Items stated in the management plan
| Item | Details |
|---|---|
| Plan name | Capital Investment in Low-Dielectric Resin Materials Facilities |
| Plan period | Fiscal year 2028 onward (operations scheduled to commence; final year not stated) |
| Total investment plan | Approximately 100 |
| Plan assumptions | Demand for low-dielectric resin materials is expected to continue growing steadily as the markets for data centers and high-speed communications infrastructure expand |
| Date of board resolution | 30 September 2026 |
| Publication date | 30 September 2026 |
Items this document does not state (19)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To capture growing demand for low-dielectric resin materials as the markets for data centers and high-speed communications infrastructure expand, and to increase production capacity. To ensure a stable supply to customers and further strengthen the supply structure from a business continuity planning (BCP) perspective.