Improving the Cost Ratio in the Plating Business
First written in FY2018. 5 of 9 entries say "Advanced", first in FY2025-H1. Latest entry: FY2026.
95 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「Sales and segment profit both exceeded the previous consolidated fiscal year, reflecting firm demand for plating for electronic circuit boards and efforts to reduce costs and improve yield. As a result, sales for the current consolidated fiscal year were ¥4,838 million, up 13.8% from the previous consolidated fiscal year, and segment profit was ¥168 million, compared with a segment loss of ¥47 million in the previous consolidated fiscal year.」
The Group continued to reduce costs and improve yield, turning the plating business segment result from a ¥47 million loss into a ¥168 million profit. - FY2026-H1AdvancedAnnual report
「In addition to increased demand for plating for electronic circuit boards compared with the same period of the previous year, the company worked to reduce costs and improve yields. As a result, both revenue and segment profit exceeded the previous year's levels. Revenue for the six months ended the interim period was ¥2,305 million, up 12.6% year on year, and segment profit was ¥90 million, compared with a segment loss of ¥52 million in the same period of the previous year.」
The Group implemented cost reductions and yield improvements, turning the plating business segment result from a ¥52 million loss into a ¥90 million profit. - FY2025AdvancedAnnual report
「Demand for plating for automotive components remained weak, and revenue fell below the previous consolidated fiscal year. However, the segment loss improved from the previous consolidated fiscal year as the company worked to reduce costs and improve yields. As a result, revenue for the fiscal year was ¥4,250 million, down 1.1% year on year, and the segment posted a loss of ¥47 million, compared with a segment loss of ¥346 million in the previous consolidated fiscal year.」
The Group implemented cost reductions and yield improvements in the plating business, reducing the segment loss from ¥346 million to ¥47 million. - FY2025-H1AdvancedAnnual report
「Although demand for plating automotive parts remained weak, demand for plating electronic circuit boards increased, and efforts to reduce costs and improve yield resulted in revenue exceeding the previous year and an improved segment loss. As a result, revenue for the six months ended the interim period was ¥2,047 million, up 1.3% year on year, and the segment loss was ¥52 million, compared with a segment loss of ¥194 million in the same period of the previous year.」
The Group implemented cost reductions and yield improvements at its plating production sites, reducing the segment loss from ¥194 million to ¥52 million. - FY2022RestatedAnnual report
「To improve the cost ratio, the Group shares issues among its plating production sites within the Group and is working on measures to improve quality and production processes.」
The Group continues to improve the cost ratio by sharing issues among plating production sites, improving quality and improving production processes. - FY2021RestatedAnnual report
「To improve the cost ratio, the Group shares issues among its plating production sites within the Group and is working on measures to improve quality and production processes.」
The Group continues to share issues among its production sites, improve quality and improve production processes to improve the cost ratio of the plating business. - FY2018First statedAnnual report
「The Group is working to update production equipment and improve production processes in order to improve the cost ratio.」
For the first time, the Group explicitly states measures to update production equipment and improve production processes in response to losses in the plating business.