Slowing PC and Smartphone Markets and the Impact of FOWLP on Electronic Business Sales
First written in FY2016. 9 of 33 entries say "Mitigated", first in FY2018-Q1. Latest entry: 2026-08-04.
Ibiden moved to the "Worse" side of this theme in 2026, 4 years after the typical company in this theme (2022).
The whole theme swung hardest in 2023: 43 of 66 companies on the "Worse" side.
5 other companies' latest entry also says "Other".
- FY2026-H1PC and general-purpose server recovery remains slowAnnual report
「The PC market continued a gradual recovery overall, although it lacked strength. In the server market, growth areas, particularly those related to generative AI, remained firm, but recovery in the general-purpose data center server market remained slow.」
Although the PC market shifted from its previous weak recovery to a gradual recovery trend, generative AI-related areas remained firm, while recovery in the general-purpose data center server market was described as slow. - FY2025Weak PC recovery; competition in existing server market continuesAnnual report
「In the PC market, inventory adjustments mainly resulting from the reversal of the surge in demand generated by the spread of COVID-19 had run their course, but the market overall remained lacking in strength during its recovery, and price competition among suppliers intensified. In the server market, growth areas, particularly those related to generative AI, performed well, while the existing data center server market remained difficult overall. Although investment by major users appeared to have bottomed out, changes in the competitive environment among semiconductor manufacturers continued.」
Although inventory adjustments in the PC market had run their course, the recovery lacked strength, while changes in the competitive environment continued in the existing data center server market. Generative AI-related areas, meanwhile, were described as performing well. - FY2025-H1Slow PC recovery; competition in existing server market continuesAnnual report
「In the PC market, inventory adjustments following the sharp slowdown in demand from the second half of fiscal 2022 had run their course, but demand recovery was progressing more slowly than expected, and the market overall remained lacking in strength. In the server market, new growth areas, particularly those related to generative AI, performed well. However, although investment by major users in the existing data center server market appeared to have bottomed out, changes in the competitive environment among semiconductor manufacturers continued.」
Although inventory adjustments in the PC market had run their course, demand recovery was described as slower than expected. Generative AI-related areas were performing well, but changes in the competitive environment continued in the existing data center server market. - FY2024RestatedAnnual report
「In the PC market, inventory adjustments following the sharp slowdown in demand from the second half of fiscal 2022 had run their course, but the recovery was progressing more slowly than expected, and uncertainty continued. In the server market, new growth areas, particularly those related to generative AI, performed well, but the existing data center server market remained difficult overall as major users continued to restrain investment and conduct inventory adjustments.」
Although inventory adjustments in the PC market had run their course, the recovery remained slow, while investment restraint and inventory adjustments in the existing server market continued. Generative AI-related areas were described as performing well as a growth area. - FY2024-Q3PC inventory adjustments nearing completion; difficult server market conditions continueAnnual report
「In the PC market, inventory adjustments following the sharp slowdown in demand from the second half of the previous fiscal year had run their course, but the recovery was progressing more slowly than expected, and uncertainty continued. In the server market, new growth areas, particularly those related to generative AI, performed well, but the existing data center server market remained difficult overall as major users continued to restrain investment and conduct inventory adjustments.」
Although inventory adjustments in the PC market had run their course, the recovery was described as slower than expected. In the server market, generative AI-related areas performed well, but investment restraint and inventory adjustments continued in the existing data center market, leaving the overall market in difficult conditions. - FY2024-Q2WorsenedAnnual report
「In the PC market, inventory adjustments following the sharp slowdown in demand from the second half of the previous fiscal year continued. In the server market, new growth areas, particularly those related to generative AI, performed well, but the existing data center server market remained difficult overall as major users continued to restrain investment.」
Although new growth areas related to generative AI were performing well, the market overall was described as being in difficult conditions due to the sharp slowdown in PC demand and inventory adjustments, as well as continued investment restraint in the existing data center server market. - FY2024-Q1WorsenedAnnual report
「The semiconductor and electronic components market faced difficult conditions overall, as inventory adjustments following the sharp slowdown in PC demand from the second half of the previous fiscal year continued, while the data center server market also remained sluggish.」
In addition to the slowdown in traditional PC demand, the server market, including data center servers, also weakened, and the overall electronic components market was described as being in difficult conditions. The Electronics segment reported a 17.3% decline in revenue and a 70.7% decline in operating profit. - FY2023-Q3WorsenedAnnual report
「In the PC market, temporary demand increases related to teleworking, online education and OS upgrades had run their course, and the market entered an adjustment phase from the summer onward. However, the server market, particularly for data centers, generally remained firm, and the semiconductor and electronic components market continued to grow overall.」
