Contents of this document
- Reclaimed wafer unit prices: up several percent quarter on quarter in the third quarter. Specific outlook for price revisions not disclosed
- Decline in the reclaimed wafer operating margin: mainly due to higher depreciation expenses
- Slower reclaimed wafer revenue growth: affected by temporary demand for wafers sold in the previous year and the product mix
- Capital investment: the planned increase of 30,000 wafers in monthly production at the Tainan plant has been completed, while the Sanbonki No. 7 Plant is scheduled to reach a monthly production capacity of 40,000 wafers by year-end
- Silicon components: sales volume increased by more than 100% year on year and by more than 20% quarter on quarter
- 8-inch wafers: average selling prices improved slightly, with efforts focused on higher-value-added products
- Shift in demand toward SiC and GaN: explained that while there is long-term potential, silicon demand is expected to remain solid over the medium term
- GRITEK reorganization: aimed at integrated operations spanning 5-, 6-, 8- and 12-inch wafers and improved management efficiency
- Maintaining GRITEK within the consolidated group: emphasis on group synergies and future growth opportunities
- Enterprise value of Shandong GRITEK and SGRS: currently under review; reorganization expected to be completed during 2027
- SGRS: operating profit of approximately ¥4.7 billion and a net loss of approximately ¥3.9 billion. Break-even is assumed to be reached at monthly production of approximately 300,000 wafers
- Dissolution of RSPDH and cancellation of entry into the automotive camera module business: no impact on the current fiscal year, with a potential impact from the next fiscal year onward
- Decline in the wafer reclamation business's operating marginFactorsIncrease in depreciation expenses associated with capital investment to increase production
- Slowdown in revenue growth for the wafer reclamation businessFactorsTemporary increase in demand for wafers sold in the same period of the previous year; impact of the product mix
The company identifies the factors but does not state the amount attributable to each one.
- AssumptionIncreased production at the Tainan plantFigureThe planned increase of 30,000 wafers in monthly production for the current fiscal year has been completed
- AssumptionSanbonki No. 7 PlantFigureScheduled to reach a monthly production capacity of 40,000 wafers by year-end
- AssumptionSGRS's break-even pointFigureAssumed to be approximately 300,000 wafers per month, around 2029
- Gradual improvement in reclaimed wafer unit prices
- Expansion of orders for advanced products with higher unit prices
- Capital investment to increase production at the Tainan plant and Sanbonki No. 7 Plant
- Strengthening production of higher-value-added wafers, including Epi, FZ and MCZ
- Reorganization of GRITEK and integrated deployment of management resources
- Dissolution of RSPDH and cancellation of entry into the automotive camera module business
- Reclaimed wafer unit priceUp several percent quarter on quarter
- Silicon component sales volumeUp more than 100% year on yearYear on year against the same period last yearUp more than 100% year on year
- Silicon component sales volumeUp more than 20% quarter on quarter
- Average selling price of 8-inch wafersSlight improvementYear on year against the same period last yearImproved from the sharp decline in the previous year
- Reclaimed wafer unit priceUp several percent quarter on quarter
- Silicon component sales volumeUp more than 100% year on year and more than 20% quarter on quarter
- Average selling price of 8-inch wafersSlight improvement
- Share of total wafer shipments by sales waferYear-on-year decline
- Wafer reclamation businessNet SalesUp 7.1% year on yearProfitOperating margin down 1.3 ppt year on year
- 200mm Prime Wafer BusinessNet SalesSilicon component sales volume increased by more than 100% year on year and by more than 20% quarter on quarter
- Semiconductor manufacturing equipment and components businessNet SalesOutlook for annual revenue above ¥10 billion
| Item | Details |
|---|---|
| Document type | Summary of Q&A |
| Fiscal Period Covered | Q3 FY2026 |
| Operating profit margin | Wafer reclamation business: down 1.3 ppt year on year |
| Full-year earnings forecast | Wafer reclamation business: revenue and operating profit are expected to increase year on year. Semiconductor manufacturing equipment and components business: outlook for annual revenue above ¥10 billion maintained |
| Segment results | Segment Wafer reclamation business / Net Sales Up 7.1% year on year / Profit Operating margin down 1.3 ppt year on year, Segment 200mm Prime Wafer Business / Net Sales Silicon component sales volume increased by more than 100% year on year and by more than 20% quarter on quarter / Profit Not disclosed, Segment Semiconductor manufacturing equipment and components business / Net Sales Outlook for annual revenue above ¥10 billion / Profit Not disclosed |
