Announced details
Advanced semiconductor packaging processes, including patterning, bonding, molding and plating, as well as growth fields such as generative AI and autonomous driving
12 participating companies (as of 20 April 2026)
A participating company in US-JOINT. Conducts research and development in materials, evaluation and assembly technologies through the consortium.
11 Japanese and US materials and equipment manufacturers. Individual locations, representatives, paid-in capital, years of establishment and business descriptions are not provided.
Union City, California, US
The consortium aims to bring new technologies into commercial use and business at an early stage, but no specific impact on sales or profit is provided.
The company does not address Contract Value / Offering price.
| Item | Details |
|---|---|
| Names of Products / Services Covered | US-JOINT, Products including high-performance, high-purity photoresists |
| Counterparty | Azimuth Industrial, KLA Corporation, Kulicke and Soffa Industries, MEC COMPANY LTD., Moses Lake Industries, ナミックス株式会社, TOPPAN Inc., TOWA株式会社, ULVAC, Inc., 3M Company, Resonac Corporation |
| Counterparty overview | 11 Japanese and US materials and equipment manufacturers. Individual locations, representatives, paid-in capital, years of establishment and business descriptions are not provided. |
| Relationship with the Company | A participating company in US-JOINT. Conducts research and development in materials, evaluation and assembly technologies through the consortium. |
| Launch date | April 2026 (full-scale operations; already commenced) |
| Applicable area | Advanced semiconductor packaging processes, including patterning, bonding, molding and plating, as well as growth fields such as generative AI and autonomous driving |
| Location | Union City, California, US |
| Location scale | Cleanrooms (Class 100 and Class 1,000) |
| Usage history | 12 participating companies (as of 20 April 2026) |
| Impact on Business Performance | The consortium aims to bring new technologies into commercial use and business at an early stage, but no specific impact on sales or profit is provided. |
Items this document does not state (8)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.Because opportunities to rapidly and practically validate new packaging concepts are limited. The consortium aims to identify market needs, combine the materials and equipment technologies of Japanese and US companies with US semiconductor users and ideas, accelerate research and development, and bring new technologies into commercial use and business at an early stage.