The company stated that, in addition to the end of the temporary increase in PC demand, the market entered an adjustment phase from the summer onward, indicating a shift from the previous end of temporary demand to an adjustment phase. Meanwhile, the server market continued to support the overall market. - FY2023-Q2The end of temporary PC demandAnnual report
「In the PC market, temporary demand increases related to teleworking, online education and OS upgrades had run their course, but the server market, particularly for data centers, remained firm, and the semiconductor and electronic components market continued to grow overall.」
Although the temporary increase in PC demand from teleworking and other factors had run its course, the overall electronic components market was described as continuing to grow, supported by the resilience of the server market. - FY2022-Q3RestatedAnnual report
「The semiconductor and electronic components market continued to grow overall, as the PC market remained firm with the entrenchment of teleworking and remote education, while the server market, particularly for data centers, performed well.」
Although the risk of a slowdown in traditional markets such as smartphones remained, the resilience of the PC and server markets led to a reaffirmation that the overall electronic components market was continuing to grow. - FY2022-Q2RestatedAnnual report
「The semiconductor and electronic components market continued to grow overall, as the PC market remained firm with the entrenchment of teleworking and remote education, while the server market, particularly for data centers, continued to perform well.」
Although the risk of a slowdown in the traditional PC and smartphone markets remained, the overall electronic components market was described as continuing to grow, supported by PC demand from teleworking and remote education and the strong performance of the server market. - FY2022-Q1MitigatedAnnual report
「The semiconductor and electronic components market continued to grow overall, as the PC market remained strong with the entrenchment of teleworking and remote education, while the server market, particularly for data centers, continued to perform well.」
Against the risk of a slowdown in the traditional PC and smartphone markets, the overall electronic components market was described as continuing to grow, supported by the resilience of the PC and server markets. - FY2021MitigatedAnnual report
「Revenue in the Electronics segment was ¥166.07 billion, up 25.6% from the previous consolidated fiscal year. Operating profit was ¥27.809 billion, up 86.7%.」
Although the risk of a slowdown in the PC and smartphone markets remained, the Electronics segment reported higher revenue and a substantial increase in operating profit, driven by data center demand and the expansion of its package substrate business. - FY2021-Q3MitigatedAnnual report
「The semiconductor and electronic components market continued to grow overall, as the PC market remained strong with the expanding adoption of teleworking and remote education, while markets centered on data center servers generally remained firm.」
Against the risk of a slowdown in the traditional PC and smartphone markets, the overall electronic components market was described as continuing to grow, supported by PC demand from teleworking and remote education and the resilience of the server market. - FY2021-Q2MitigatedAnnual report
「The semiconductor and electronic components market continued to grow overall. Although the smartphone market contracted year on year, the PC market remained strong with the rapid global adoption of teleworking, while markets centered on data center servers also generally remained firm.」
Although negative growth in the smartphone market continued, the overall electronic components market was described as continuing to grow, supported by PC demand from teleworking and the resilience of the server market. - FY2021-Q1RestatedAnnual report
「The semiconductor and electronic components market continued to grow overall, despite year-on-year negative growth in the PC and smartphone markets, as new markets, particularly the data center server market, generally remained firm.」
Although negative growth in the PC and smartphone markets continued, the overall electronic components market was described as continuing to grow, supported by the resilience of new markets such as the data center server market. - FY2020MitigatedAnnual report
「Although the smartphone market contracted year on year, the overall semiconductor and electronic components market continued to grow, supported by sustained replacement demand in the PC market and generally solid performance in new markets, particularly the market for servers used in data centers. Electronics sales were ¥132,170 million, up 14.0% from the previous consolidated fiscal year.」
Although negative growth in the smartphone market continued, the Electronics segment reported higher revenue, supported by replacement demand for PCs and the resilience of the data center server market, which relatively mitigated the impact of the risk of a market slowdown. - FY2020-Q2MitigatedAnnual report
「Although the smartphone market continued to contract year on year, the overall semiconductor and electronic components market continued to grow, supported by signs that the PC market had bottomed out and generally solid performance in new markets, particularly the market for servers used in data centers.」
Although the smartphone market continued to contract, the overall electronic components market was described as trending upward, supported by the PC market bottoming out and solid performance in new markets such as servers. - FY2020-Q1RestatedAnnual report
「Although the PC and smartphone markets in the semiconductor and electronic components industry contracted year on year, the overall market continued to grow, supported by growth in new markets, particularly the market for servers used in data centers.」
The PC and smartphone markets continued to contract, while the market environment included growth in new markets such as servers for data centers. - FY2019RestatedAnnual report
「Sales in the small, thin substrates (CSP) business for smartphones and tablets declined from the previous consolidated fiscal year as the impact of the launch of fan-out wafer-level packaging (FO-WLP) continued.」