| Breakdown of Factors Affecting the Change | Subject Decline in the wafer reclamation business's operating margin / Factors Increase in depreciation expenses associated with capital investment to increase production / Amount Not disclosed, Subject Slowdown in revenue growth for the wafer reclamation business / Factors Temporary increase in demand for wafers sold in the same period of the previous year; impact of the product mix / Amount Not disclosed |
| Key KPIs | Indicator Reclaimed wafer unit price / Value Up several percent quarter on quarter / Year on year against the same period last year Not disclosed, Indicator Silicon component sales volume / Value Up more than 100% year on year / Year on year against the same period last year Up more than 100% year on year, Indicator Silicon component sales volume / Value Up more than 20% quarter on quarter / Year on year against the same period last year Not disclosed, Indicator Average selling price of 8-inch wafers / Value Slight improvement / Year on year against the same period last year Improved from the sharp decline in the previous year |
| Unit price and quantity metrics | Indicator Reclaimed wafer unit price / Value Up several percent quarter on quarter, Indicator Silicon component sales volume / Value Up more than 100% year on year and more than 20% quarter on quarter, Indicator Average selling price of 8-inch wafers / Value Slight improvement, Indicator Share of total wafer shipments by sales wafer / Value Year-on-year decline |
| Assumptions Underlying the Business Outlook | Assumption Increased production at the Tainan plant / Figure The planned increase of 30,000 wafers in monthly production for the current fiscal year has been completed, Assumption Sanbonki No. 7 Plant / Figure Scheduled to reach a monthly production capacity of 40,000 wafers by year-end, Assumption SGRS's break-even point / Figure Assumed to be approximately 300,000 wafers per month, around 2029 |
| Medium-term management plan targets | Outlook for annual revenue above ¥10 billion maintained. Plans from 2027 onward are scheduled to be explained again in February 2027 |
| Key points of the Q&A | Reclaimed wafer unit prices: up several percent quarter on quarter in the third quarter. Specific outlook for price revisions not disclosed, Decline in the reclaimed wafer operating margin: mainly due to higher depreciation expenses, Slower reclaimed wafer revenue growth: affected by temporary demand for wafers sold in the previous year and the product mix, Capital investment: the planned increase of 30,000 wafers in monthly production at the Tainan plant has been completed, while the Sanbonki No. 7 Plant is scheduled to reach a monthly production capacity of 40,000 wafers by year-end, Silicon components: sales volume increased by more than 100% year on year and by more than 20% quarter on quarter, 8-inch wafers: average selling prices improved slightly, with efforts focused on higher-value-added products, Shift in demand toward SiC and GaN: explained that while there is long-term potential, silicon demand is expected to remain solid over the medium term, GRITEK reorganization: aimed at integrated operations spanning 5-, 6-, 8- and 12-inch wafers and improved management efficiency, Maintaining GRITEK within the consolidated group: emphasis on group synergies and future growth opportunities, Enterprise value of Shandong GRITEK and SGRS: currently under review; reorganization expected to be completed during 2027, SGRS: operating profit of approximately ¥4.7 billion and a net loss of approximately ¥3.9 billion. Break-even is assumed to be reached at monthly production of approximately 300,000 wafers, Dissolution of RSPDH and cancellation of entry into the automotive camera module business: no impact on the current fiscal year, with a potential impact from the next fiscal year onward |
| New initiatives | Gradual improvement in reclaimed wafer unit prices, Expansion of orders for advanced products with higher unit prices, Capital investment to increase production at the Tainan plant and Sanbonki No. 7 Plant, Strengthening production of higher-value-added wafers, including Epi, FZ and MCZ, Reorganization of GRITEK and integrated deployment of management resources, Dissolution of RSPDH and cancellation of entry into the automotive camera module business |
Items this document does not state (19)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The decline in the wafer reclamation business's operating margin was mainly due to higher depreciation expenses associated with capital investment to increase production. The slowdown in revenue growth was due to a temporary increase in demand for wafers sold in the same period of the previous year and changes in the product mix during the current period. The increase in reclaimed wafer unit prices and silicon component sales volumes was explained by the demand environment and growth in sales to South Korea.