Application of Core Technologies and Development of New Products Addressing Customer Needs
First written in FY2016. 11 of 20 entries say "Advanced", first in FY2018. Latest entry: 2026-10-30.
3 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「Alongside developing products that meet customer performance requirements for achieving miniaturization of next-generation semiconductors at the 1.8nm technology node and beyond, we are advancing the development of multiple new products with improved productivity, and have obtained favorable results in customer evaluations.」
Customer evaluations of multiple products combining particle control and improved productivity are progressing favorably for next-generation semiconductors at the 1.8nm node and beyond. - FY2026-H1RestatedAnnual report
「In research and development, we are also creating new high-performance products based on our technological capabilities and expanding into a range of business fields.」
We continue to create high-performance products based on our technological capabilities and expand into a range of fields, but no new milestones, such as adoption of individual products, have been indicated. - FY2025AdvancedAnnual report
「We plan to establish a new integrated research and development base combining our businesses, with operations targeted to begin in fiscal 2028. By consolidating the research and development functions of both businesses, we aim to leverage the resulting synergies to create new businesses and strengthen existing businesses.」
A new base consolidating the research and development functions of both businesses has now been specifically planned, with operations targeted to begin in fiscal 2028. - FY2025-H1Research and development expenditure updatedAnnual report
「The total research and development expenses of the group for the current interim consolidated accounting period were ¥451 million.」
Research and development expenses for the first half of fiscal 2024 were reported at ¥451 million. No material changes in research and development activities were reported. - FY2024AdvancedAnnual report
「In the field of ultra-high-purity colloidal silica products for polishing slurries used in next-generation semiconductors at the 2nm technology node and beyond, we continue to focus on advancing technologies for more precise control of particle size, shape, surface condition, and the number of coarse particles. Development of new products aligned with customer needs is progressing and has led to adoption.」
It was explained that particle-control technology has been enhanced for next-generation semiconductors at the 2nm node and beyond, and that new-product development has led to adoption. - FY2024-Q3Research and development expenditure updatedAnnual report
「The total research and development expenses of the group for the cumulative third quarter of the current consolidated fiscal year were ¥626 million.」
Research and development expenses for the cumulative third-quarter period were reported at ¥626 million. No material changes in research and development activities were reported. - FY2024-Q2Research and development expenditure updatedAnnual report
「The total research and development expenses of the group for the cumulative second quarter of the current consolidated fiscal year were ¥413 million.」
Research and development expenses for the cumulative second quarter were reported at ¥413 million. No material changes in research and development activities were reported. - FY2023AdvancedAnnual report
「In July 2022, we opened a new research base in Kobe and relocated there from the Kyoto Plant. While advancing research and development to address semiconductor miniaturization, we are also planning applications in new fields by leveraging the location and surrounding environment.」
The Kobe Research Institute was opened, establishing a two-site research structure with the Tokyo Research Institute to develop a research base for semiconductor miniaturization and new applications. - FY2023-Q3Research and development expenditure updatedAnnual report
「The total research and development expenses of the group for the cumulative third quarter of the current consolidated fiscal year were ¥626 million.」
Research and development expenses for the cumulative third-quarter period were reported at ¥626 million. No material changes in research and development activities were reported. - FY2023-Q2Research and development expenditure updatedAnnual report
「The total research and development expenses of the group for the cumulative second quarter of the current consolidated fiscal year were ¥343 million.」
Research and development expenses for the first half were reported at ¥343 million. Meanwhile, no material changes in research and development activities were reported. - FY2023-Q1RestatedAnnual report
「We advanced initiatives to strengthen our research and development structure, including promoting new product development and expanding research facilities.」
Research and development capabilities continue to be strengthened, including the expansion of research facilities, but no new specific progress, such as the scale-up of new-concept products, has been indicated. - FY2022AdvancedAnnual report
「In addition, we have begun developing ultra-high-purity colloidal silica incorporating a new concept, and scale-up is already under way following sample work for some customers. In this way, initiatives for the latest generation featuring single-digit-nanometer to angstrom-level line widths are progressing steadily.」
The new-concept product has advanced to the scale-up stage following sample work, and development for the latest generation is progressing. - FY2022-Q2RestatedAnnual report
「Adoption of our ultra-high-purity colloidal silica products has increased as semiconductor miniaturization has progressed, and sales remained firm despite the impact on exports from global shipping disruptions.」
We have confirmed increased adoption and firm sales of ultra-high-purity colloidal silica, but no new specific milestones for new-product development have been indicated. - FY2021AdvancedAnnual report
「In addition, we have begun developing colloidal silica incorporating a new concept and started sample work for some customers, advancing initiatives for the latest generation featuring single-digit-nanometer to angstrom-level line widths.」
Sample work for some customers has begun for new-concept colloidal silica, and preparations are advancing for generations with line widths ranging from single-digit nanometers to angstroms. - FY2020AdvancedAnnual report
「We have begun developing colloidal silica incorporating a new concept and started sample work for some customers, advancing initiatives for the latest generation featuring single-digit-nanometer to angstrom-level line widths.」
Development of new-concept products for the latest generation has begun, and sample work for some customers has started. - FY2019AdvancedAnnual report
「The new facilities equipped with state-of-the-art machinery have been completed and commenced operations. This has significantly increased manufacturing capacity and accelerated the active mass production of new products.」
The new facilities have been completed and commenced operations, advancing the expansion of manufacturing capacity and the acceleration of new-product mass production. - FY2018AdvancedAnnual report
「In addition, for these manufacturing technologies, we are continuously enhancing our high-level manufacturing process quality-control systems to address the rapid reduction in semiconductor line widths, while beginning construction of new facilities equipped with state-of-the-art machinery. This will significantly increase manufacturing capacity and accelerate the active mass production of new products.」
The development and mass production of single-digit-nanometer products are being advanced through the expansion of research facilities at the Kyoto Plant and Tokyo Research Institute, the addition of researchers, and the introduction of state-of-the-art analytical equipment. - FY2016First statedAnnual report
「In the field of ultra-high-purity colloidal silica products for silicon wafer polishing and semiconductor CMP polishing slurries, the company is further advancing technologies that enable flexible control of particle size, shape, concentration, surface condition, hardness and particle-size distribution, developing new products that meet customer needs and steadily increasing its market share.」
Combines particle-property control technology, quality control, and applied development centered at the Tokyo Research Institute.