Risk that semiconductor manufacturing methods may be established to replace TAB and COF tape
First written in FY2016. 5 of 6 entries say "Restated". Latest entry: FY2025.
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- FY2025RestatedAnnual report
「If technological innovation or other developments result in the establishment of manufacturing methods for semiconductor components that do not use these tapes, this could affect our financial condition and operating results.」
The risk that semiconductor manufacturing methods replacing TAB and COF tape may be established continues to be disclosed. - FY2024RestatedAnnual report
「If technological innovation or other developments result in the establishment of manufacturing methods for semiconductor components that do not use these tapes, this could affect our financial condition and operating results.」
The risk that semiconductor manufacturing methods replacing TAB and COF tape may be established continues to be disclosed. - FY2022RestatedAnnual report
「If technological innovation or other developments result in the establishment of manufacturing methods for semiconductor components that do not use these tapes, this could affect our financial condition and operating results.」
The risk that semiconductor manufacturing methods replacing TAB and COF tape may be established continues to be disclosed. - FY2018RestatedAnnual report
「If technological innovation or other developments result in the establishment of manufacturing methods for semiconductor components that do not use these tapes, this could affect our financial condition and operating results.」
The risk that semiconductor manufacturing methods replacing TAB and COF tape may be established continues to be disclosed. - FY2017RestatedAnnual report
「If technological innovation or other developments result in the establishment of manufacturing methods for semiconductor components that do not use these tapes, this could affect our financial condition and operating results.」
The risk that semiconductor manufacturing methods replacing TAB and COF tape may be established continues to be disclosed. - FY2016First statedAnnual report
「If technological innovation or other developments result in the establishment of manufacturing methods for semiconductor components that do not use these tapes, this could affect our financial condition and operating results.」
The possibility that TAB and COF tape could be replaced due to changes in semiconductor component manufacturing methods was identified as a risk.