lead frames were the largest application at ¥5,617 million. - FY2021-Q2Update: second-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,751 million for printed circuit boards and semiconductor package substrates, ¥1,374 million for connectors and microswitches, ¥3,494 million for lead frames, and ¥100 million for Other.」
Updated sales by application for the cumulative second quarter. Lead frames were the largest application at ¥3,494 million. - FY2021-Q1First-quarter sales by end use updatedAnnual report
「The breakdown of sales by application was: ¥1,492 million for printed circuit boards and semiconductor package substrates, ¥638 million for connectors and microswitches, ¥1,703 million for lead frames, and ¥57 million for Other.」
Updated first-quarter sales by application. Lead frames were the largest application at ¥1,703 million. - FY2020Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥4,606 million, an increase of 25.9% year on year. Sales of connectors and microswitches were ¥2,463 million, an increase of 25.1% year on year. Sales of lead frames were ¥5,621 million, an increase of 24.7% year on year. Sales of Other, including watch decoration, were ¥279 million, an increase of 14.5% year on year.」
Updated full-year sales by application. Lead frames were the largest application at ¥5,621 million, and sales increased year on year in all 4 applications. - FY2020-Q3Update: third-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥3,394 million for printed circuit boards and semiconductor package substrates, ¥1,741 million for connectors and microswitches, ¥4,077 million for lead frames, and ¥198 million for Other.」
Updated sales by application for the cumulative third quarter. Lead frames were the largest application at ¥4,077 million. - FY2020-Q2Update: second-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,158 million for printed circuit boards and semiconductor package substrates, ¥1,094 million for connectors and microswitches, ¥2,500 million for lead frames, and ¥103 million for Other.」
Updated sales by application for the cumulative second quarter. Lead frames were the largest application at ¥2,500 million. - FY2020-Q1First-quarter sales by end use updatedAnnual report
「The breakdown of sales by application was: ¥987 million for printed circuit boards and semiconductor package substrates, ¥537 million for connectors and microswitches, ¥1,161 million for lead frames, and ¥42 million for Other.」
Updated first-quarter sales by application. Lead frames were the largest application at ¥1,161 million. - FY2019Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor package substrates were ¥3,660 million, an increase of 10.4% year on year. Sales of connectors and microswitches were ¥1,968 million, an increase of 1.0% year on year. Sales of lead frames were ¥4,508 million, a decrease of 5.6% year on year. Sales of Other were ¥243 million, a decrease of 61.3% year on year.」
Updated full-year sales by application. Sales of printed circuit boards and semiconductor package substrates and of connectors and microswitches increased, while sales of lead frames, the largest application, decreased to ¥4,508 million. - FY2019-Q3Update: third-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,971 million for printed circuit boards and semiconductor package substrates, ¥1,450 million for connectors and microswitches, ¥3,464 million for lead frames, and ¥164 million for Other.」
Updated sales by application for the cumulative third quarter. Lead frames were the largest application at ¥3,464 million. - FY2019-Q2Update: second-quarter sales by applicationAnnual report
「The breakdown of sales by application was: ¥2,005 million for printed circuit boards and semiconductor package substrates, ¥960 million for connectors and microswitches, ¥2,419 million for lead frames, and ¥113 million for Other.」
Updated sales by application for the cumulative second quarter. Lead frames were the largest application at ¥2,419 million. - FY2019-Q1First-quarter sales by end use updatedAnnual report
「The breakdown of net sales by end-use category was ¥1,084 million for printed circuit boards and semiconductor mounting boards, ¥520 million for connectors and micro switches, ¥1,261 million for lead frames, and ¥59 million for Other.」
First-quarter sales by end use were updated, with lead frames the largest category at ¥1,261 million. - FY2018Annual sales by end use updatedAnnual report
「Sales of printed circuit boards and semiconductor mounting boards were ¥3,316 million, an 18.9% increase year on year. Sales of connectors and micro switches were ¥1,949 million, a 30.2% increase year on year. Sales of lead frames were ¥4,773 million, a 42.2% increase year on year. Sales in Other were ¥629 million, a 7.7% increase year on year.」
Full-year sales by end use were updated. Lead frames were the largest category at ¥4,773 million, up 42.2% year on year. - FY2018-Q3Sales by end use updatedAnnual report
「The breakdown of net sales by end-use category was ¥2,420 million for printed circuit boards and semiconductor mounting boards, ¥1,457 million for connectors and micro switches, ¥3,497 million for lead frames, and ¥490 million for Other.」
Sales by end use for the cumulative third-quarter period were updated, with lead frames the largest category at ¥3,497 million. - FY2018-Q2Sales by end use updatedAnnual report
「The breakdown of net sales by end-use category was ¥1,525 million for printed circuit boards and semiconductor mounting boards, ¥976 million for connectors and micro switches, ¥2,145 million for lead frames, and ¥383 million for Other.」
Sales by end use for the cumulative second-quarter period were updated, with lead frames the largest category at ¥2,145 million. - FY2018-Q1First statedAnnual report
「The breakdown of net sales by end-use category was ¥683 million for printed circuit boards and semiconductor mounting boards, ¥451 million for connectors and micro switches, ¥1,051 million for lead frames, and ¥173 million for Other.」
For the first quarter, sales by end use can be extracted for the first time as standalone business composition data. Lead frames were the largest end-use category at ¥1,051 million.