Komori
M&A and Subsidiary Changes4062IBIDEN CO.,LTD.Electrical Equipment and Precision Instruments

Notice Regarding Capital Investment (Acquisition of Fixed Assets) for High-Performance IC Package Substrates

Approximately ¥151 billion will be invested in the Kawama facility in Gifu Prefecture and overseas plants to increase production capacity for high-performance IC package substrates, primarily for AI servers. The facilities are planned to come online sequentially from fiscal 2029.

Worth reading
24Immaterial
0–100. This measures how worthwhile something is to read, not how good or bad the company is.
Direction
Improvement
Direction inferred from the company’s description.
Scale
1510
¥100 million (planned)
Wording
Conditional
How definitive the wording is.

This transaction

Capital Investment (Acquisition of Fixed Assets) for High-Performance IC Package Substrates
Date of board resolution29 October 2026
Execution Date / Effective DateThe facilities are planned to come online sequentially from fiscal 2029, with mass production scheduled to begin.
Consideration and expenses
Acquisition priceApproximately ¥151 billion (planned)
Impact on Business Performance

The impact of this investment on consolidated results for the current fiscal year will be minor.

This transaction
ItemDetails
Transaction nameCapital Investment (Acquisition of Fixed Assets) for High-Performance IC Package Substrates
Acquisition priceApproximately ¥151 billion (planned)
Impact on Business PerformanceThe impact of this investment on consolidated results for the current fiscal year will be minor.
Date of board resolution29 October 2026
Execution Date / Effective DateThe facilities are planned to come online sequentially from fiscal 2029, with mass production scheduled to begin.
Items this document does not state (27)
Counterparty nameName of the Subject CompanyBusiness Description of the Subject CompanyLocation of the Subject CompanyCapital Stock of the Subject CompanyDate of Establishment of the Subject CompanyNet Sales of the Subject CompanyOperating Profit of the Subject CompanyNet Income of the Subject CompanyNet Assets of the Subject CompanyExpenses other than the acquisition priceType of ConsiderationMerger ratio/share exchange ratioTender offer priceMinimum number of shares to be purchasedTender offer periodNumber of shares acquiredVoting rights ownership percentageFunding arrangementsGoodwill amountAmount of extraordinary income (loss)Contract DateValuation methodologyIndependent valuation institutionSpecial CommitteeConditions Precedent to ExecutionManagement structure after acquisition

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

Production capacity will be expanded in anticipation of increased demand for high-performance IC package substrates for CPUs as AI evolves from training-based AI to inference-based AI and then to agentic AI.

How to read this page

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Corrections happenIf the company reissues this disclosure, the page is rebuilt from the corrected version and the revision number moves up.
Notice Regarding Capital Investment (Acquisition of Fixed Assets) for High-Performance IC Package Substrates | IBIDEN CO.,LTD. (4062) timely disclosure | Komori