The impact of the FO-WLP launch on the CSP business and the resulting sales decline continued on a full-year basis as well. - FY2019-Q3RestatedAnnual report
「Sales in the small, thin substrates (CSP) business for smartphones and tablets declined from the same period of the previous year as the impact of the launch of fan-out wafer-level packaging (FO-WLP) continued.」
The decline in CSP business sales resulting from the FO-WLP launch continued. - FY2019-Q2RestatedAnnual report
「Sales in the small, thin substrates (CSP) business for smartphones and tablets declined from the same period of the previous year as the impact of the launch of fan-out wafer-level packaging (FO-WLP) continued.」
The report continues to state that the FO-WLP launch has reduced sales in the CSP business. - FY2019-Q1RestatedAnnual report
「Sales in the small, thin substrates (CSP) business for smartphones and tablets declined from the same period of the previous year as the impact of the launch of fan-out wafer-level packaging (FO-WLP) continued.」
The impact of the FO-WLP launch on the CSP business and the resulting sales decline continued. Meanwhile, overall Electronics sales increased, driven by the development of new fields and new customers. - FY2018-Q3MitigatedAnnual report
「Sales in the small, thin substrates (CSP) business for smartphones and tablets remained at about the previous year’s level, as the impact of the launch of fan-out wafer-level packaging (FO-WLP) continued.」
Although the impact of FO-WLP and the PC and smartphone markets remaining below the previous year’s levels continued, Electronics sales increased 13.3% year on year, and operating results also turned from a loss in the same period of the previous year to a profit. - FY2018-Q2MitigatedAnnual report
「Sales in the small, thin substrates (CSP) business for smartphones and tablets remained at about the previous year’s level, as the impact of the launch of fan-out wafer-level packaging (FO-WLP) continued. As a result, Electronics sales were ¥55,496 million, an increase from the same period of the previous year. Operating profit was ¥455 million, compared with an operating loss of ¥2,145 million in the same period of the previous year, partly reflecting the effects of the business restructuring carried out last fiscal year.」
Although the impact of FO-WLP continued, Electronics sales increased year on year, and operating results turned from a loss in the same period of the previous year to a profit. - FY2018-Q1MitigatedAnnual report
「Although there were signs of a recovery in the PC market, the slowdown in smartphone and tablet market growth and some inventory adjustments resulted in Electronics sales of ¥25,982 million, broadly unchanged from the same period of the previous year. The business posted operating profit of ¥93 million, compared with an operating loss of ¥1,001 million in the same period of the previous year.」
The slowdown in smartphone and tablet market growth and inventory adjustments continued, but Electronics sales remained at about the same level as the same period of the previous year, and operating results improved from a loss to a profit. - FY2017MaterialisedAnnual report
「Orders remained weak due to the continued weakness in the PC and tablet markets, intensifying competition as smartphone market growth slowed, and the new adoption of fan-out wafer-level packaging (FO-WLP) in some high-end products. As a result, Electronics sales were ¥99,224 million, down 32.9% from the previous consolidated fiscal year. The business posted an operating loss of ¥3,649 million, compared with operating profit of ¥11,471 million in the previous consolidated fiscal year.」
Market weakness, intensifying competition and the adoption of FO-WLP resulted in lower Electronics sales and an operating loss for the full year. - FY2017-Q3MaterialisedAnnual report
「In addition to the continued weakness in the PC market, intensifying competition as smartphone and tablet market growth slowed, and the adoption of fan-out wafer-level packaging (FO-WLP) in some high-end products resulted in Electronics sales of ¥74,215 million, down 37.4% from the same period of the previous year. The business posted an operating loss of ¥3,086 million, compared with operating profit of ¥11,501 million in the same period of the previous year.」
The weakness in the PC and smartphone markets, intensifying competition and the adoption of FO-WLP continued to appear in results as a 37.4% decline in Electronics sales and an operating loss. - FY2017-Q2MaterialisedAnnual report
「In the semiconductor and electronic components markets, continued weakness in the PC market, slowing growth in the smartphone and tablet markets, intensifying competition and the launch of fan-out wafer-level packaging (FO-WLP) led to lower CSP sales. Sales in the Electronics business were ¥50,800 million, down 33.9% from the same period of the previous year. The business posted an operating loss of ¥2,145 million, compared with operating profit of ¥6,967 million in the same period of the previous year.」
The slowdown in the PC and smartphone markets, intensifying competition and the launch of FO-WLP led to lower Electronics sales and an operating loss. - FY2017-Q1MaterialisedAnnual report
「In addition to the continued weakness in the PC market and continued slowing growth in the smartphone and tablet markets, sales in the Electronics business were ¥26,011 million, down 22.6% from the same period of the previous year. The business posted an operating loss of ¥1,001 million, compared with operating profit of ¥1,222 million in the same period of the previous year.」
The slowdown in the PC, smartphone and tablet markets resulted in lower Electronics sales and an operating loss for the quarter. FOWLP is not mentioned in this quarterly report. - FY2016First statedAnnual report
「In addition, with the launch of fan-out wafer-level packaging (FOWLP), which is expected to replace our package substrates (CSP) for smartphones and tablets, sales in our Electronics business are expected to decline by approximately 20% from the previous fiscal year in fiscal 2016.」
Against a backdrop of slower market growth and the launch of alternative technology, the company expects Electronics sales to decline by approximately 20% in the following fiscal year.