Agreements reached under this partnership
Establishment of a joint venture- 1
Development, evaluation and optimization of integrated solutions combining our materials technologies with AIメカテック's equipment technologies
- 2
Development of integration technologies for three-dimensional packaging and provision of field engineering services
- 3
Enhancement of our ability to respond to customer requirements
- 4
Acceleration of the development of technologies for next-generation advanced semiconductor packaging, including panel-level packaging (PLP)
These are items that the documents state the two companies will work on. The lines above and below represent arrangements between the two companies.
This indicates whether the companies will do more than work together, such as holding each other’s shares or seconding personnel (capital and business alliance).
The impact of establishing this joint venture on our consolidated results for the fiscal year ending December 2026 is currently expected to be minor. We will promptly disclose any future impact on our results.
| Item | Details |
|---|---|
| Name of alliance partner | AIメカテック株式会社 |
| Alliance partner's business activities | Design, manufacture, sale and servicing of semiconductor- and display-related equipment and other products |
| Alliance partner's location | Ryugasaki City, Ibaraki Prefecture |
| Alliance partner's capital | ¥1,620.723 million |
| Alliance partner's net sales | ¥35,244 million (fiscal year ending June 2026) |
| Alliance partner's operating income | ¥5,810 million (fiscal year ending June 2026) |
| Type of alliance | Establishment of a joint venture |
| Details of the alliance | Development, evaluation and optimization of integrated solutions combining our materials technologies with AIメカテック's equipment technologies, Development of integration technologies for three-dimensional packaging and provision of field engineering services, Enhancement of our ability to respond to customer requirements, Acceleration of the development of technologies for next-generation advanced semiconductor packaging, including panel-level packaging (PLP) |
| Overview of the joint venture | Name Zero Newton Solutions 株式会社 / Location 5-2 Koyodai, Ryugasaki, Ibaraki Prefecture (the location of AIメカテック's head office) / Business Description Research, development, technical support, evaluation and analysis of semiconductor manufacturing and packaging processes; contract testing; and field engineering services / Capital Contributions Capital: ¥15 million; capital reserve: ¥15 million / Ownership ratio TOKYO OHKA KOGYO CO.,LTD. 51%; AIメカテック株式会社 49% |
| Ownership ratio | TOKYO OHKA KOGYO CO.,LTD. 51%; AIメカテック株式会社 49% |
| Date of board resolution | 9 October 2026 |
| Contract Date | 23 October 2026 |
| Alliance start date | 31 October 2026 (予定) |
| Impact on Business Performance | The impact of establishing this joint venture on our consolidated results for the fiscal year ending December 2026 is currently expected to be minor. We will promptly disclose any future impact on our results. |
Items this document does not state (9)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To anticipate advances in three-dimensional packaging technologies in the advanced semiconductor packaging market and accelerate the development, evaluation and optimization of integrated solutions combining materials, equipment and processes by combining the materials technologies of TOKYO OHKA KOGYO CO.,LTD. with the equipment technologies of AIメカテック.